Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the DRAM Technology Development team at Micron, pushing the limits of memory scaling and performance. Our work spans cutting-edge lithography and tight collaboration across integration, etch, deposition, and CMP to bring new nodes to life. If you enjoy solving complex patterning challenges on advanced tools including EUV we’d love to have you! In this role, you will lead photolithography process development for next-generation DRAM. You’ll own process modules, drive roadmap decisions, and translate concept to manufacturable solutions on pilot lines and into high-volume fabs. This is a hands-on, high-impact position working closely with cross-functional teams and equipment/material partners! Responsibilities: Develop and optimize photo processes to meet device physical and electrical requirements while reducing cost and variability Lead a lithography module; create manufacturing-friendly solutions across 365nm, 248nm, 193i, and EUV Partner with integration and unit process teams; drive vendor engagement for new materials and equipment solutions Analyze failures and process limits; perform root cause and DOE-based improvements Document plans, results, and drive transfer to production fabs Minimum Qualifications: Bachelor’s degree in engineering, physics, or related field and 7+ years of semiconductor experience, or MS/PhD with 6+ years in photolithography Deep knowledge of imaging
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Diffusion Process Development Engineer, you will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices! This position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness. The ideal candidate blends extensive expertise in diffusion processes, oxidation principles, and device physics with practical experience transitioning technologies from development to production. You will collaborate closely with groups dedicated to process development, device engineering, equipment, and manufacturing to support future technology nodes. This role requires work with AI for productivity. Key Responsibilities Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology. Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability. Drive process development from concept through integration, pilot qualification, and manufacturing transfer. Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds. Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability. Interpret electrical, physical, and materials characterization data to guide development decisions. Partner with external suppliers to develop hardware and processes aligned with future technology
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3+ years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative builds push the boundaries of future semiconductors. We seek a dynamic BEOL Process Integration Expert with proven experience in developing, transferring, and optimizing advanced DRAM technologies. Our team enjoys solving complex integration challenges and improving yield, reliability, and manufacturability. Known for technical leadership, strategic vision, and passion for semiconductor advancement, this role suits ambitious and determined candidates eager to make a big impact. Responsibilities In this role, you will need to have strong semiconductor Process Integration skills in an R&D department. You will be developing the future generation DRAM technologies. This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Define and implement BEOL process flows, build rules, and specifications for advanced DRAM products. Lead troubleshooting and resolution of complex integration issues spanning multiple modules and fields. Drive yield improvement and reliability enhancement initiatives using data-driven methodologies. Coordinate technology transfers, ensuring robust process qualification and rapid ramp to high-volume manufacturing. Engage in industry benchmarking and collaborative projects to maintain te
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The F15 ATE DIF Engineer is responsible for successful transfer achievement of new technode transferred from TD, Yield improvement/CT reduction/tool expansion toward TTMCY with great collaboration with TD/F15 all related Dept/DRAM network/MCT.Safety, Technology transfer to sister site & further new tech node transfer readiness are also our responsibility. As one of our team members, you should Understand site, department, area goals and set individual goals to achieve them with discussion with your SV. You are required to take a responsibility for process & workstation as owner and do all tasks assigned timely and accurately. You are also highly appreciated to work positively and show your ownership of all the tasks you are assigned. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-perfor
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, focused on building and scaling advanced wet process equipment that enables next-generation DRAM. We work closely with vendors, process teams, and manufacturing partners to bring new tools from concept to production. This team combines hands-on engineering with real impact on performance, cost, and sustainability! This role focuses on developing, optimizing, and sustaining liquid-phase processing equipment for advanced semiconductor manufacturing. You will work across R&D and manufacturing, solve hardware challenges, and drive tools to meet performance and reliability targets. The position offers strong ownership, multi-functional work, and exposure to tool development at scale. Responsibilities: Develop and optimize wet process equipment for advanced DRAM nodes Partner with vendors and internal teams to close hardware gaps Drive installation, qualification, and upgrades of new tools Apply data analysis to monitor tool performance and resolve issues Support process transfer from development to manufacturing Minimum Qualifications: Bachelor’s degree in mechanical, chemical engineering, or related field 3+ years of experience in semiconductor equipment or process engineering Knowledge of wet process equipment and semiconductor fabrication Experience fixing spin clean and drying systems Ability to analyze data and define problem statements <div
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ATE (Alpha Technology Engineering) - New Product Team Diffusion Process Engineer is responsible for the successful transfer and implementation of new technology nodes developed by the Technology Development team. The role focuses on improving manufacturing yield, enhancing operational efficiency, and supporting equipment capacity expansion through close collaboration with Technology Development, Fab15 departments, the global DRAM network, and manufacturing teams. Responsibilities also include maintaining a strong safety culture, supporting technology transfers to sister sites, and preparing for future technology node introductions. As one of our team members, you should Understand site, department, area goals and set individual goals to achieve them with discussion with your SV. You are required to take responsibility for process & workstation as owner and do all tasks assigned timely and accurately. You are also highly appreciated working positively and show your ownership of all the tasks you are assigned. Responsibilities and Tasks: Establish and improve process condition and technology. Upgrade process capability and r
