Dram Power Engineer Jobs

Senior DRAM Product Engineer — Manassas, VA - Fab 6. Apply via Workday.

Sr DRAM Product Engineer — Manassas, VA - Fab 6. Apply via Workday.

Principal DRAM Product Applications Engineer — San Jose, CA. Apply via Workday.

LPDDR DRAM Product Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Micron's DRAM organization focuses on designing and developing industry leading dynamic random access memory products. These teams drive R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. Our Process Integration team is at the center of advancing next‑generation memory technology. We work closely across engineering, manufacturing, and change management to turn data into action and keep programs moving forward. If you enjoy solving complex problems and seeing your impact on real products, you’ll find a home here! We’re hiring a Senior Process Integration Technician to partner with Module Engineers and help drive day-to-day execution. This role is essential to keeping experiments, conversions, and production priorities on track through strong coordination and clear communication. You’ll play a hands‑on role in data analysis, issue resolutions, and cross‑functional alignment to support key technology milestones. Responsibilities Collaborate with cross-functional teams to interpret and complete conversions for assigned PI Engineering Module. Serve as the primary point of contact for experiment coordination, conversion activities, and lot movement logistics. Partner with PI Module Owners, Process Area Owners, PI Conversion Coordinators, and Change Management teams to ensure alignment and execution of module support tasks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron research and development has an opening for Yield Analysis (DA) engineer to develop our next generation memory solution and to support production transfer for the next generation Micron products. As a DA engineer you will be responsible to characterize electrical data to identify and source out extrinsic and intrinsic device issues that are impacting yield. You will work closely with cross functional team from R&D and manufacturing to accelerate product to market timeline by applying device physics knowledge to develop end of line device performance prediction using machine learning. We need engineers who are passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict end of line device performance. Your responsibilities will include, but are not limited to the following: Analyze end of line test, parametric and fab data to identify design, process, and test issues that are impacting yield Develop new tools for yield analysis and implement machine learning technique to improve analysis efficiency and accuracy, leveraging artificial intelligence (AI) to improve proficiency. Identify new creative and innovative ways to use existing tools to identify relevant process issues or device failures Identify interactions between process modules and/or equipment to detect fail mechanisms Use the data collected inline to drive process improvements Improve yield by standardizing methods and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron's Boise R&D site, the DRAM Technology Development organization drives innovation in next-generation memory solutions. The team develops advanced DRAM cell architectures, access devices, materials systems, and integration technologies that enable future scaling, improved performance, enhanced reliability, and manufacturing readiness. Engineers work across device, materials, process integration, modeling, design, and product engineering teams to bring groundbreaking memory technologies from concept to production. As an intern in the Advanced DRAM Device & Cell Technology team, you will contribute to the development and characterization of future DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams. This position combines semiconductor device physics, materials engineering, silicon experimentation, electrical characterization, and data-driven decision making to improve cell performance, density, retention, reliability, and manufacturability. The successful candidate will collaborate with multi-functional teams to evaluate novel materials, device architectures, and integration schemes supporting future memory technology development. Responsibilities Support the evaluation of DRAM access devices, capacitors, and cell stack elements through characterization, data analysis, and assessment of new device architectures, materials systems, and integration schemes. Design and implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners! The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the 3D DRAM organization, you will join a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology that enables the future of memory scaling. You will focus on performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science and semiconductor device physics, along with a creative mindset and effective project management. The role interacts significantly with process development, simulation, characterization, and reliability groups. Responsibilities: Contribute to technology development activities to enable next generation DRAM, working on device components such as charge storage devices and thin-film transistors, among others. Optimize process flows and develop creative solutions to meet product requirements. Engage numerous cross-functional te

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a PYE Engineer, you will work on the Product Yield Enhancement Failure Analysis team to support legacy DRAM products throughout their manufacturing lifecycle. You will focus on yield improvement, product reliability, and component failure analysis to identify and resolve issues, enable stable production, and support quality requirements for industrial and automotive customers. Your responsibilities will require using electrical and physical characterization techniques combined with AI supported workflows and statistical data analysis to identify failures related to fabrication and assembly process, as well as testing marginalities. You will be responsible for communicating and coordinating component-level improvement activities with Product, Process, Quality and Test Engineering teams. Job Duties Perform electrical failure analysis to understand failure mechanisms Identify causes of component failures through statistical data analysis Work closely with cross-functional engineering teams to resolve fabrication and assembly process defect related issues and test flow marginalities Use statistical data analysis, data visualization, and AI tools to identify trends, accelerate root cause investigations, and improve component performance Communicate findings clearly through written reports and presentations Minimum Qualifications: At least a bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials S

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Technology Development organization is responsible for advancing next-generation memory technologies that enable future computing innovations. Engineers within this team work in a brand new 300mm R&D facility, collaborating across process development, characterization, reliability, design, and simulation fields to drive memory scaling and manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will support the development of next-generation DRAM technologies with a focus on device performance, reliability, and manufacturability. This role involves working on advanced memory structures, including charge storage devices and thin-film transistors, while partnering with multi-functional engineering teams to solve challenging integration and circuit-related issues. The ideal candidate will have a strong foundation in semiconductor device fabrication, materials science, and device physics, combined with data-driven problem-solving skills and a passion for technology innovation. Responsibilities Contribute to the development of next-generation DRAM technologies, including advanced memory device components such as charge storage structures and thin-film transistors. Design, complete, and analyze experiments within the R&D fabrication environment to support technology development objectives. Collaborate with process

New College Grad - DRAM Design Engineer — Boise, ID - Main Site. Apply via Workday.

Intern - Advanced DRAM Cell/Device Engineer — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Micron For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. The DRAM Customer Enablement team serves as the bridge between Micron's newest memory technologies and the systems that deploy them. We help validate, characterize, and enable new DRAM products across hyperscale cloud, AI, enterprise, client, mobile, and next-generation computing platforms. We are seeking a highly motivated intern who is eager to gain hands-on experience working with cutting-edge memory technologies, cloud computing systems, and AI-assisted software development. This internship provides an opportunity to work alongside experienced engineers while contributing to real-world projects that help bring Micron's latest DRAM innovations to customers. (Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly expanding your individual and collaborative skills in this exciting and outstanding opportunity. What You'll Do As a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp