Dram Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team drives leading-edge process capability, best-in-class yield (bits per wafer), high product quality, and rapid time to maturity through innovation and strong cross-functional collaboration. Supporting a global DRAM and NAND technology portfolio across development and manufacturing sites in the U.S., Japan, Taiwan, and Singapore, the team ensures consistent execution of manufacturing excellence worldwide! As a Frontend Central Process Integration Senior Engineer, you will identify, align, and deploy best-known methods across the global network and develop optimized processes to achieve product maturity and sustainable performance improvement. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline transparency to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. </li

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next ‑ generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best ‑ in ‑ Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device ‑ and stack ‑ level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design ‑ For ‑ Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross ‑ functional partners—including Fab, Product Leads, Design Engineeri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Hands on experience in SV, UVM based Verification. Good scripting skills using perl, python is a plus Good understanding of digital / mixed signal circuits and experience in Digital /Mixed signal Verification. Understand the usage of industry standard tools like Virtuoso, Xcellium, Simvision, vsim, Waveview, Finseim, Hspice and Micron-specific simulators Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments and contribute to cross-group communication to work towards standardization and group success About

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Hands on experience in SV, UVM based Verification. Good scripting skills using perl, python is a plus Good understanding of digital / mixed signal circuits and experience in Digital /Mixed signal Verification. Understand the usage of industry standard tools like Virtuoso, Xcellium, Simvision, vsim, Waveview, Finseim, Hspice and Micron-specific simulators Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments and contribute to cross-group communication to work towards standardization and group success About M

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline visibility to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people creat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容&#xff08;Job Description&#xff09; Micronのテクノロジー開発&#xff08;Technology Development&#xff09;グループに所属する DRAMプロセスインテグレーション・パスファインディングエンジニアとして、次世代DRAMテクノロジーノードに向けたモジュール開発を主導していただきます。 モジュールオーナーとして、1つまたは複数のモジュールに対する構造的および電気的要件を定義し、ユニットプロセス部門や支援チーム、ならびに他のモジュールオーナーと連携しながら、モジュールをプロセス全体に統合します。 また、多分野のエンジニアからなるチームと協働し、新しいアーキテクチャ、デバイス、技術、材料を評価することで、今後5年以上を見据えた技術開発の方向性を検証します。 主な業務内容&#xff08;Responsibilities&#xff09; 電気特性、インライン指標、ユニットプロセス、デザインルールに基づき、構造仕様を策定する 構造‐電気特性の相関に基づき、エンジニアリング仕様を満たすための実験を設計・実行・解析する モデルベースのアプローチで問題解決を行い、プロセス改善、特許、技術論文を通じて技術革新を推進する 1つまたは複数のプロセスモジュールについて、デザインルール、構造仕様、電気仕様を含めて開発・維持・改善する&#xff08;代替フロー含む&#xff09; 既存プロセスフローを最適化し、製品要件を満たす創造的な解決策を開発する JMPなどの統計解析ソフトウェアを用いて、実験の設計・実行および結果解析を行う 結果を製品側へフィードバックし、歩留まり改善に貢献する インラインデータ、欠陥データ、パラメータデータ、プローブデータを抽出・監視・解析し、 歩留まり問題の解決、性能・信頼性向上、プロセスマージン拡大、コスト削減を推進する 設計、製品技術、モデリング、歩留まり改善、電気・物理的故障解析、欠陥解析、パラメータ、品質チームと部門横断的に連携し、課題・目標・優先順位を理解する 複雑な問題を要約し、対応策を導出・説明し、チームの実行を牽引する 担当モジュール内におけるサブマイルストーンを定義する プロセスインテグレーション、プロセス開発、パイロットファブ間の円滑なコミュニケーションを維持・徹底する 製造移管に向けて、R&D活動の適時なドキュメンテーションを確実に行う 学歴・経験要件&#xff08;Education and Experience&#xff09; 修士号または博士号 &#xff08;電気工学、マイクロエレクトロニクス、物理学、材料科学&#xff09; または 学士号&#xff0b;業界経験5年以上 必要スキル・知識 半導体デバイス物理および電気特性評価に関する知識 材料科学および半導体プロセス基礎に関する知識 JMP、Python、またはその他のデータ解析&#xff0f;データエンジニアリングソフトを用いたデータ解析スキル 英語による対人・口頭・文書コミュニケーション能力 歓迎要件&#xff08;Preferred Experience&#xff09; プロセスインテグレーション、またはそれと密接に関わる職務における業界経験5年以上 DRAM製

