Dram Disability Jobs

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We’re looking for a Global Supply Chain Manager to lead strategic sourcing and supplier management for our memory and storage portfolio, including DRAM components and modules, and NAND-based storage products such as solid-state drives (SSDs). You will own commodity strategy, commercial negotiations, and supply assurance from new product introduction through volume production. Working closely with Hardware Engineering, Operations, Finance, and Procurement, you will align supplier technology roadmaps, capacity commitments, and cost targets with our product requirements and build plans. This role is hybrid, based in Toronto, ON, Austin, TX, or Santa Clara, CA. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced in strategic sourcing or commodity management for memory and storage, with knowledge of DRAM components and modules, including DDR memory, and NAND-based storage products including SSDs. You understand the supplier ecosystem, technology roadmaps, qualification requirements, and commercial dynamics of these commodities. Comfortable managing direct relationships with global memory and storage manufacturers and authorized distributor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The role is junior level, only for fresh graduates.該職缺提供給畢業生。 The general responsibilities of the position are the following: DRAM Probe Testing Improve DRAM probe testing coverage and quality on DRAM products Own the DRAM probe test flow , review and sign off probe test program releases to ensure quality control Develop innovative DRAM test algorithms and Leveraging Artificial Intelligence to improve test efficiency and reduce test cost New Generation DRAM Product Development Responsible for new DRAM product startup and yield improvement Support design verification and in-depth DRAM circuit analysis using CAD tools and Verilog simulations Work with the wafer fab process / integration teams to address process-related defects impacting DRAM yield Identify design marginalities in DRAM circuits and recommend design fixes for circuit-related issues Functional and Design Validation (DRAM) Design novel DRAM test algorithms and develop test programs for validating DRAM features, modes, and commands Analyze failures generated from characterization and validation activities Automate DRAM test program development and engineering workflows using scripting and data processing tools DRAM Product Yield Enhance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, subsystem, and full‑chip levels while partnering closely with register‑transfer level (RTL) d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, driving next-generation DRAM through advanced photolithography process development. Our team operates at the center of innovation, enabling rapid learning cycles and continuous process improvement in a fast-paced, 24/7 development environment. We value strong execution, collaboration, and building future technical leaders! This role combines people leadership, operations ownership, and deep photolithography expertise. You will lead a team across shifts, guide development execution, and remove barriers to accelerate technology learning. The position offers strong ownership, visibility, and direct impact on Micron’s technology roadmap. Responsibilities: Lead photolithography development execution and ensure high-quality wafer flow and data Manage and develop engineers across shifts through coaching and mentoring Drive operational performance including cycle time, tool readiness, and execution efficiency Partner with integration, process, and manufacturing teams to resolve issues Apply AI-Enabled approaches to improve decision making and development efficiency Minimum Qualifications: Bachelor’s degree in engineering or equivalent semiconductor experience Experience in photolithography process development and imaging fundamentals Demonstrated leadership in a technical or manufacturing environment Strong problem-solving and comm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Films, Metals, and Implant MDE team sits at the center of next-generation DRAM innovation, enabling rapid process learning and high-quality development outcomes. We work closely with multi-functional partners to translate ideas into scalable manufacturing solutions, and we take pride in building strong engineering talent while advancing groundbreaking semiconductor technology. As a Principal Lead Engineer, you will play a dual role as both a technical expert and people leader. You will guide a multi-shift engineering team, drive execution rigor, and ensure seamless development flow across a 24/7 environment. This role is critical to accelerating technology turning points, improving operational performance, and developing the next generation of engineering talent. Responsibilities: Lead multi-shift engineering teams to