Dram Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary This team member will focus on performing semiconductor design engineering assignments including engineering and designing chip layout circuits, circuit checking, documenting specifications, and modifying and evaluating semiconductor devices and components. Typically responsible for projects, or portions of projects, to design, fabricate, optimize, and validate memory circuit solutions while supporting advanced semiconductor technology development. Responsibilities Design, layout, and optimize memory circuits with a focus on performance, power, area, and manufacturability. Perform circuit simulation and analysis using industry-standard tools such as SPICE and Verilog to validate circuit functionality. Develop and support schematic blocks including memory arrays, control logic, address decoders, datapaths, and internal test circuitry. Evaluate design architecture tradeoffs and incorporate layout parasitics to ensure robust circuit operation and silicon success. Drive innovation through test chip development, silicon validation, and AI-enabled improvements to design methodologies and workflows. Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher, or equivalent experience. Basic understanding of memory array architectures, circuits, and operation. Strong understanding of circuit simulation setup, analysis, and debug techniques. Strong written and verbal communication skills with the ability to convey technical concepts

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design and maintain standard cells layout for new DRAM products on new technology Lead the stdcells layout projects from initial spec definition to till PPA qualified library release Closely collaborate with DTCO team to develop stdcells architecture for emerging technologies Perform layout verification like LVS/DRC/Latchup, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Guide junior team-members in their execution of Sub block-level layouts & review their work. Contribute to effective project-management. Develop new flows/methodologies to reduce the stdcells manual effort & increase the productivity Closely work with the Process team, CMOS and CAD to negotiate drc for new technology. Co-work with international colleagues on developing new flows and tools for stdcells layout & design Leverage AI tools to automate the tools and workflow Use AI-assisted workflows to improve design productivity About Micron Technology, Inc. We a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Develop and standardize EMIR methodology that applies consistently across all DRAM products, ensuring alignment, repeatability, and high-quality analysis outcomes Perform static and dynamic EM/IR and PDN analysis using RedHawk or Totem or other industry‑standard tools; identify root‑cause issues such as high‑resistance segments, insufficient via density, and decap deficiencies, and provide clear, actionable recommendations to design and layout teams. Actively leverage AI‑based tools, agentic workflows, and automation frameworks for effective Power-delivery-network (PDN) analysis. Maintain a strong understanding of the full EMIR flow—from netlist preparation, extraction, simulation, and debug to reporting and silicon correlation—and ensure accurate evaluation across operating modes and temperatures. Partner across design, timing, physical implementation, architecture, modeling, and verification teams to understand real switching behavior, develop worst‑case vectors, and standardize analysis expectations across global teams. Collaborate with cross-geographical teams and also EDA tool vendors to evaluate and improve EMIR methodologies, and document Best Known Methods (BKMs) to enhance consistency and correlation across DRAM teams. Develop and maintain dashboards to track EMIR results, monitor trends, and support signoff progression for multiple designs. Qualifications: Master’s degree i

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Take responsibility for designing digital IP blocks from initial microarchitecture to RTL creation, integration, and supporting physical hardware development. Define and review module interfaces and system-level architecture. Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate RTL design optimization and design‑space exploration Assist in testbench generation and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Drive full-chip integration including CDC, Lint, synthesis, STA and power analysis. Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Collaborate closely with architecture, design, verification, and physical design / layout teams. Oversee and manage the layout process including floor-planning, placement, and routing. Perform block-level and full-chip verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Provide technical mentorship and participate in design and methodology reviews. Drive innovation into the future memory generations and design methodology within a dynamic w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Lead Principal Engineer, Layout Design at Micron, you will be at the forefront of developing groundbreaking memory solutions! This role is an outstanding opportunity to lead the physical implementation of modern DRAM and mixed-signal circuits, turning schematics and specifications into flawless, manufacturable layouts. You will collaborate with a world-class team of Circuit Designers, Verification Engineers, CAD/Methodology experts, Process Integrators, Product Engineers, Test/Probe specialists, Assembly professionals, and Marketing strategists. Together, we will drive cost, quality, reliability, time-to-market, and customer happiness through outstanding layout and build. Key Responsibilities Lead the layout build and physical realization of new memory products. Interpret device and circuit specifications to implement custom layout solutions meeting PPA (power, performance, area) and reliability targets. Develop hierarchical layouts for analog, digital, and memory-array-related circuitry using industry-standard EDA tools. Build block and top-level floorplans optimizing placement, routing resources, signal integrity, power delivery, and manufacturability. Optimize layout for critical metrics such as die size/area efficiency, matching, coupling/noise, and timing. Produce layout collateral and documentation for cross-team integration. Physical Verification and Tapeout Signoff Run and debug physical verification flows and ensure closure using indust

