Hbm Advanced Package Sr Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a HIG IE Engineer, your responsibilities encompass tactical execution and planning to support tactical pillar, CAPEX and OCAP budget management, material planning for wafer probe C1-C4 to Micron IQP, build Business Processes to enable wafer level activities. Also to work as a window for wafer PRIME, pWLR and DOE material acquisition, drive sample deliveries to execution for Wafer Reliability and IQP Reliability. You are also expected to understand procurement of items, inventory logistic management, audits, continual improvements, 6S housekeeping, and project management. It is a must for a HIG PSE IE Engineer to be familiar with Claude Code, AI apps and leveraging AI for work productivity and quality improvements. Responsibilities include, but are not limited to: Able to utilize Claude Code and AI apps in regular work. Proven creation of Claude Code apps (Advantageous with more than one creation) Have clear knowledge of HBM wafer probe operations starting from Assembly to post C4. Have clear knowledge of wafer material acquisition from FE processes. Liaison with NPO, SIC, NPI teams from F15 and OMT. Have knowledge in MES/MAM attributes, tagging of lots from AAA, DAA and NAA lots. Familiar with CBG setting to ensure engineering wafers are not mixed with MFG wafers. Able to track E2E DOEs requests from start to CRD/MAD. Work closely with requestors on process needs. Able to work as a team with fellow members in a safe, cohesive, and collabo

HBM Assembly Capacity IE Manager — Taichung - MTB, Taiwan. Apply via Workday.

HBM Talent Pool – Engineering, Manufacturing (HBM人才專區-台中后里) — 2 Locations. Apply via Workday.

HBM Customer Systems Validation Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.

HBM製程輪班工程師 HBM Shift Process Engineer — Taichung - MTB, Taiwan. Apply via Workday.

HBM SOC Design Engineer — Richardson, TX. Apply via Workday.

HBM Equipment Technician 輪班助理工程師 — Taichung - MTB, Taiwan. Apply via Workday.

HBM ASSEMBLY PRODUCTION SUPERVISIOR — Taichung - MTB, Taiwan. Apply via Workday.

HBM SoC Physical Design Engineer — Richardson, TX. Apply via Workday.

HBM IO Architecture, Principal Engineer — Richardson, TX. Apply via Workday.

HBM Customer Systems Validation Engineer — 2 Locations. Apply via Workday.

HBM SoC Physical Design Engineer — Richardson, TX. Apply via Workday.

HBM Engineering Technician — Taichung - MTB, Taiwan. Apply via Workday.

HBM SoC RTL Design Engineer — Folsom, CA. Apply via Workday.