complete development priorities and ensure consistent 24/7 operational performance Partner with Process Development, Integration, Equipment, and Manufacturing to accelerate learning cycles and meet roadmap goals Coordinate wafer execution, ensuring data quality, process monitoring, timely response to customer concerns, and defect reduction Drive operational excellence by managing important metrics, improving cycle time, and removing execution bottlenecks Build and improve workflows, systems, and AI-enabled practices to improve effi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Chip in to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop sophisticated capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5+ years of direct CAD or Design experience in mixed-signal, custom IC design flows. Proven experience w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 メトロロジー プロセス開発エンジニアは、次世代DRAMおよびHBM技術を支える先端計測技術の開発・導入を担当します。 測定レシピ開発、データ解析、計測装置の評価・立上げに加え、装置サプライヤーと連携した新規計測装置の開発にも携わります。 半導体業界での経験は必須ではなく、製造業で培った分析力や問題解決力を活かしながら、世界中のエンジニアと協働し、最先端メモリ技術の開発に挑戦できるポジションです。 職務内容 先端DRAM/HBM技術向けの新規計測手法および測定レシピの開発・認定 測定結果の解析および測定精度改善に向けた問題解決活動 新規計測装置および測定技術の評価・導入 計測装置の開発業務&#xff08;要求仕様の検討・策定、サプライヤーとの調整・開発推進、完成後の装置立ち上げ・導入までを一貫して担当&#xff09; プロセス管理戦略の策定およびモニタリング計画の構築 実験データおよび量産データを活用したプロセス改善・歩留まり改善支援 プロセスインテグレーション、製造、歩留まり改善、装置エンジニアリング部門との協業 計測装置サプライヤーとの技術レビューおよび開発推進 設備投資計画&#xff08;Capital Planning&#xff09;、設備設置、立ち上げ、認定活動の支援 AIツールを活用した業務効率改善およびデータ活用の推進 必須条件 修士卒以上&#xff08;電気・電子、材料、物理、化学、化学工学、機械工学などの理工系関連分野&#xff09; 製造業または技術系職種における業務経験 論理的思考力および問題解決能力 データを基に課題を分析し、改善策を検討できる能力 日本語による円滑なコミュニケーション能力&#xff08;目安&#xff1a;JLPT N2以上&#xff09; 英語によるコミュニケーションに抵抗がないこと AIツール&#xff08;Anthoropic Claude、Microsoft 365 Copilot等&#xff09;を活用しながら業務効率向上や課題解決に取り組めること 歓迎条件 半導体業界における実務経験 自動車、化学、精密機械、電子部品等の製造業での経験 計測機器、分析装置、生産設備に関する知識または経験 XRD、SIMS、OCD、Scatterometry、CD-SEM、Film Metrology等に関する知識 統計解析や工程管理手法に関する経験 DRAM、HBM、NANDなど先端メモリ技術への興味・関心 海外メンバーとのプロジェクト経験 求める人物像 論理的に物事を整理し、課題解決に取り組める方 指示待ちではなく、自ら考え行動できる方 多様なバックグラウンドを持つメンバーと協働できる方 新しい技術やAIツールの活用に前向きな方 グローバルな環境で成長したい方 <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM Design Architecture organization, where we push the limits of memory technology every day. Our team works across global, multicultural engineering groups to build next-generation HBM solutions that power AI and machine learning. We believe the best ideas come from collaboration, curiosity, and a shared drive to innovate! This role plays a critical part in ensuring the reliability of Micron’s most advanced DRAM and HBM products. As an ESD & Latch Up Engineer, you will shape protection strategies from early design through high-volume manufacturing, working hands-on with silicon, layout, and foundry partners. If you enjoy solving deep technical problems and influencing product robustness at scale, this role offers both impact and growth. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Define and own chip-level and IP-level ESD and latch up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfaces Establish ESD and latch up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standards Enable ESD protection circuits and latch up safe layout practices across designs and technologies Lead silicon validation, failure analysis, and correlation of pre-silicon assumptions to silicon results Act as the technical interface to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Shift Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. Responsibilities: Accurately identifies and appropriately handles chemicals and associated hazards in work area Rec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role supports a high-visibility manufacturing expansion in Boise, where Micron is investing approximately $15 billion to establish leading-edge DRAM manufacturing capabilities. The team plays a critical role in driving operational excellence, process stability, yield improvement, and manufacturing output while supporting Micron's long-term global growth strategy in semiconductor manufacturing. The ID1 High Volume Manufacturing Shift Process Engineer is responsible for optimizing semiconductor manufacturing processes, improving product quality, increasing equipment and process efficiency, and supporting area throughput goals. This position partners closely with equipment engineers, shift operations teams, process owners, and cross-functional stakeholders to rapidly resolve issues, implement continuous improvement initiatives, and ensure manufacturing objectives are achieved safely and effectively. Responsibilities Monitor and optimize manufacturing processes to improve yield, quality, throughput, and overall equipment effectiveness while supporting area KPIs and wafer output goals. Analyze process performance using SPC, FDC, DOE, and other engineering methodologies to identify trends, resolve excursions, and drive systematic problem solving. Lead issue resolution activities by identifying, escalating, and addressing process, tool, defect, yield, and output-related concerns in a timely manner. Develop, update, and main

