Hbm Mrda Shift Process Engineer Jobs

New College Grad - Mixed Signal Design Engineer, HBM — Richardson, TX. Apply via Workday.

New College Grad - Design Engineer, HBM DFT — Richardson, TX. Apply via Workday.

Engineering Execution Manager, HIG High Bandwidth Memory (HBM) — Fab 10A, Singapore. Apply via Workday.

New College Grad - Memory Design Engineer, HBM — Richardson, TX. Apply via Workday.

SoC Static Timing Analysis (STA) Engineer, HBM — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and cov

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Senior/Staff Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal/Snr/Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a key team member within the HIG HBM Product Engineering Advanced Data Analytics team, you will be spearhead and develop a high-performing team to drive initiatives that significantly enhance yield and quality through advanced data analysis, machine learning, and AI. Your responsibilities will include developing cutting-edge algorithms, creating robust product disposition solutions, and establishing a proactive deviation alert system for yield and quality, enhancing data infrastructure, mentor team members, and fostering innovation to maintain a competitive edge. You will also collaborate with cross-functional teams within and outside of HBM to achieve both strategic and tactical objectives, continually maximizing the effectiveness of the HIG HBM PE organization, focusing on critical KPIs such as quality, cos

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Member of Technical Staff, SoC Power and Physical Architect in the Next-generation HBM Architecture Team, you will drive SoC-level specification 3D-stacked, high-performance memories. Apply your knowledge to analyze SoC trade-offs in close collaboration with peer architecture and design teams. Drive power architecture, physical planning, and early SoC design activities, including definition of IP interfaces (e.g., signals, power delivery), clocking, power sequencing, design-for-test, floorplanning, and specification development. Responsibilities: Define clocking architectures, power sequencing, power delivery, and on-die signal interfaces. Define and analyze on-die power delivery networks (PDN) and full-chip thermal implications, including power hot-spot identification and mitigation. Define DFT architectures (e.g., scan chain topology) and set verification requirements. Define SoC floorplans in collaboration with physical designers. Compose and maintain clear SoC physical documentation. Preferred Qualifications: Experie

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.