Dram Technology Sr Layout Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is s

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI’s Quality, Cost and Cycle Time. You will play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing. This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role As a Member of Technical Staff (MTS) in Micron’s HBM Product Engineering Component Validation team, you will serve as a technical leader and authority for the validation of advanced High Bandwidth Memory (HBM) products. You will apply deep DRAM and HBM architecture and design knowledge to define validation coverage strategy, lead complex product debug and failure analysis, and drive a zero-escape validation mindset across all test modes and product milestones. Operating within Micron’s global validation organization and partnering closely with teams across multiple sites, you will influence design-intent-to-coverage decisions, mentor engineers, and set the technical direction for current and next-generation HBM validation. Responsibilities and Tasks Technical Leadership & Validation Strategy Act as a technical authority for HBM Component Validation, translating DRAM/HBM design intent and architecture into comprehensive validation coverage and test strategy. Define and own validation methodologies and coverage plans across structural (black-box) and functional test flows, driving toward full validation coverage at each product milestone with zero validation escapes. Lead validation definition and closure for new and high-risk product

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role We are looking for a passionate and innovative ATE Test Engineer to design and deliver cutting-edge test solutions for HBM-DRAM devices using modern advanced ATE platforms. In this role, you will lead the development and implementation of test plans, ATE test programs, silicon validation, and test methodologies, while driving multi-site hardware design and development, product characterization, and high-volume production support. Success in this position requires a forward-thinking mindset and the ability to apply the right technologies to meet evolving challenges. Key Responsibilities Develop and implement robust test strategies, plans, and ATE programs for HBM-DRAM devices. Drive silicon validation, characterization, and yield improvement initiatives. Design and debug test hardware, including schematic capture and PCB layout. Collaborate cross-functionally to ensure seamless integration of test solutions into production. Support high-volume manufacturing and troubleshoot complex test issues. Qualifications & Skills Education: Bachelor’s or Master’s degree in Electrical, Electronics or Computer Engineering. Experience: A

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Integration Module Engineer in the Central Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for DRAM/NAND process and production line. Day-to-day responsibilities include but not limit to collaborating with network PI/YE/PQA/PEE teams to craft and analyze process experiments, to achieve best-in-class (BIC) yield and quality to establish documented best-known methods (BKMs) Responsibilities and Tasks Collaborate with multi-functional network teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. May require travel to global Micron sites to foster collaboration and drive execution. Communicate module related issues to the Fab engineering and leadership teams. Design, execute, and analyze experiments to improve fab process, yield, and quality. Collect and interpret complex data to optimize Fab processes and increase yields. Engage and/or lead cross-area engineering teams to tackle process issues. Work closely with global partners to stay ahead of on module related topics and process alignment projects. Collaborate with oth

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Process Integration Module Engineer in the Central Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for DRAM/NAND process and production line. Day-to-day responsibilities include but not limit to collaborating with network PI/YE/PQA/PEE teams to craft and analyze process experiments, to achieve best-in-class (BIC) yield and quality to establish documented best-known methods (BKMs) Responsibilities and Tasks Collaborate with multi-functional network teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. May require travel to global Micron sites to foster collaboration and drive execution. Communicate module related issues to the Fab engineering and leadership teams. Design, execute, and analyze experiments to improve fab process, yield, and quality. Collect and interpret complex data to optimize Fab processes and increase yields. Engage and/or lead cross-area engineering teams to tackle process issues. Work closely with global partners to stay ahead of on module related topics and process alignment projects. Collaborate with oth

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next ‑ generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best ‑ in ‑ Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device ‑ and stack ‑ level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design ‑ For ‑ Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross ‑ functional partners—including Fab, Product Leads, Design Engineeri

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing . Location 1 North Coast Drive, Singapore Department Product Integration Engineering (PIE), Process Integration (PI ) Project Title Advanced Memory Process Integration Improvement Exploration and Device Reliability Study (NAND / DRAM / HBM) Project Description This internship provides a structured learning opportunity within the Process Integration Engineering team, focusing on advanced semiconductor memory manufacturing technologies, including NAND, DRAM, and HBM devices. The intern will gain exposure to reliability concepts, fail

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Cost Engineer within MSH/ MSB Lean Manufacturing, you will be responsible for driving cost efficiency across High Bandwidth Memory (HBM), Component Assembly and Test, and SSD operations. You will collaborate with cross-functional teams to identify , implement, and govern cost improvement initiatives, ensuring alignment with site and network-wide financial goals. Main Responsibilities Manage and introduce cost improvement programs across manufacturing operations High-bandwidth Memory (HBM), Multi-Chip Packages (MCP ) and Low Power DRAM (LPDRAM) Component Assembly/Test/SSD . Perform month-end close activities and driv