Dram Ip Development Layout Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI（人工知能）を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格（必須） ・電気工学、物理学、化学工

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Static Timing Analysis (STA) Engineer — you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, DFT, verification, and product teams to ensure timing integrity and drive timing closure across all modes and corners from initial design through tape-out. This is a hands-on senior technical role focused on chip-level STA ownership, constraint authoring, timing closure, methodology development, and pre-/post-silicon timing correlation. Key Responsibilities Responsibilities will include, but are not limited to: Own end-to-end chip-level static timing analysis and sign-off across all checks, modes, corners, and voltage and temperature conditions. Develop, maintain, and validate sign-off quality Synopsys Design Constraints (SDC) for clocks, resets, high-bandwidth memory (HBM) interfaces, design for test (DFT), and configuration logic. Drive timing closure at block, sub

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Diffusion Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our DIFI equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Installation and qualification of industry leading diffusion equipment in our new cleanroom Diffusion equipment performance, includin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We validate Micron memory products on current and next-generation computing platforms. As an Intern System Compatibility Engineer, you will join our System Enablement and Test Development teams and gain hands-on experience with platform bring-up, system configuration, memory validation, test development, automation, data analysis, and AI-enabled engineering workflows under the guidance of experienced engineers. We will provide technical mentorship, structured onboarding, and exposure to DRAM, BIOS and firmware interactions, computer architecture, laboratory workflows, responsible use of approved AI tools, and the memory product lifecycle from initial bring-up through qualification and readiness. Key Responsibilities Set up and support Intel, AMD, and ARM-based systems in Linux, Windows, and UEFI environments; document hardware, BIOS, firmware, operating system, memory, and test configurations for repeatable execution and traceability. Implement memory validation activities that assess compatibility, stability, reliability, performance, and platform readiness. Reproduce and triage failures, collect logs and diagnostic data, use issue-tracking systems, apply structured failure-analysis methods, and support validation of corrective actions. Build or refine automation using Python, PowerShell, C++, or related languages; use approved AI-assisted tools to accelerate code development, test generation, log analysis, data summarization, technical research, documentation, and report

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Utilize AI-enabled tools and data analytics solutions to improve engineering productivity, accelerate problem solving, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in advanced semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s broader $150 billion global expansion, the High Volume Manufacturing (HVM) organization leverages AI-Enabled innovation, advanced analytics, and operational excellence to deliver world-class memory solutions at scale. As an ID1 High Volume Manufacturing Process Engineer Intern, you will support process optimization, yield improvement, and cost reduction within a high-volume fab environment. You will collaborate with equipment engineering, operations, and multi-functional partners while applying data-driven methodologies and Applying AI to improve wafer output, stability, and performance. Responsibilities Analyze manufacturing data and Apply SPC, FDC, and 8D methodologies alongside AI Assisted analytics to improve yield, reduce defects, and enhance tool availability. Investigate process excursions and Using AI, including LLMs and Generative AI tools, to identify trends, perform root-cause analysis, and recommend corrective actions. Collaborate with multi-functional teams to optimize wafer processing using AI-Enabled and data-driven decision-making approaches. Implement process improvement projects focused on increasing wafer outs, Using AI and visualization tools to enhance process capability and efficiency. Maintain and update process documentation, integrating insights gen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview The High Volume Manufacturing (HVM) organization is responsible for delivering world-class manufacturing performance through process excellence, operational discipline, and continuous improvement. At Micron's Boise, Idaho facility, HVM teams play a critical role in ramping next-generation DRAM technology and supporting one of the most significant semiconductor manufacturing expansions in the United States. Through collaboration across engineering, manufacturing, and equipment teams, the organization drives yield improvement, productivity, and quality while enabling the memory solutions that power AI, data centers, and advanced computing technologies. Position Overview As a High Volume Manufacturing Shift Process Engineer, you will be responsible for improving process quality, yield, equipment performance, and manufacturing efficiency within your assigned area. You will analyze process performance, resolve manufacturing challenges, and drive continuous improvement initiatives that support area objectives and semiconductor production goals. In this role, you will partner closely with equipment engineers, shift operations leaders, and cross-functional stakeholders to ide

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that transform how the world uses information to enrich life for all. With a relentless focus on customers, technology leadership, and manufacturing excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products. The Process & Engineering Improvement Section Manager is responsible for leading a team of engineers to drive manufacturing excellence through continuous improvement initiatives focused on productivity, cost optimization, equipment performance, quality enhancement, and Max Outs (MXT) performance within FAB 16. This leader will collaborate across engineering, manufacturing, and support organizations to identify opportunities, develop strategic improvement plans, and execute solutions that deliver sustainable business results. Key Responsibilities Lead and develop a high-performing engineering team to achieve FAB business objectives in Safety, Quality, Cost, Delivery, and MXT performance. Drive continuous improvement initiatives across processes, equipment, and operational systems to enhance manufacturing efficiency and productivity. <span style="font-siz

