Engineer Hbm Layout Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a build Engineer at Micron Technology, Inc., you will be responsible for crafting and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve design quality and manufacturability. You will coordinate with multi-functional partners to support tape‑out readiness and future technology scaling. This role offers hands‑on impact across the full semiconductor design flow. Responsibilities Contribute to new product opportunities by supporting overall circuit design, layout, and optimization for memory and logic or analog circuits. Perform parasitic modeling and support design validation, including reticle experim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Member of Technical Staff or Member of Technical Staff, DRAM Design Engineer in the next-generation HBM Architecture team, you will drive the architecture and optimization 3D-stacked, high-performance memories. Apply your knowledge to optimize DRAM designs and architectures for maximum performance, power, and area (PPA). This role is ideal for experienced DRAM designers who will identify, architect, design, and simulate next-generation architectures and memory features in collaboration with experts in stack architecture, memory systems architecture, and SoC microarchitecture. Responsibilities: Identify and develop novel DRAM circuit architectures that anticipate next-generation AI workload requirements, to unlock improvements in bandwidth and energy efficiency. Collaborate with peers to identify the highest-leverage DRAM circuit bottlenecks and define architectural hypotheses. Validate architectural hypotheses through schematic-level circuit design, SPICE simulation, and tradeoff analysis, establishing PPA feasibility. Partner with layout designers to conduct floorplanning studies. Colla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the design and own critical HBM analog circuits, including: High‑speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes‑related analog blocks Biasing, reference, and calibration circuits Power delivery and regulation circuits (LDOs, regulators) Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems Perform detailed pre‑layout and post‑layout simulations Conduct PVT, Monte Carlo, mismatch, and aging analyses Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance Review and sign off on analog layouts Drive layout‑aware build optimizations for advanced nodes <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of information into intelligence. The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions that power next-generation Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing applications. Our team brings together experts across design, validation, manufacturing, test, and quality to deliver industry-leading products through a highly collaborative and innovative environment. As a Design Validation Product Engineer, you will play a critical role in the development and validation of next-generation HBM products from design through qualification and high-volume manufacturing. This position provides the opportunity to work at the intersection of semiconductor design, silicon validation, hardware and software debugging, and data analysis while collaborating with multi-functional teams around the world. The level of responsibility will be aligned with a combination of education, experience, and demonstrated technical capabilities. Responsibilities Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts. Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis. Collaborate closely with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to id

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of information into intelligence. The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions that power next-generation Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing applications. Our team brings together experts across design, validation, manufacturing, test, and quality to deliver industry-leading products through a highly collaborative and innovative environment. As a Design Validation Product Engineer, you will play a critical role in the development and validation of next-generation HBM products from design through qualification and high-volume manufacturing. This position provides the opportunity to work at the intersection of semiconductor design, silicon validation, hardware and software debugging, and data analysis while collaborating with multi-functional teams around the world. The level of responsibility will be aligned with a combination of education, experience, and demonstrated technical capabilities. Responsibilities Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts. Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis. Collaborate closely with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to id

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout . • Interpret product specifications and design circuits to meet the required functionality. • Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators, DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory (HBM) products • Integration of modules with Power delivery network and propose design solution for optimum performance • Deep understanding of Array and its peripheral circuits. • Driving innovation into the future Memory generations within a dynamic work environment • Validate & optimize design for reliability (Device stress, Aging effect) • EM/IR simulation, optimize layout to achieve best circuit performance • Custom digital circuit design & validation • Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions • Overseeing and managing the layout process including floor-planning, placement, and routing • Performing verification processes with modeling and simulation using industry standard simulators • Contributing to cross group communication to work towards standardization and group success • Working wit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout. · Interpret product specifications and design circuits to meet the required functionality. · Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators , DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory ( HBM ) products · Integration of modules with Power delivery network and propose design solution for optimum performance · Deep understanding of Array and its peripheral circuits. · Driving innovation into the future Memory generations within a dynamic work environment · Validate & optimize design for reliability (Device stress, Aging effect) · EM/IR simulation, optimize layout to achieve best circuit performance ·

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You will evaluate block-level and full-chip functionality, perform architectural pathfinding, and contribute to the development of next‑generation high‑bandwidth DRAM solutions. This role works across diverse engineering teams to deliver functionally accurate, low‑power, and high‑performance HBM products by bringing to bear 3D stacking and TSV-based integration. Responsibilities • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high‑speed timing structures • Evaluate full‑chip and block‑level functionality and propose solutions to achieve correct circuit and system behavior • Perform timing, area, power, and complexity analysis for high‑speed DRAM and mixed‑signal circuits • Conduct pathfinding studies and feasibility analyses for future HBM architectures • Contribute to the development, layout, and optimization of memory, logic, and analog circuits • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation • Collaborate with multi-functional teams across build, verification, product engineering, process, and packaging • Support design reviews, documentation, and continuous improvement of design methodologies Minimum Qualifications • BSEE with 7&#43; years, or MSEE with 5&#43; years of releva

