Dram Ip Development Layout Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of DRAM Memory array/Peripheral Logic/Analog circuits Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate schematic optimization and design‑space exploration Assist in parasitic analysis, sensitivity studies, and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Oversee and manage the layout process including floor-planning, placement, and routing Perform circuit-level verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Drive innovation into the future memory generations and design methodology within a dynamic work environment Minimum Qualifications Master’s degree in electrical or computer engineering with 4-8 years of experience in memory design. Strong fundamentals in CMOS circuit design, device physics and memory operation. Experience with SPICE-based simulation and parasitic extraction. </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The AMHS Shift Technical Engineer is responsible for maintaining and sustaining the OHT (Overhead Transport), OHS system(Overhead Shuttle), Normal Stockers, Tower Stockers, BWS (Bare Wafer Stockers), Sorters, N2 purge tools, Carriers, Carrier/Wafer Packing Tools, and ASRS. Responsibilities and Tasks 1. Work with supplier for regular AMHS maintenance (PM). 2. Work with IT and vendor as automation on duty help desk for production trouble shooting (include Micron system and AMHS system, AMHS H/W). 3. Automation project support 4. Regular report update 5. Using AI Other Requirement&#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in the TDT (TD Taiwan) Device Team, you will drive DRAM device development projects supporting technology roadmap enablement, model delivery, performance optimization, reliability improvement, and technology transfer. You will collaborate closely with Technology Development organizations worldwide to advance next-generation CELL technologies from concept development through high-volume manufacturing. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. Key Responsibilities Drive DRAM CELL device development projects supporting future technology roadmap requirements. Lead electrical characterization, margin assessment, performance optimization, and reliability improvement activities.</p

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: T

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is s

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI&#xff08;人工知能&#xff09;を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格&#xff08;必須&#xff09; ・電気工学、物理学、化学工

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR4,LPDDR4,DDR5 and LPDDR5 that can operate at high speeds of up to 6400MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: • Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops • Strong judgment to validate AI outputs before use (review assumptions, align with specs/standards, cross-check with simulations, waveforms, assertions, and coverage reports, and document what was accepted/changed) prior to incorporating results into design decisions, verification plans, or debug conclusions • Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, focused on building and scaling advanced wet process equipment that enables next-generation DRAM. We partner closely with vendors, process teams, and manufacturing to bring new tools from concept to high-volume production. Our work blends hands-on engineering with real impact on performance, cost, and sustainability—making this an exciting place to shape the future of memory! In this role, you will develop, optimize, and sustain liquid-phase processing equipment used in advanced semiconductor manufacturing. You will work across R&D and manufacturing environments, solve complex hardware challenges, and help drive tools to meet aggressive performance and reliability targets. This is a high-ownership role with strong multi-functional exposure and direct impact on tool development at scale. Responsibilities: Develop and optimize wet process equipment for advanced DRAM nodes Partner with vendors and internal teams to resolve hardware gaps Drive installation, qualification, and upgrades of new tools Apply data analysis to monitor tool performance and solve issues Support transfer of processes from development to manufacturing Minimum Qualifications: Bachelor’s degree in Mechanical Engineering, Chemical Engineering, or related field 3&#43; years of experience in semiconductor equipment or process engineering Knowledge of wet process equipment and semiconductor fabric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR4,LPDDR4,DDR5 and LPDDR5 that can operate at high speeds of up to 6400MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: • Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops • Strong judgment to validate AI outputs before use (review assumptions, align with specs/standards, cross-check with simulations, waveforms, assertions, and coverage reports, and document what was accepted/changed) prior to incorporating results into design decisions, verification plans, or debug conclusions • Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Participate in simulating, analyzing, and debugging pre-silicon full chip designs by applying leading edge verification technique Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Participate in developing verification methodology and verification environ

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3&#43; months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, exp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Lead design readiness activities for new DRAM products, including risk assessments, DFMEA development, validation planning, and readiness reviews Partner with cross-functional teams to identify product risks, define validation coverage, and prioritize debug activities Drive root-cause investigations of silicon findings through data analysis, experiment planning, evidence review, and corrective action development Influence product readiness decisions by connecting design intent, validation results, silicon behavior, manufacturing constraints, and customer quality expectations Mentor engineers and help improve technical practices, readiness processes, and organizational learning across DRAM programs Minimum Qualifications: Advanced degree in Electrical Engineering, Computer Engineering, Semiconductor Engineering, Applied Physics, Materials Science, or a related technical field, or equivalent industry experience Significant experience in semiconductor design, DRAM or memory technology, silicon validation, product engineering, device characterization, circuit debug, reliability, test development, or new product introduction Proven ability to analyze sophisticated technical problems using silicon data, validation results, circuit behavior, failure analysis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities · Lead pre-silicon readiness activities across new DRAM products, including risk assessment, DFMEA preparation, validation planning, and readiness reviews with cross-functional engineering teams. · Partner closely with Design, Verification, Component Validation, Product Engineering, Product Architecture, System Compatibility Group, and Silicon Strategy teams to identify product risks, define validation coverage, and align debug priorities. · Apply strong technical judgment to analyze circuit behavior, silicon data, validation results, failure signatures, and product-level interactions across design, test, and manufacturing flows. · Drive structured investigation and resolution of silicon findings, including root-cause analysis, experiment planning, evidence review, and alignment of mitigation or screen strategies to project milestones. · Influence product readiness decisions by connecting design intent, silicon behavior, validation results, manufacturing constraints, and customer quality expectations. · Mentor engineers, strengthen technical practices, and help capture lessons learned that improve execution, product robustness, and organizational readiness across future DRAM programs. ·Apply AI-enabled ways of working to improve engineering productivity, including use of approved AI tools for technical research, data synthesis, debug plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Shift Process Engineer is responsible for improving process quality, working on yield and efficiency improvements, cost reduction, and resolving line issues in their assigned area to achieve area KPIs and optimize manufacturing wafer outs. They partner with equipment team members, leaders within the area, shift operations leaders, and periphery stakeholders to ensure critical area priorities are understood and executed on Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures proper tool documentation/reaction mechanisms exist and submits updates to content Leads in expertise of executing area operations to ensure throughput needs are accomplished Resolves or escalates issues that