Hbm Advanced Package Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High Bandwidth Memory Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. We bring architecture and physical implementation together to shape products that are efficient, manufacturable, and ready for demanding applications! As a Custom Layout Architecture Engineer , you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. You will work with design, architecture, process, verification, and product engineering teams to balance performance, power, area, routability, and manufacturability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools Build scripts and automation that improve layout quality, verification, and design-cycle time Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field 4+ years of semiconductor physical layout experience with a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Handle several tasks at once and bring them to completion within the specified timeframe. Accurately examine and interpret production data to pinpoint and address abnormal issues. Collaborate with other departments to solve problems and improve production processes. Apply Generative AI to improve the efficiency of daily work. Carry out research to analyze process changes and propose improvements or alterations to equipment. Minimum Qualifications: Demonstrated skill in analyzing and interpreting data with precision. Demonstrated excellence in team building, mentoring, and coaching. Strong problem-solving skills and the ability to find solutions to improve production. Skill in managing several assignments concurrently and completing them on time. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits Requirement: 1 years of experience in semiconductor manufacturing, packaging, or assembly processes. Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses infor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Bachelor's degree or above in Engineering disciplines, such as Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, Industrial Engineering, Physics, or related fields. • Fresh graduates or candidates with less than one year of working experience are welcome to apply. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits • Work methods that include AI capabilities or are empowered by AI, Using Artificial Intelligence, Applying Artificial Intelligence and Leveraging Artificial Intelligence. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leader

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities Yield Loss Accounted For Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode Work closely with PI to identify defect that is coming from their area to brainstorm for CIP Learn NPI processes, phase gates, and yield best practices Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss Yield Deviation Control Analyze and report on yield deviation issue and trigger action from PI, PE or RDA Support block run and partial conversion build yield analysis to early detect any impact on yield Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring Yield Improvement Opportunities Brainstorm with staff from other departments to brainstorm for improvement opportunities to propose to PI Utilize software tool like Auto-diagnostics to find yield improvement opportunities Integrating Artificial Intelligence Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements Contributes to a culture of continuous improvement by identifying, testing, and sha

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a member of the HIG HBM Media Health HVM team, you will embody an outstanding approach to Next Generation HBM Product driven by important metrics: Quality, Cost, Cycle Time, and Scale. You will work closely with various teams within and outside of HBM to achieve strategic and operational goals. Key Responsibilities Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing. Encouraging Innovation: Motivate innovation and inspire changes that will help Micron maintain a technical advantage over its competition, ensuring Micron’s competitive edge in the market. Product Development and Validation: Develop, validate, characterize, and qualify Micron’s next-generation HBM products, ensuring reliability and market readiness. Support for New Product Design Validation: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations. Yield Improvement and Cost Reduction: Improve manufacturing test yields, reduce test time, and resolve yield-related issues, contributing to cost reduction and meeting yield targets. Root Cause and Resolution of Qual and RMA Device Issues: Identify and resolve issues related to device qualification and return material authorization, ensuring product quality. Process Conversions and HVM: Recommen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks Your main task will be operating Equipment. Manning of multiple machines Demonstrate ability to use computer based programs and applications to perform daily duties Provide machine coverage during breaks Logging machines accurately Monitoring and awareness of equipment performance discrepancies with timely communication to your Lead Working hours are 12 hours shift with biweekly rotation for day and night. Use Generative AI to enhance daily work quality Ensure Quality of Process and Product Run equipment based on current process specifications (e.g. procedures, change notifications, etc.) Organize own workstations and ensuring 6S Make suggestions to improve quality and safety Complete Certification and Recertification Participate actively in assigned on-the-job and other required training; asking questions to increase knowledge and abilities Complete certification requirements by demonstrating understanding and abilities Communication Information Receive and understand pass down, providing clear, accurate, and detailed pass down Seek and provide feedback to leadership, coworkers, and support groups to make positive changes in performance Offer suggestions for improvements when appropriate Always seek clarification when in doubt Contribute to a Safe and Compliant Work Environment Identify and promptl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, as well serializing and de-serializing scheme. You will collaborate with a highly creative and motivated development team applying brand-new memory technologies to build groundbreaking HBM products! Responsibilities: Responsible for the high-speed DRAM and Base die interface in HBM cube. Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface. Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG Collaborate with data path design on floor planning and full chip testbench. Analyze timing/area/power in high-speed DRAM or mixed-signal design. Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits. Qualifications: Extensive experience with DRAM operation and JEDEC specifications across DDR, LPDDR, GDDR, and HBM product families. Strong technical expertise in analog and mixed-signal circuit design. Hands-on proficiency in DRAM command decoding, bank logic, and RAS/CAS chain design. Demonstrated innovation and problem‑solving capabilities in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications! Our ultimate goal is to deliver the lowest power per bit solutions in the industry! Position Overview: We are searching for an HBM IO Design Architecture Engineer. This role will focus on HBM IO / TSV IO design and analysis including electrical modeling, Signal Integrity (SI) and Power Integrity (PI) analysis, and design optimization across the HBM development cycle. The ideal candidate brings hands-on experience in design execution, simulation to silicon correlation, and cross-functional methodology development, and embraces AI-driven analysis and data-driven decision making to accelerate quality improvement cycles. Responsibilities will include, but are not limited to: High-speed IO design architecture for HBM products Define and standardize IO design quality process from architecture to silicon Define IO architecture, TSV IO performance targets, and design quality requirements for future HBM products. Develop IO and TSV modeling methodologies to support architecture tradeoff analysis, SI/PI evaluation, and design optimization. Drive simulation-to-silicon correlation and post-silicon learning feedback to improve design quality across HBM product generations. Leverage AI Assisted analytics to accelerate root cause identification from comp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Memory Systems Architecture team defines the next generation of High Bandwidth Memory (HBM) solutions that power artificial intelligence, high-performance computing, and data center applications. The team drives architectural innovation across memory systems, controllers, interfaces, and reliability features to deliver industry-leading performance, scalability, and efficiency for future computing platforms. As a Memory Systems Architecture Intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work alongside experienced architects to evaluate new memory features, analyze architectural trade-offs, develop performance models, and explore solutions that improve memory performance, reliability, and efficiency for AI and high-performance computing workloads. Responsibilities Research and evaluate next-generation HBM architecture and microarchitecture features, including memory scheduling, refresh management, reliability features, thermal behavior, and memory controller interactions. Develop and enhance performance models, simulators, and analytical tools using Python, C++, or similar technologies to assess architectural trade-offs and system performance. Analyze workload behavior, simulation results, and architectural data to provide recommendations for future HBM product development. Utilize AI-assisted engineering tools and workflows to accelerate software development, specification analysis, data exploration, and technical documentat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications! Our ultimate goal is to deliver the lowest power per bit solutions in the industry! Position Overview: We are searching for an HBM IO Design Architecture Engineer to build and own the end-to-end design quality system — including design checklist delivery, silicon data analysis, and cross-team data collection framework — ensuring that silicon learnings are systematically captured and fed back into the project before the next generation design is finalized. The ideal candidate brings hands-on experience in design execution, simulation to silicon correlation, and cross-functional methodology development, and embraces AI-driven analysis and data-driven decision making to accelerate quality improvement cycles. Responsibilities will include, but are not limited to: High-speed IO design architecture for HBM products Define and standardize IO design quality process from architecture to silicon Work with Product Engineering to correlate silicon measurements and simulation performance for circuit level design analysis Contribute to cross group communication to work towards standardization and group success Proactively solicit input from Standards, CAD, m