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Systems & Architecture Lab researches next-generation memory architectures that enable future AI, machine learning, and high-performance computing systems. The team explores innovative memory technologies, system architectures, and hardware-software co-design approaches to improve performance, scalability, and efficiency for emerging AI workloads. As a Research Intern in the DRAM Systems & Architecture Lab, you will conduct research focused on next-generation memory systems for AI accelerators. You will investigate tiered memory architectures, analyze AI workload behavior, develop experimental prototypes, and evaluate architectural innovations across hardware, software, and system-level environments. This role offers the opportunity to contribute to research that may influence future product roadmaps, publications, and advanced memory system designs. Responsibilities Research and evaluate tiered memory architectures designed to improve performance and scalability for AI inference and large language model workloads. Develop experimental methodologies, models, simulations, and prototypes to analyze memory system performance, data movement, and workload behavior. Investigate memory hierarchy optimizations, data placement strategies, cache management, and memory migration mechanisms across AI computing systems. Perform quantitative analysis using hardware platforms, simulation environments, and FPGA-based prototypes to evaluate architectural trade-offs. Document research finding

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Signal Integrity (SI) Research & Development team enables the electrical performance of Micron's industry-leading memory and storage products, including DRAM, LPDRAM, NAND, HBM, SSDs, and emerging memory technologies. The team works across silicon, package, PCB, and system-level designs to develop high-speed signaling and power delivery solutions that support next-generation computing, AI, networking, automotive, mobile, and data center applications. As a Signal Integrity Engineer, you will support the design, analysis, and validation of high-speed memory interfaces and power distribution networks across Micron's product portfolio. Working alongside experienced engineers, you will use modeling, simulation, measurements, and AI-enabled workflows to evaluate signal and power integrity performance, support product development, and contribute to future technology and industry standards initiatives. Responsibilities Support signal integrity and power integrity analysis for high-speed memory interfaces and power distribution networks through modeling, simulation, measurement, and correlation activities. Collaborate with silicon, package, product, validation, and system engineering teams to ensure product electrical performance across all stages of development. Develop and evaluate die, package, PCB, and system-level models to identify performance risks and optimization opportunities. Apply AI-enabled tools and agentic workflows to improve engineering efficiency, automate analysis, improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for sophisticated products. Co-work with international colleagues on developing new verification flows to take on the challenges in design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Ability to identify verification pain points suitable for AI-based automation and collaborate with cross‑functional teams to deploy scalable solutions. Core Requirements Good communication skills and ability to work well in a team Exposure to gate level simulations ( with delays ) and Logic schematic analysis Analytical capability for complex CMOS and/or gate level circuit designs Proficient with Spice and Verilog simulations Qualifications & Skills Experience in DRAM, SRAM or other memory related fields Experience in python scripting Experience in timin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include but are not limited to the following: Team oriented approach to create new strategies for DRAM DFT. New DRAM Test Flow Strategy. Fail Pattern Recognition. Improved methodology for test time reduction and improved quality. Assist in solutions to high visibility DRAM product issues. Create supporting software tools to assist in Engineering Analysis. Invent and Innovate anything and everything related to DFT. Employer will accept a Bachelor’s degree in Electrical Engineering, Computer Science, Electrical and Computer Engineering or related field. Position requires: 1) CMOS circuit knowledge 2) Basic programming skills in Python, Java, C or C&#43;&#43; 3) DRAM knowledge 4) Statistics 5) Basic lab experience or equivalent applied software profiling/analytics As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.<s