Dram Design Technology Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容（Job Description） Micronのテクノロジー開発（Technology Development）グループに所属する DRAMプロセスインテグレーション・パスファインディングエンジニアとして、次世代DRAMテクノロジーノードに向けたモジュール開発を主導していただきます。 モジュールオーナーとして、1つまたは複数のモジュールに対する構造的および電気的要件を定義し、ユニットプロセス部門や支援チーム、ならびに他のモジュールオーナーと連携しながら、モジュールをプロセス全体に統合します。 また、多分野のエンジニアからなるチームと協働し、新しいアーキテクチャ、デバイス、技術、材料を評価することで、今後5年以上を見据えた技術開発の方向性を検証します。 主な業務内容（Responsibilities） 電気特性、インライン指標、ユニットプロセス、デザインルールに基づき、構造仕様を策定する 構造‐電気特性の相関に基づき、エンジニアリング仕様を満たすための実験を設計・実行・解析する モデルベースのアプローチで問題解決を行い、プロセス改善、特許、技術論文を通じて技術革新を推進する 1つまたは複数のプロセスモジュールについて、デザインルール、構造仕様、電気仕様を含めて開発・維持・改善する（代替フロー含む） 既存プロセスフローを最適化し、製品要件を満たす創造的な解決策を開発する JMPなどの統計解析ソフトウェアを用いて、実験の設計・実行および結果解析を行う 結果を製品側へフィードバックし、歩留まり改善に貢献する インラインデータ、欠陥データ、パラメータデータ、プローブデータを抽出・監視・解析し、 歩留まり問題の解決、性能・信頼性向上、プロセスマージン拡大、コスト削減を推進する 設計、製品技術、モデリング、歩留まり改善、電気・物理的故障解析、欠陥解析、パラメータ、品質チームと部門横断的に連携し、課題・目標・優先順位を理解する 複雑な問題を要約し、対応策を導出・説明し、チームの実行を牽引する 担当モジュール内におけるサブマイルストーンを定義する プロセスインテグレーション、プロセス開発、パイロットファブ間の円滑なコミュニケーションを維持・徹底する 製造移管に向けて、R&D活動の適時なドキュメンテーションを確実に行う 学歴・経験要件（Education and Experience） 修士号または博士号 （電気工学、マイクロエレクトロニクス、物理学、材料科学） または 学士号＋業界経験5年以上 必要スキル・知識 半導体デバイス物理および電気特性評価に関する知識 材料科学および半導体プロセス基礎に関する知識 JMP、Python、またはその他のデータ解析／データエンジニアリングソフトを用いたデータ解析スキル 英語による対人・口頭・文書コミュニケーション能力 歓迎要件（Preferred Experience） プロセスインテグレーション、またはそれと密接に関わる職務における業界経験5年以上 DRAM製

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 50,000 patents granted and still growing . As an Engineer, you will be a part of revolutionary next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As RAM (RDA and Metrology) Central Team Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers as well as process integration team, responsible for starting up, developing and optimizing detection to improve product yield, quality, and cost. This position will identify, diagnose and resolve detection gaps, as well as improving current detection. Responsibilities include working closely with the NAND and DRAM sites, HVM and TD, and even suppliers, to achieve Inline Visibility and Inline Control for Detection enablement and improvement. This position is responsible in setting up and aligning BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement. Responsibilities and Tasks: • Establish Detection to have 100% Inline Visibility and Inline control • Improve Detection strategy, system, and methods to continuously strengthen detection performance. • Enhance Detection capability and strategy to enable Yield improvement, improve Cycle of Learning and strengthen Defense Line. • Establish and improve BKM (Best Known Method) related to RAM Detection performance, RAM dete

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary: We are seeking a highly motivated Photo Engineer to join our Manufacturing Engineering (MFG-ME) team. This role is instrumental in driving business objectives related to capacity ramp-up and cost reduction for advanced DRAM semiconductor products. Key Responsibilities: Lead initiatives to improve productivity through process optimization on Track equipment and ensure stable equipment operation to support capacity expansion and cost efficiency. Collaborate with equipment vendors and suppliers of components and materials to develop and implement innovative technologies that address technical challenges. Facilitate cross-functional communication and drive improvement activities by working closely with managers, engineers, and technicians across various departments and operational areas. Contribute to company-wide technology deployment efforts by coordinating with both domestic and international fabrication sites. Preferred Qualifications: (Candidates are not required to meet all criteria) Proficiency in Microsoft Office applications (Outlook, Excel, PowerPoint, Word). Ability to communicate effectively in Japanese and English, including email correspondence and technical documenta