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life. Our commitment to people, innovation, tenacity, collaboration, and customer focus enables us to deliver leading memory and storage solutions that power artificial intelligence, data centers, mobile devices, automotive applications, and other emerging technologies. The DRAM Lithography team develops and optimizes advanced photolithography processes tha t support current and future semiconductor manufacturing technology. As a DRAM Lithography Intern, you will contribute to projects focused on advancing next-generation semiconductor manufacturing processes. You will collaborate with engineers across Photolithography, Metrology, Dry Etch, Wet Process, and other process areas to develop innovative solutions for process optimization and technology development. During the internship, you will complete one or more technical projects with opportunities to apply AI and data-driven approaches to complex manufacturing challenges. Responsibilities Design and execute experiments (DOE) to optimize photolithography processes, including EUV lithography, photoresist performance, and related process technologies. Plan, run, and document experiments in a semiconductor cleanroom environment using advanced process equipment. Analyze process images and manufacturing data using commercial and in-house software tools, including AI-enabled methodologies where appropriate. Support projects focused on photolithography simulations, process window opti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We’re looking for a Global Supply Chain Manager to lead strategic sourcing and supplier management for our memory and storage portfolio, including DRAM components and modules, and NAND-based storage products such as solid-state drives (SSDs). You will own commodity strategy, commercial negotiations, and supply assurance from new product introduction through volume production. Working closely with Hardware Engineering, Operations, Finance, and Procurement, you will align supplier technology roadmaps, capacity commitments, and cost targets with our product requirements and build plans. This role is hybrid, based in Toronto, ON, Austin, TX, or Santa Clara, CA. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced in strategic sourcing or commodity management for memory and storage, with knowledge of DRAM components and modules, including DDR memory, and NAND-based storage products including SSDs. You understand the supplier ecosystem, technology roadmaps, qualification requirements, and commercial dynamics of these commodities. Comfortable managing direct relationships with global memory and storage manufacturers and authorized distributor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, subsystem, and full‑chip levels while partnering closely with register‑transfer level (RTL) d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, driving next-generation DRAM through advanced photolithography process development. Our team operates at the center of innovation, enabling rapid learning cycles and continuous process improvement in a fast-paced, 24/7 development environment. We value strong execution, collaboration, and building future technical leaders! This role combines people leadership, operations ownership, and deep photolithography expertise. You will lead a team across shifts, guide development execution, and remove barriers to accelerate technology learning. The position offers strong ownership, visibility, and direct impact on Micron’s technology roadmap. Responsibilities: Lead photolithography development execution and ensure high-quality wafer flow and data Manage and develop engineers across shifts through coaching and mentoring Drive operational performance including cycle time, tool readiness, and execution efficiency Partner with integration, process, and manufacturing teams to resolve issues Apply AI-Enabled approaches to improve decision making and development efficiency Minimum Qualifications: Bachelor’s degree in engineering or equivalent semiconductor experience Experience in photolithography process development and imaging fundamentals Demonstrated leadership in a technical or manufacturing environment Strong problem-solving and comm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Films, Metals, and Implant MDE team sits at the center of next-generation DRAM innovation, enabling rapid process learning and high-quality development outcomes. We work closely with multi-functional partners to translate ideas into scalable manufacturing solutions, and we take pride in building strong engineering talent while advancing groundbreaking semiconductor technology. As a Principal Lead Engineer, you will play a dual role as both a technical expert and people leader. You will guide a multi-shift engineering team, drive execution rigor, and ensure seamless development flow across a 24/7 environment. This role is critical to accelerating technology turning points, improving operational performance, and developing the next generation of engineering talent. Responsibilities: Lead multi-shift engineering teams to complete development priorities and ensure consistent 24/7 operational performance Partner with Process Development, Integration, Equipment, and Manufacturing to accelerate learning cycles and meet roadmap goals Coordinate wafer execution, ensuring data quality, process monitoring, timely response to customer concerns, and defect reduction Drive operational excellence by managing important metrics, improving cycle time, and removing execution bottlenecks Build and improve workflows, systems, and AI-enabled practices to improve effi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Chip in to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop sophisticated capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5&#43; years of direct CAD or Design experience in mixed-signal, custom IC design flows. Proven experience w