Hbm Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron combines the brightest minds in the business with the world’s broadest memory portfolio of memory and storage technology, creating technology that leading global brands use to make computing faster, travel safer, healthcare more effective, and much more, addressing the world most challenging needs. Micron’s Customer Engineering Department plays a critical role in the company’s worldwide operations. With a career at Micron, you’ll be contributing your expertise to connect our customers with the industry’s most forward-thinking team to help reshape information, communication, and innovation around the globe. As an High Bandwidth Memory (HBM) Field Applications Engineer at Micron, you will be part of a high integrity, best-in-class customer engineering team ​responsible for strengthening technical partnerships, ​inspiring Micron and our customers to deliver ​the best possible products, and maximizing revenue​​. Responsibilities will include, but not limited to, the following: High Bandwidth Memory (HBM) Program alignment/expansion with key Micron customers, assist with Micron’s HBM qualifications, and Technical Opportunity management with our HBM customer engagements Extend/grow technical relationship with key HBM customers as the local execution and escalation point of contact Work with the Micron and customer qualification labs to complete qualification and debug any iss

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a SoC Architecture and Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the architecture, design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, design, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role for candidates passionate about architecture, RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Architect, design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Architect and design memory sub-systems including memory IP selection and integration, bus and protocol selection, and power/performance/area optimization. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Trans

About the Team OpenAI’s Hardware organization is building the infrastructure foundation for frontier AI systems. The Supply Chain organization is responsible for enabling scalable, resilient, and efficient supply chains across custom silicon, systems, networking, memory, storage, and rack-scale infrastructure. The Supply Chain Program Manager (SCPM) drives end-to-end material readiness and supply chain execution across the hardware lifecycle, from early architecture and sourcing strategy through production ramp and sustaining operations. We are looking for experienced supply chain leaders who can operate across technical, commercial, and operational domains to ensure material readiness, supply continuity, and execution excellence for complex AI hardware programs. About the Role As a Supply Chain Program Manager, you will own material readiness and supply chain execution for critical hardware programs spanning custom silicon, systems, memory, storage, networking, and rack infrastructure. You will work cross-functionally with Engineering, Strategic Sourcing, Manufacturing Operations, Finance, Planning, Quality, and external suppliers to develop and execute scalable supply strategies that support aggressive product development and deployment timelines. This role requires deep understanding of hardware supply chains, material planning, NPI execution, supplier management, and operational scaling in constrained and rapidly evolving environments. Responsibilities Material Readiness & Supply Planning - Own end-to-end material readiness across NPI and production phases, including building the necessary framework and processes for enablement. Drive supply planning and execution for long lead-time and constrained commodities including ASICs, HBM, DDR, SSDs, networking, optics, power, thermal, and mechanicals. Build and manage material readiness plans aligned to proto/pre-EVT, EVT, DVT, PVT, and mass production schedules. Monitor supply health, lead times, inventory positio

About the Team OpenAI’s Hardware organization develops system and infrastructure solutions optimized for advanced AI workloads. We collaborate across research, software, and external hardware partners to design and deploy next-generation AI systems at scale. Our team works closely with silicon vendors and system partners to evaluate emerging technologies, validate performance characteristics, and ensure that hardware capabilities translate effectively to real-world AI workloads. About the Role We are seeking a 3P Hardware Architecture Expert with deep expertise in GPU and accelerator architectures to engage directly with silicon vendors and guide hardware decisions for AI infrastructure. In this role, you will evaluate architectural tradeoffs across compute, memory, and interconnect systems, translating vendor specifications into real-world workload impact. You will play a critical role in early silicon evaluation, benchmarking, and performance validation, helping ensure that next-generation hardware meets the needs of our workloads. This role is highly hands-on and requires both deep technical understanding and the ability to engage at a high level with partners such as NVIDIA and AMD on architectural direction and design tradeoffs. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance. Key Responsibilities Engage deeply with silicon vendors (e.g NVIDIA & AMD) on GPU and accelerator architecture tradeoffs. Analyze and interpret performance, power, and efficiency characteristics of next-generation hardware. Translate vendor specifications into expected real-world performance for AI workloads. Evaluate architectural aspects including: compute throughput and utilization memory systems (HBM, cache hierarchies, bandwidth constraints) data types and precision tradeoffs (FP16, BF16, FP8, etc.) interconnect and scaling behavior. Run benchmarks and profiling to validate hardware performance a