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role combines advanced DRAM circuit design with technology development, silicon learning, and yield improvement. We work across Design, Technology Development, Product Engineering, Test, Reliability, Quality, Manufacturing, and other teams to solve challenging memory-design problems and enable future technology generations In this position, you will contribute to the design and optimization of critical DRAM circuitry, including Sense Amplifiers, timing distribution, calibration, and training features. You will influence designs from early process-node development through silicon bring-up and production ramp, using simulation, silicon data, statistical analysis, and automation to improve performance, robustness, yield, and manufacturability Responsibilities: Design, analyze, verify, and optimize memory, logic, and analog circuits, including Sense Amplifiers, timing distribution, calibration, and training features Identify design marginalities and develop circuit- or architecture-level solutions that improve DRAM robustness, performance, scalability, and yield Support new process-node development, qualification, silicon bring-up, yield learning, and production ramp through modeling, simulation, silicon experiments, electrical failure analysis, and statistical analysis Guide layout, parasitic extraction, and modeling activities for Sense Amplifiers and Wordline drivers, including floor planning, placement, routing, signal-margin optimization, and memory-bit interaction Lead technical investigati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we design the memory that moves the world — from advanced DRAM to complete silicon-to-systems solutions! Our design teams work at the leading edge of memory technology, and we collaborate across the globe to turn ambitious ideas into world-class products. If you want your work to show up in the devices billions of people rely on, this is the place to do it. As a Staff Design Engineer on our DRAM team, you'll shape the circuits at the heart of our next memory generations. You'll own design decisions that directly affect cost, quality, reliability, and time-to-market, and you'll partner with talented engineers across design, verification, product, and manufacturing. This is a role for someone who enjoys working close to silicon and wants real ownership over the products they help create. Responsibilities: Design, lay out, and optimize Memory, Logic, and Analog circuits for new memory products Handle parasitic modeling and support design validation, reticle experiments, and tape-out revisions Oversee the layout process, including floor-planning, placement, and routing Run verification through modeling and simulation using industry-standard simulators Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to ensure manufacturability, and use Generative AI tools to speed up design, analysis, and documentation while owning correctness and signoff Minimum Qualifications: Bachelor's degree in Electrical

