Dram Design Development Quality Engineer Jobs

Principal Engineer/MTS, DRAM PI — Hiroshima - Fab 15, Japan. Apply via Workday.

Senior Engineer, DRAM PI — Hiroshima - Fab 15, Japan. Apply via Workday.

Staff Engineer, Adv DRAM PI — Boise, ID - Main Site. Apply via Workday.

Sr Engineer, Photo DRAM — Boise, ID - Main Site. Apply via Workday.

STAFF ENGINEER, DRY ETCH DRAM — Boise, ID - Main Site. Apply via Workday.

Senior Engineer, DRAM PI — Hiroshima - Fab 15, Japan. Apply via Workday.

Technician / Engineer, E-characterization DRAM — Hiroshima - Fab 15, Japan. Apply via Workday.

Sr Process Integration Engineer, DRAM — Boise, ID - Main Site. Apply via Workday.

Senior Engineer, DRAM PATHFINDING PI — Hiroshima - Fab 15, Japan. Apply via Workday.

DMTS, DRAM Systems — 2 Locations. Apply via Workday.

R&D Thin Films Process Development Engineer Advanced DRAM — Boise, ID - Main Site. Apply via Workday.

Sr. Process Integration Engineer - DRAM — Boise, ID - Main Site. Apply via Workday.

Intern - Process Pathfinding, DRAM Dry Etch — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Strategy & Innovation Define and execute the technical roadmap for Advanced DRAM Films development. Provide technical leadership across Epi, device films, hardmask technologies, HAR deposition, and diffusion processes. Drive innovative process solutions that enable future technology nodes while meeting manufacturability, yield, reliability, and cost objectives. Partner with Process Integration and cross-functional teams to resolve critical technology challenges. Leverage Artificial Intelligence to enhance problem solving across technical and logistical spaces. Organizational Leadership & Team Development Lead, coach, and develop a growing organization of engineers, technical leads, and future managers. Foster a culture of technical excellence, innovation, accountability, collaboration, and ownership. Develop talent through mentoring, succession planning, talent management, and strategic hiring. Create an environment that accelerates learning, encourages technical curiosity, and enables career growth for engineers at all levels. Drive high levels of team member engagement by cultivating an inclusive, supportive, and high-performing culture where employees feel valued, empowered, and connected to Micron's mission and business objectives. Champion employee development, recognition, feedback, and wellbeing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Overlay Strategy, Roadmap & Technical Leadership Own the overlay roadmap including bond overlay technologies. Serve as the technical authority for overlay, defining overlay specifications, error budgets, mark strategies, technical signoff criteria, and scaling requirements for future technology nodes. Develop innovative overlay solutions that enable advanced bonding while meeting performance, yield, manufacturability, and scaling objectives. Drive advancement of overlay metrology, automation, process control, modeling, and analytics capabilities in partnership with Process and Metrology teams. Apply advanced analytics, Artificial Intelligence, simulation, and experimental methodologies to accelerate learning, identify root causes, and improve overlay performance. Technology Development & Problem Solving Lead simulation and experimental process development activities, balancing modeling with hands-on characterization and technology development. Develop and maintain overlay error budgets, validation plans, experiments, and technical assessments that connect process behavior to device and integration requirements. Solve complex overlay challenges involving alignment, distortion, deformation, process interactions, and bonded wafers. Translate technical findings into actionable process improvements, technology decisions, and roadmap recommendations. <