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact <a target="_blank" href="mailto:hrsupport_jp&#64;micron.c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The F15 ATE DIF Engineer is responsible for successful transfer achievement of new technode transferred from TD, Yield improvement/CT reduction/tool expansion toward TTMCY with great collaboration with TD/F15 all related Dept/DRAM network/MCT.Safety, Technology transfer to sister site & further new tech node transfer readiness are also our responsibility. As one of our team members, you should Understand site, department, area goals and set individual goals to achieve them with discussion with your SV. You are required to take a responsibility for process & workstation as owner and do all tasks assigned timely and accurately. You are also highly appreciated to work positively and show your ownership of all the tasks you are assigned. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-perfor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Photo Engineer to join our Manufacturing Engineering (MFG-ME) team. This role is instrumental in driving business objectives related to capacity ramp-up and cost reduction for advanced DRAM semiconductor products. Key Responsibilities: Lead initiatives to improve productivity through process optimization on Track equipment and ensure stable equipment operation to support capacity expansion and cost efficiency. Collaborate with equipment vendors and suppliers of components and materials to develop and implement innovative technologies that address technical challenges. Facilitate cross-functional communication and drive improvement activities by working closely with managers, engineers, and technicians across various departments and operational areas. Contribute to company-wide technology deployment efforts by coordinating with both domestic and international fabrication sites. Preferred Qualifications: (Candidates are not required to meet all criteria) Proficiency in Microsoft Office applications (Outlook, Excel, PowerPoint, Word). Ability to communicate effectively in Japanese and English, including email correspondence and technical documentation. Strong initiative and problem-solving skills, with a proactive approach to proposing improvement strategies. Capability to manage complex issues through close collaboration with stakeholders and appropriate escalation when necessary. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Utilize AI-enabled tools and data analytics solutions to improve engineering productivity, accelerate problem solving, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a PI Magin Bin and ESPEC manager, you will lead a team of highly skilled PI Margin Bin and ESPEC engineers with the goal of introducing new tech-node and optimizing DRAM process flow while ensuring stable fab output and maintaining product quality in OMT. You will interact with a wide variety of engineering and production teams within and outside OMT to achieve the company’s goals. Also, adopt AI agent tools to strengthen job function competitiveness continuously. Responsibilities and Tasks Lead and manage a team of engineers to successfully implement innovative solutions Coordinate the development and execution of technical projects and initiatives Ensure flawless execution of projects by strictly adhering to quality and performance standards Collaborate with cross-functional teams to determine project requirements and deliverables Provide mentorship and guidance to team members to foster growth and development Monitor and analyze project performance to identify areas for improvement and implement corrective actions Stay up-to-date with industry trends and advancements to maintain our competitive edge Develop and maintain relationships with key collaborators to support project goals Required skills and experience to succeed in this role, you will need as following, Proven experience in a managerial engineering role Strong leadership skills with the ability to encourage and motivate a team Outstanding

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a PI Margin Bin and ESPEC manager, you will lead a team of highly skilled PI Margin Bin and ESPEC engineers with the goal of introducing new tech-node and optimizing DRAM process flow while ensuring stable fab output and maintaining product quality in OMT. You will interact with a wide variety of engineering and production teams within and outside OMT to achieve the company’s goals. Alos, adopt AI agent tools to strengthen job function competitiveness continuously. Responsibilities and Tasks Lead and manage a team of engineers to successfully implement innovative solutions Coordinate the development and execution of technical projects and initiatives Ensure flawless execution of projects by strictly adhering to quality and performance standards Collaborate with cross-functional teams to determine project requirements and deliverables Provide mentorship and guidance to team members to foster growth and development Monitor and analyze project performance to identify areas for improvement and implement corrective actions Stay up-to-date with industry trends and advancements to maintain our competitive edge Develop and maintain relationships with key collaborators to support project goals Required skills and experience to succeed in this role, you will need as following, Proven experience in a managerial engineering role Strong leadership skills with the ability to encourage and motivate a team Outstanding

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer Job Description As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3 , Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to apply AI to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase f

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product & System Engineering Media Health team, you will work together with a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will work within the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics.