Hbm Mtb Ai Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Location: Richardson, TX We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities · Lead the design and execution of sophisticated memory subsystems and top-level integration activities. · Own design planning, technical decision-making, risk assessment, and schedule execution. · Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. · Review design specifications, microarchitecture documents, and implementation plans. · Drive memory array design, including address decoders and data path, internal power supplies, and custom circuit design activities depending on project needs. · Lead design reviews and drive issue resolution across organizations. · Guide engineers who are developing their skills and provide technical leadership to project teams. · Define and improve building methodologies by applying AI-enabled tools, automation, and guidelines. · Support silicon bring-up, debug, characterization, and yield improvement activities. · Communicate project status, risks, and mitigat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Building, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor early-career engineers and provide technical leadership to project teams. Define and improve develop methodologies applying AI-enabled tools, automation, and standard processes. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction At Micron's High Bandwidth Memory (HBM) team, we develop advanced memory solutions that enable next-generation artificial intelligence and high-performance computing applications. We collaborate across global engineering teams to deliver innovative semiconductor technologies that help transform how the world uses information. Join us and help build the future of memory innovation! Position Overview As a Layout Build Engineer within the HBM organization in Guadalajara, Mexico, you will develop and integrate analog, mixed-signal, and custom digital layouts for advanced memory solutions. You will support physical build implementation, verification, and project execution while collaborating with global engineering teams to deliver high-quality layouts on schedule. This role contributes directly to AI-enabled and high-performance computing products through efficient and reliable layout development. Responsibilities Develop analog, mixed-signal, custom digital block layouts, and support full-chip integration activities. Perform layout verification activities, including Build Rule Check (DRC), Layout Versus Schematic (LVS), antenna checks, quality reviews, and documentation. Deliver block-level layout builds on schedule while meeting established quality requirements. Lead layout planning, area and schedule estimation, task delegation, and execution across multiple concurrent projects. Work together with international engineering groups to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer Job Description As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3 , Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to apply AI to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase f

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications! Our ultimate goal is to deliver the lowest power per bit solutions in the industry! Position Overview: We are searching for an HBM IO Design Architecture Engineer to build and own the end-to-end design quality system — including design checklist delivery, silicon data analysis, and cross-team data collection framework — ensuring that silicon learnings are systematically captured and fed back into the project before the next generation design is finalized. The ideal candidate brings hands-on experience in design execution, simulation to silicon correlation, and cross-functional methodology development, and embraces AI-driven analysis and data-driven decision making to accelerate quality improvement cycles. Responsibilities will include, but are not limited to: High-speed IO design architecture for HBM products Define and standardize IO design quality process from architecture to silicon Work with Product Engineering to correlate silicon measurements and simulation performance for circuit level design analysis Contribute to cross group communication to work towards standardization and group success Proactively solicit input from Standards, CAD, m

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal Engineer, you will be a senior technical authority who owns complex validation scopes, optimizes test flows, and leads technical problem solving for next generation HBM products. You’ll drive coverage completeness, improve detection efficiency, and mentor junior engineers—ensuring flawless product readiness through deep platform, Verilog simulation, and analysis expertise. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient IQP/ETV material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time. Guarantee coverage completeness across MBIST and flows; drive Hot/Cold corners , TSV screen/AQLK , async timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on SM3/Cobra and Advantest V93K ; enforce code quality, reviews, and r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions for AI, machine learning, and high-performance computing applications. We are seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products. This role focuses on PHY IO architecture, timing methodology, analog calibration schemes, and silicon learning frameworks that enable industry-leading bandwidth, power efficiency, and robustness. The successful candidate will collaborate across Design, Product Engineering, Modeling, Verification, Packaging, and System Architecture teams to define architectural requirements, drive technology innovation, and ensure successful translation from concept to silicon. As a technical leader, you will influence future HBM roadmap decisions, develop engineering methodologies, and mentor design teams on architectural principles, calibration strategies, and best practices for high-speed IO design. Key Responsibilities Define and drive next-generation HBM PHY and IO architecture , balancing performance, power, area, reliability, and manufacturability requirements. Architect high-performance transmit and receive paths , including clocking, signaling, equalization, timing alignment, and interface optimization. Define and optimize analog calibration architectures , including impedance calibration, reference v

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time. Guarantee coverage completeness across Validation flows; drive Hot/Cold corners , screen , timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on ATEs like Advantest and In-house ATE; enforce code quality, reviews, and release discipline. Align hardware configs ( handler, socket, loadboard, probe card ) to test intent and throughput targets. Advanced Analysis, Verilog Simulation & Automation Perform power/thermal characterization ; correlate IDD/thermal data with performance/reliability; author recommendations for content changes and silicon fixes. Architect and execute Verilog simulations (bench cre

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities Responsible for Design and development of critical Design and Co-optimization objectives, mixed-signal, custom digital block and full chip level integration support. Build and tapeout PWF Reticles Design Engage with Scribe Design team to capture Advanced Packaging requirements and Review TSV design engagement with HIG-HBM DTPCO teams (electrical , thermal and mechanical performance) Creation and Maintenance of DFMEA related to advanced packaging process steps like PWF, die stacking etc Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Title: Principal Engineer – HBM Verification Location: Hyderabad, India Experience : 12+ years in Design Verification (experience with Pre-Silicon Verification OR DDR/GDDR/LPDDRmemory/SerDes PHY IP Verification is preferred) Role Description Join the Micron HBM team where you will drive verification architecture for next-generation HBM, ensuring robust methodologies and sign-off strategies. This role is perfect for a hands-on silicon verification expert who is passionate about developing best-in-class verification methodologies, testbench design, AI enabled verification and developing novel solutions to improve quality and efficiency of verification workflows. Key Responsibilities Define and drive verification architecture and methodology for next generation HBM designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Apply Formal Verification techniques for critical Collaborate strictly with build teams to ensure verification completeness and quality. Mentor a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description About the Position We are seeking a recent graduate with a strong foundation in electronics and a passion for technology to join our Design Verification team. In this role, you will contribute to the verification of advanced pre-silicon memory solutions, including High Bandwidth Memory (HBM) and emerging memory technologies. You will collaborate with experienced engineers while developing technical expertise in semiconductor design and verification. Responsibilities Provide verification support for circuit designs by simulating, analyzing, and debugging pre-silicon full-chip designs. Develop and maintain test benches and test cases to improve verification coverage of HBM and emerging memory architectures and features. Participate in the development of verification methodologies and test plans for advanced HBM and emerging memory products. Collaborate with engineering teams to identify and resolve design and verification issues. Support automation initiatives and contribute to process improvements through the application of AI technologies. Minimum Qualifications Bachelor’s, Master’s, or PhD degree in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or a related field. Graduated within the last two years from a Bachelor’s, Master’s, or PhD program.</sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on