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design and CAD Enablement Own the development, deployment, and support of scalable CAD tools, automation frameworks, design flows, and methodologies for NAND, DRAM, HBM, SoC, mixed-signal, and other advanced semiconductor products. Develop, improve, and maintain infrastructure for circuit build capture, layout, simulation, characterization, implementation, physical verification, and signoff workflows. Create robust software and scripts using Python, Tcl, SKILL, Shell, Perl, C/C&#43;&#43;, Java, Lisp, or related languages to automate engineering workflows, analytics, and quality checks. Evaluate and integrate advanced EDA technologies, AI-assisted engineering solutions, and emerging methodologies to improve productivity, scalability, and silicon quality. Validated ability to demonstrate AI‑assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies Leverage AI tools to automate the tools and workflow Applying Artificial Intelligence in workflows to improve build efficiency undefined undefined Lead implementation and signoff activities across physical design, static timing analysis, and design for test for complex digital, memory, SoC, or mixed-signal products. Drive floor planning, power planning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification to meet power, performance, area, reliability, and sche

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Chip in to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop sophisticated capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5&#43; years of direct CAD or Design experience in mixed-signal, custom IC design flows. Proven experience w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next generation High Bandwidth Memory (HBM) architectures and circuit blocks. The HBM DFT Design Engineer is responsible for defining, designing, and integrating Design for Test (DFT) architectures for next generation High Bandwidth Memory (HBM) products. This role ensures robust test coverage across wafer, die, stack, and system in package (SiP) test stages while balancing performance, power, area, and manufacturing cost. The engineer works in a multi-functional manner with HBM build, verification, product engineering, test enablement, packaging, and external partners to deliver manufacturable, high quality HBM solutions. Responsibilities will include, but are not limited to: Define and implement HBM DFT architectures, including scan, MBIST, JTAG, boundary scan, TSV test, redundancy test, and at‑speed test structures. Develop DFT solutions for both base die and DRAM die, considering stacked‑die and cube‑level test requirements. Design and integrate test access mechanisms to support wafer probe, cube test, and SiP/system test flows. Collaborate with Product Engineering and Test Enablement teams to align DFT features with manufacturing test flows and cost targets. Support yield learning, failure analysis, and debug by enabling observability and controllability in silicon. Work closely with logic, analog, layout, verification, and physical design teams to ensure DFT is

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Contribute to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop advanced capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. applying Artificial Intelligence Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5&#43; years of direct CAD or Design experience in mixed

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role We are looking for a passionate and innovative ATE Test Engineer to design and deliver cutting-edge test solutions for HBM-DRAM devices using modern advanced ATE platforms. In this role, you will lead the development and implementation of test plans, ATE test programs, silicon validation, and test methodologies, while driving multi-site hardware design and development, product characterization, and high-volume production support. Success in this position requires a forward-thinking mindset and the ability to apply the right technologies to meet evolving challenges. Key Responsibilities Develop and implement robust test strategies, plans, and ATE programs for HBM-DRAM devices. Drive silicon validation, characterization, and yield improvement initiatives. Design and debug test hardware, including schematic capture and PCB layout. Collaborate cross-functionally to ensure seamless integration of test solutions into production. Support high-volume manufacturing and troubleshoot complex test issues. Qualifications & Skills Education: Bachelor’s or Master’s degree in Electrical, Electronics or Computer Engineering. Experience: A

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Lead end-to-end layout execution of analog, mixed-signal, custom digital blocks and full-chip integration for HBM products. Own full-chip technical decisions covering analog, digital, memory, ESD, EM/IR and ensure optimal performance, power, and area (PPA). Technical Expertise : Hands-on experience in layout design of critical Memory /Analog and mixed-signal blocks such as: Array Layout, Decoder, Control logic , IOs , PLLs , ADCs, DACs, LDOs, Bandgaps, Reference Generators, Charge Pumps, Current Mirrors, Comparators, and Differential Amplifiers. Drive project planning and execution , including area/time estimation, scheduling, task delegation, and milestone tracking across multiple concurrent programs. Ensure timely delivery with quality , responsible for block-level and full-chip layouts meeting schedule commitments and quality expectations. Perform and oversee layout verification activities including LVS, DRC, Antenna checks, and ensure closure with proper documentation and audits. Lead and mentor the layout team , guiding junior engineers on sub-block execution, conducting design reviews, and enabling capability development. Drive innovation and productivity improvements , including adoption of AI/automation to reduce layout effort, improve turnaround time, and enhance quality. <li