Field Security Specialist Jobs

About us At Graphcore, we’re building the future of AI compute. We’re a team of semiconductor, software and AI experts, with deep experience in creating the complete AI compute stack - from silicon and software to infrastructure at datacenter scale. As part of the SoftBank Group, backed by significant long-term investment, we are delivering key technology into the fast-growing SoftBank AI ecosystem. To meet the vast and exciting AI opportunity, Graphcore is expanding its teams around the world. We are bringing together the brightest minds to solve the toughest problems, in a place where everyone has the opportunity to make an impact on the company, our products and the future of artificial intelligence. Job Summary Reporting to Senior Director of Post Silicon Validation, the Debug Validation Engineer will drive post-silicon debug and validation activities for next-generation AI compute silicon and systems. You will lead teams passionate about identifying, reproducing, analyzing, and resolving complex silicon, firmware, and system-level issues during bring-up, characterization, and product readiness. This role combines deep technical debugging expertise with strong cross-functional collaboration across multiple engineering fields. The Team The Post-Silicon Debug and Validation team manages bring-up, fault diagnosis, and validation of Graphcore silicon and systems. Our team participates throughout the entire product lifecycle, supporting initial silicon bring-up, subsystem validation, system integration, and production readiness tasks. We coordinate closely with hardware, firmware, software, and systems teams to examine complex failures, develop debug strategies, and advance validation infrastructure. Responsibilities and Duties Lead post-silicon debugging and validation efforts for AI compute silicon and platform technologies Contribute to debug and validation activities across multiple projects and achievements Analyze and address intricate sili

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts Experience with wafer probe and fin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High Bandwidth Memory Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. We bring architecture and physical implementation together to shape products that are efficient, manufacturable, and ready for demanding applications! As a Custom Layout Architecture Engineer , you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. You will work with design, architecture, process, verification, and product engineering teams to balance performance, power, area, routability, and manufacturability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools Build scripts and automation that improve layout quality, verification, and design-cycle time Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field 4+ years of semiconductor physical layout experience with a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team delivers best‑in‑class yield, quality, and cycle time through innovation and strong cross‑functional teamwork. Supporting diverse DRAM and NAND technologies across global development and manufacturing sites (Boise, Japan, and fabs in the U.S., Taiwan, Japan, and Singapore), the team identifies, aligns, and deploys best‑known methods across the network. As a Frontend Central Process Integration Senior Engineer, you will develop and optimize processes to drive rapid product maturity. Join us today and make a difference! Responsibilities and Tasks Drive rapid product maturity, improving yield (bits per wafer), repair density, and DPM through fast learning cycles. Apply deep process integration knowledge across FEOL, MOL, CELL, and BEOL to identify optimal solutions; design and circuit knowledge is a plus. Partner with Yield Engineering, Device, RDA, and Metrology teams to resolve key yield issues and build strong inline visibility for fast ramp and excursion prevention. Identify and standardize best‑known methods and business processes across DRAM and NAND sites. Travel to Micron sites as needed for onsite collaboration. Minimum Qualifications Bachelor’s degree in Engineering or a related field 5+ years of experience in process integration, product design, or equivalent technical roles Demonstrated ability to collaborate optimally with global, cross‑functional teams Proven t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project Title: - Support Autoshell host enablement for Enclosure Attach Scope: - Perform system setup to enable autoshell host for tools in Enclosure Attach Processes. - Perform user acceptance testing (UAT) and data analysis - engage with cross functional team (engineering, IT, manufacturing, tool vendor) for setup and testing - prepare standard operating procedures and provide training Supporting Team: - Process & Equipement Engineering team - IT team - Manufacturing Team Deliverables: - able to enable tool communication with host - able to perform and complete UAT - Data collection and analysis - able to write SOP and provide training to mfg team Stretch Goal: - Able to enable host automation for Enclosure Attach. - Able to improve process control for Enclosure Attach. Requirement: - Bachelor of Computer science & engineering - Bachelor of IT engineering - Any related engineering field About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Cruci