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 50,000 patents granted and still growing . As an Engineer, you will be a part of revolutionary next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As RAM (RDA and Metrology) Central Team Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers as well as process integration team, responsible for starting up, developing and optimizing detection to improve product yield, quality, and cost. This position will identify, diagnose and resolve detection gaps, as well as improving current detection. Responsibilities include working closely with the NAND and DRAM sites, HVM and TD, and even suppliers, to achieve Inline Visibility and Inline Control for Detection enablement and improvement. This position is responsible in setting up and aligning BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement. Responsibilities and Tasks: • Establish Detection to have 100% Inline Visibility and Inline control • Improve Detection strategy, system, and methods to continuously strengthen detection performance. • Enhance Detection capability and strategy to enable Yield improvement, improve Cycle of Learning and strengthen Defense Line. • Establish and improve BKM (Best Known Method) related to RAM Detection performance, RAM dete

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary: We are seeking a highly motivated Photo Engineer to join our Manufacturing Engineering (MFG-ME) team. This role is instrumental in driving business objectives related to capacity ramp-up and cost reduction for advanced DRAM semiconductor products. Key Responsibilities: Lead initiatives to improve productivity through process optimization on Track equipment and ensure stable equipment operation to support capacity expansion and cost efficiency. Collaborate with equipment vendors and suppliers of components and materials to develop and implement innovative technologies that address technical challenges. Facilitate cross-functional communication and drive improvement activities by working closely with managers, engineers, and technicians across various departments and operational areas. Contribute to company-wide technology deployment efforts by coordinating with both domestic and international fabrication sites. Preferred Qualifications: (Candidates are not required to meet all criteria) Proficiency in Microsoft Office applications (Outlook, Excel, PowerPoint, Word). Ability to communicate effectively in Japanese and English, including email correspondence and technical documenta

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact <a target="_blank" href="mailto:hrsupport_jp&#64;micron.c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The F15 ATE DIF Engineer is responsible for successful transfer achievement of new technode transferred from TD, Yield improvement/CT reduction/tool expansion toward TTMCY with great collaboration with TD/F15 all related Dept/DRAM network/MCT.Safety, Technology transfer to sister site & further new tech node transfer readiness are also our responsibility. As one of our team members, you should Understand site, department, area goals and set individual goals to achieve them with discussion with your SV. You are required to take a responsibility for process & workstation as owner and do all tasks assigned timely and accurately. You are also highly appreciated to work positively and show your ownership of all the tasks you are assigned. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-perfor

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Photo Engineer to join our Manufacturing Engineering (MFG-ME) team. This role is instrumental in driving business objectives related to capacity ramp-up and cost reduction for advanced DRAM semiconductor products. Key Responsibilities: Lead initiatives to improve productivity through process optimization on Track equipment and ensure stable equipment operation to support capacity expansion and cost efficiency. Collaborate with equipment vendors and suppliers of components and materials to develop and implement innovative technologies that address technical challenges. Facilitate cross-functional communication and drive improvement activities by working closely with managers, engineers, and technicians across various departments and operational areas. Contribute to company-wide technology deployment efforts by coordinating with both domestic and international fabrication sites. Preferred Qualifications: (Candidates are not required to meet all criteria) Proficiency in Microsoft Office applications (Outlook, Excel, PowerPoint, Word). Ability to communicate effectively in Japanese and English, including email correspondence and technical documentation. Strong initiative and problem-solving skills, with a proactive approach to proposing improvement strategies. Capability to manage complex issues through close collaboration with stakeholders and appropriate escalation when necessary. <