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, focused on building and scaling advanced wet process equipment that enables next-generation DRAM. We partner closely with vendors, process teams, and manufacturing to bring new tools from concept to high-volume production. Our work blends hands-on engineering with real impact on performance, cost, and sustainability—making this an exciting place to shape the future of memory! In this role, you will develop, optimize, and sustain liquid-phase processing equipment used in advanced semiconductor manufacturing. You will work across R&D and manufacturing environments, solve complex hardware challenges, and help drive tools to meet aggressive performance and reliability targets. This is a high-ownership role with strong multi-functional exposure and direct impact on tool development at scale. Responsibilities: Develop and optimize wet process equipment for advanced DRAM nodes Partner with vendors and internal teams to resolve hardware gaps Drive installation, qualification, and upgrades of new tools Apply data analysis to monitor tool performance and solve issues Support transfer of processes from development to manufacturing Minimum Qualifications: Bachelor’s degree in Mechanical Engineering, Chemical Engineering, or related field 3+ years of experience in semiconductor equipment or process engineering Knowledge of wet process equipment and semiconductor fabric
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron research and development has an opening for Yield Analysis (DA) engineer to develop our next generation memory solution and to support production transfer for the next generation Micron products. As a DA engineer you will be responsible to characterize electrical data to identify and source out extrinsic and intrinsic device issues that are impacting yield. You will work closely with cross functional team from R&D and manufacturing to accelerate product to market timeline by applying device physics knowledge to develop end of line device performance prediction using machine learning. We need engineers who are passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict end of line device performance. Your responsibilities will include, but are not limited to the following: Analyze end of line test, parametric and fab data to identify design, process, and test issues that are impacting yield Develop new tools for yield analysis and implement machine learning technique to improve analysis efficiency and accuracy, leveraging artificial intelligence (AI) to improve proficiency. Identify new creative and innovative ways to use existing tools to identify relevant process issues or device failures Identify interactions between process modules and/or equipment to detect fail mechanisms Use the data collected inline to drive process improvements Improve yield by standardizing methods and
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development Group, where we turn advanced materials into manufacturable memory technology. Our thin films teams work at the groundbreaking edge of DRAM scaling, partnering across R&D, manufacturing, and suppliers to enable future nodes. We operate in a fast paced, hands‑on environment where strong fundamentals and execution matter! As a Thin Films Engineer, you will develop and integrate deposition processes that directly enable Micron’s next-generation DRAM! This role owns thin film concepts from early development through high‑volume manufacturing, with a strong focus on EUV patterning films. You will work closely with cross‑functional teams and external partners to deliver robust, scalable processes that meet aggressive technology requirements. Responsibilities: Develop, optimize, and transfer thin film deposition processes for EUV‑enabled DRAM technology Lead process characterization, troubleshooting, and defect reduction through VME Drive thin film roadmap activities aligned to future technology nodes Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions Analyze large physical and electrical datasets and communicate clear recommendations Minimum Qualifications: PhD or MS with 4+ years of semiconductor experience in materials or process development Strong foundation in materials science, chemical reaction engineering, and thin film physics H
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development Group, where we turn advanced materials into manufacturable memory technology. Our thin films teams work at the groundbreaking edge of DRAM scaling, partnering across R&D, manufacturing, and suppliers to enable future nodes. We operate in a fast paced, hands‑on environment where strong fundamentals and execution matter! As a Thin Films Engineer, you will develop and integrate deposition processes that directly enable Micron’s next-generation DRAM! This role owns thin film concepts from early development through high‑volume manufacturing, with a strong focus on EUV patterning films. You will work closely with multi-functional teams and external partners to deliver robust, scalable processes that meet aggressive technology requirements. Responsibilities: Develop, optimize, and transfer thin film deposition processes for EUV‑enabled DRAM technology Lead process characterization, troubleshooting, and defect reduction through VME Drive thin film roadmap activities aligned to future technology nodes Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions Analyze large physical and electrical datasets and communicate clear recommendations Minimum Qualifications: PhD or MS with 4+ years of semiconductor experience in materials or process development Strong foundation in materials science, chemical reaction engineering, and thin film physics H
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. F15 ATE ( Alpha Technology Engineering ) Photo エンジニアは、研究開発チームから移管される新技術の量産導入、良品率( Yield )の向上、サイクルタイム短縮を推進し、関連するすべての部門および DRAM ネットワークと連携しながら成果を創出する役割を担います。 また、 ATE Photo EUV フォトマスクエンジニアとして、最先端リソグラフィ工程で使用される EUV フォトマスクの品質・信頼性・運用健全性を確保する専門エンジニアリングチームの一員として活動します。 プロセスエンジニア、スキャナー装置エンジニア、その他の関係パートナーと密に連携し、フォトマスク認定、コンタミネーション管理、欠陥低減など、 EUV パターニング性能に直結する重要業務を主導します。 この役割は、広島サイト( Fab15 )における EUV プロセスの安定稼働に不可欠であり、技術調査・改善、データドリブンアプローチ、業務効率化を通じて、 EUV フォトマスクに関連するリスクを プロアクティブに管理すること が求められます。 The F15 ATE (Alpha Technology Engineering) Photo Engineer plays a key role in driving the successful transfer of new technologies from the R&D organization into high‑volume manufacturing, improving yield performance, shortening cycle time, and delivering measurable results through collaboration with all relevant departments and the global DRAM network. As an ATE Photo EUV Photomask Engineer, you will be part of a specialized engineering team dedicated to ensuring the quality, reliability, and operational integrity of EUV photomasks used in advanced lithography processes. You will closely collaborate with process e
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