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. You will contribute to innovative silicon-to-systems solutions, spanning technology development, advanced memory design, product development, systems design, and validation. This role requires collaboration with global multi-functional teams including invent, verification, product engineering, test, probe, process integration, assembly, and marketing. You will provide high-quality, efficient, and reliable memory solutions that optimize time-to-market and promote strong customer happiness. Responsibilities Contribute to new product development by supporting circuit design, layout, and optimization across memory, logic, and analog domains Assist with parasitic modeling, design validation, reticle experiments, and tape-out revisions Oversee layout activities including floor-planning, placement, and routing Perform circuit verification using modeling and simulation tools with industry-standard simulators Collaborate multi-functionally to support manufacturability, standardization, and overall product success Minimum Qualifications Bachelor’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or a related field Familiarity with digital and/or analog circuit design concepts Experience with circuit simulation and modeling tools Understanding of semic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are a team focused on advancing semiconductor manufacturing through innovative process development! Our work spans materials science, thin film deposition, and high‑volume manufacturing, enabling scalable, reliable technologies for next-generation devices. As a Process Engineer, you will play a key role in developing, optimizing, and sustaining manufacturing processes that directly impact product quality, yield, and cost. This role offers hands-on involvement in solving sophisticated production challenges, introducing new technologies, and collaborating across engineering and supplier teams to drive measurable improvements. Responsibilities: Diagnose and resolve assembly process issues using FA, FMEA, 8D, and SPC/FDC methodologies Execute process, equipment, and material evaluations; implement process step improvements Lead yield improvement and cost reduction initiatives Qualify and scale new processes, tools, and materials for production Manage supplier quality, audits, and risk mitigation activities Minimum Qualifications: PhD in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or related field Experience with thin film deposition techniques such as ALD, CVD, or PVD Knowledge of surface analysis methods (XPS, AFM, XRD, AES, EBSD, SIMS) Understanding of solid-state physics, materials, surfaces, and interfaces Proven ability to collaborate and comm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are building a global Process Safety function that directly supports the next generation of memory technology. Our team partners across development, manufacturing, and EHS to ensure complex processes scale safely and consistently. If you’re energized by solving high-impact challenges and shaping global safety programs, you’ll find meaningful work here. In this role, you will help drive the Risk-Based Process Safety (RBPS) framework for High Bandwidth Memory (HBM) technologies. You’ll work across global teams to identify and handle safety challenges associated with processes in fast-paced development and manufacturing environments. Your expertise will influence how new technologies are safely developed, transferred, and scaled worldwide. Responsibilities: Lead RBPS governance and drive consistency across sites supporting HBM processes Partner with engineering and manufacturing teams to identify, assess, and mitigate process safety risks tied to new materials and complex processes Support Management of Change (MOC), ensuring timely risk assessments and closure of actions for tool, chemistry, and process changes Facilitate hazard analyses, audits, investigations, and share findings to improve system-wide performance Develop clear updates and guidance for leaders on process safety risks, trends, and program health Minimum Qualifications: Bachelor’s degree in Chemical Engineering, Safety, Industrial Hygiene, or related field 5+ years of experience in process e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Boise, we are undergoing a historic $15B investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. We are looking for engineers who want to help drive innovation and operational excellence in advanced memory manufacturing. As an Implant Equipment Engineer , you will own the reliability, performance, optimization, and sustainment of ion implantation equipment supporting high-volume manufacturing. You will partner closely with process, integration, yield, manufacturing, and vendor teams to ensure robust tool performance, equipment availability, and safe execution in a fast-paced fab environment. Responsibilities Own ion implantation equipment performance and sustainment, including tool health metrics, maintenance strategies, and operational standards Drive equipment uptime, reliability, and defect reduction through data analysis, SPC, and structured root cause methodologies Lead equipment change reviews, risk assessments, qualifications, and implementations for new tools, upgrades, and hardware improvements Collaborate with process engineering, integration, manufacturing, and vendors to align equipment capability with production requirements Improve equipment productivity and operational efficiency through innovative automation, monitoring, and predictive maintenance solutions Minimum Qualifications Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Chemical, Materials, Physics, or related fiel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As an MTS Design Verification Engineer, you will serve as a technical leader driving innovation in DRAM verification for advanced memory products. This role focuses on leading design and verification strategy, influencing key technical decisions, and ensuring high-quality, functionally correct, and scalable memory solutions. You will collaborate with global teams, guide methodology improvements, mentor engineers, and act as a domain expert to support next-generation DRAM technologies. Responsibilities Lead DRAM verification innovation, driving key technical decisions, architecture, and strategy during product execution Collaborate with global teams to define and implement best-known methods for verification and product development Drive verification planning, coverage closure, and silicon debugging for advanced DRAM products Evaluate and implement new tools, methodologies, and flows to improve verification efficiency and quality Mentor engineers and provide technical leadership while contributing expert guidance to senior leadership teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field 8+ years of experience in DRAM/memory or advanced CMOS verification Strong circuit analysis and debug skills at the transistor level — able to root-cause behavior, not only at the testbench level Experience with simulation tools such as HSPICE, Finesim, Verilog, or SystemVe

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3+ years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology group at Micron Technology develops and validates advanced memory solutions that enable the transformation of information into intelligence. The team operates in a collaborative, inclusive, and globally distributed environment, partnering closely with design, product, test, process, manufacturing, and quality organizations to deliver industry‑leading DRAM technologies. The Design Validation Product Engineer supports the validation of new DRAM products by focusing on real‑silicon behavior through bring‑up, characterization, and debug. This role builds a strong technical foundation in DRAM architecture, semiconductor devices, and validation methodologies while working closely with multi-functional engineering teams. Responsibilities Support DRAM design validation through silicon bring‑up, characterization, and validation testing of new memory products Analyze electrical and functional data to identify trends, marginalities, and failure mechanisms Assist with debug of validation issues using simulations, test results, and laboratory measurements Use engineering lab equipment and testers to characterize device behavior and performance Document validation results, test coverage, and observed behaviors while collaborating with design, test, manufacturing, and quality teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field Strong fundamentals in digital logic,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data ‑ driven root ‑ cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing solutions that shape the future of memory products in a fast-paced, learning-focused environment. As a Design Verification Engineer, you will help develop next-generation memory technologies by verifying and optimizing digital and analog circuit designs. In this role, you will work closely with global multi-functional teams across the product lifecycle to deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Your work will directly contribute to bringing advanced memory products from concept to production. Responsibilities: Verify circuit functionality, reliability, power, and compliance with product specifications Drive verification planning, coverage closure, circuit debug, and design improvements Perform circuit modeling and simulation using industry-standard tools Support silicon validation, reticle experiments, and tape-out activities Partner with engineering, manufacturing, and product teams to deliver manufacturable designs Minimum Qualifications: Bachelor’s degree in Electrical Engineering or a related field 4+ years of semiconductor design, verifi