Hbm 3d Power Delivery Network Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network. Main Responsibilities Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work. Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualific

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact the future of memory technology! You will be working in an ambitious environment with a team of world-class engineers to build and analyze digital, analog, and mixed-signal circuits for advanced memory products. Our collaborative approach ensures flawless solutions and innovation, driving the success of future memory generations. Responsibilities Contribute to the development, optimization, and layout of Memory, Logic, and Analog circuits for next-generation memory products. Perform parasitic modeling and support build validation, reticle experiments, and required tape-out revisions. Coordinate and guide the layout process including floor-planning, placement, routing, and physical integration. Conduct circuit modeling and simulation using industry-standard tools to verify timing, functionality, and reliability. Collaborate across CAD, modeling, standards, and verification groups to align with best-known-methods and improve build quality. Partner with Probe, Test, Product Engineering, Assembly, Marketing, and Process Integration to ensure accurate manufacturability and product readiness. Support cross-team communication to promote standardization, consistency, and shared engineering success. Propel innovation through contributions to methodologies, architectures, and technologies for upcoming memory generations. Minimum Qualifications Bach

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Guide junior team-members in their execution of Sub block-level layouts & review their work Cont

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Create optimi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next ‑ generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best ‑ in ‑ Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device ‑ and stack ‑ level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design ‑ For ‑ Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross ‑ functional partners—including Fab, Product Leads, Design Engineeri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal HBM RTL Designer, you will serve as a technical leader driving the front‑end digital design of next‑generation High Bandwidth Memory (HBM) products. This role requires deep expertise in RTL architecture, build methodology, and multi-functional technical leadership. You will own complex design blocks end‑to‑end—from architectural definition through production‑quality implementation—while mentoring engineers, influencing design strategy, and ensuring world‑class design execution. Responsibilities: Define, architect, and lead the development of advanced RTL blocks for HBM subsystems, ensuring alignment with product requirements and architectural goals. Own end‑to‑end front‑end design, including micro‑architecture, RTL development, simulation strategy, and design quality. Drive technical decisions across circuit development, synthesis, constraints, and physical‑design integration, ensuring timing, power, and area compliance. Champion design methodologies, develop reusable frameworks, and improve RTL design flows, validation strategies, and sign‑off processes. Collaborate closely with physical design, verification, architecture, and product engineering to integrate subsystems and deliver high‑quality silicon. Lead root‑cause analysis and corrective actions for complex design issues, ensuring long‑term design robustness. Communicate effectively at all levels, contributing to technical planning, project execution, and cross‑organizational alignment. Minimum Qu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities: Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products,

Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Engineer, HIG-HBM Product System & Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Engineer, HIG HBM Product & System Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.