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s advanced memory design organization, where digital innovation directly shapes the next generation of DRAM products. We work across global teams, combining deep technical expertise with diverse perspectives to solve complex problems and push memory technology forward. We are also deeply engaged with AI tools to develop/optimize the design verification flow for better quality and efficiency This role plays a critical part in defining and delivering competitive digital IP for advanced DRAM. You will influence architecture, design, and verification while collaborating closely with layout, modeling, and CAD partners. It’s a hands-on opportunity to grow your technical depth while making a visible impact on future memory products. Responsibilities: Develop competitive digital IPs for advanced DRAM products Define design and verification requirements from specifications and reference designs Build high-level behavioral and algorithmic models for architecture verification Design IP using RTL or custom methodologies and guide layout and verification teams Collaborate with standards, CAD, modeling, and verification teams to improve design quality Leveraging AI (EX Claude Code or other AI tools) to develop, improve design quality and efficiency Minimum Qualifications: Bachelor’s degree in Electrical Engineering or related field, or equivalent experience 6+ years of experience in digit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team develops the innovations that power AI, mobile, and computing platforms around the world. Our DRAM Engineering team brings together experts across design, verification, manufacturing, and product development to solve complex technical challenges and deliver advanced memory solutions. We are passionate about innovation, collaboration, and building technology that enables the next generation of computing. As a Semiconductor Design Engineer, you will help develop advanced DRAM and emerging memory products from concept through silicon validation. This role offers opportunities to contribute across circuit design, simulation, verification, and optimization while working closely with global engineering teams. Depending on experience, you may also lead technical projects, mentor engineers, and influence future memory design strategies. Responsibilities: Design, simulate, and optimize digital, analog, and mixed-signal circuits for DRAM and emerging memory products. Translate product requirements into circuit solutions and validate performance across operating conditions. Perform circuit verification, silicon correlation, debug, and tape-out support activities. Collaborate with design, verification, layout, CAD, product, and process teams to improve product quality and manufacturability. Contribute to design automation, AI-assisted workflows, technical reviews, and engineering protocols. Minimum Qualifications: <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a Design Engineer, you will contribute to the design and analysis of digital and analog circuits used in memory technologies. You will collaborate with global, multi-functional engineering teams to optimize product performance, manufacturability, cost, and time-to-market while supporting end-to-end product development and validation. Responsibilities Design, simulate, and optimize memory circuits, including layout development and verification using industry-standard tools (e.g., SPICE, Verilog) Develop schematic blocks such as memory arrays, control logic, datapaths, address decoders, and internal test logic Analyze design trade-offs across power, speed, die size, and manufacturability to improve overall product performance Collaborate with Product Engineering, Test, Process Integration, Assembly, and Marketing teams to ensure robust and scalable designs Apply AI-enabled tools and methodologies to improve circuit design efficiency, simulation accuracy, and overall design flow optimization Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher Foundational understanding of memory architectures, circuit design, and semiconductor device behavior Experienc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Member of Technical Staff or Member of Technical Staff, DRAM Design Engineer in the next-generation HBM Architecture team, you will drive the architecture and optimization 3D-stacked, high-performance memories. Apply your knowledge to optimize DRAM designs and architectures for maximum performance, power, and area (PPA). This role is ideal for experienced DRAM designers who will identify, architect, design, and simulate next-generation architectures and memory features in collaboration with experts in stack architecture, memory systems architecture, and SoC microarchitecture. Responsibilities: Identify and develop novel DRAM circuit architectures that anticipate next-generation AI workload requirements, to unlock improvements in bandwidth and energy efficiency. Collaborate with peers to identify the highest-leverage DRAM circuit bottlenecks and define architectural hypotheses. Validate architectural hypotheses through schematic-level circuit design, SPICE simulation, and tradeoff analysis, establishing PPA feasibility. Partner with layout designers to conduct floorplanning studies. Colla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview At the Munich Development Center, we develop high-performance memory solutions for the graphics and AI markets. As part of the DRAM Design Engineering Group (DDEG), we collaborate closely with Micron’s global development and manufacturing teams. Our mission is to push the boundaries of memory technology through innovation, precision, and partnership. Role Overview We are looking for a motivated and curious working student or Master’s thesis candidate to join our DRAM design team. This is an outstanding opportunity to gain hands-on experience in integrated circuit (IC) design while working alongside expert engineers in a collaborative, startup-like environment. You will contribute to real-world projects and receive mentorship to support your academic and professional growth. Responsibilities Support the design and simulation of analog or digital circuit blocks under guidance Assist in developing schematics at the transistor level or RTL Participate in functional verification and layout reviews Contribute to testbench development and simulation setup Document design processes and results for internal use or academic reporting Collaborate with cross-functional teams to understand the full memory design flow Leverage generative AI tools to complete tasks in effective manner Optionally: define and complete a master’s thesis project aligned with team goals Required Qualifications Enrolled in a Bachelor’s or Master’s program in Ele

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations