Hvm Df Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 Production Shift Engineer は、Fab15のHVM製造ラインにおけるシフト勤務でのオペレーション管理を担当します。ラインの安定稼働、スループット最大化、サイクルタイム短縮を目的とし、異常対応や改善活動を通じて顧客納期遵守とFabの競争力強化に貢献。また、シフト業務の自動化/効率化を推進していただきます。 職務内容 製造ラインの稼働状況監視とラインバランス調整 サイクルタイム、スループット、稼働率などのKPI分析と改善提案 ロットフロー管理、優先度設定（Lot Priority） 異常発生時の迅速なトラブルシューティングとリカバリー対応 DXチームやOMTチームとの連携による自動化・効率化施策の推進 シフト間の情報共有とレポート作成 本ポジションはシフト勤務（4勤4休）となります 昼勤：08:00～20:15（実働10時間30分、休憩105分）/ 夜勤：20:00～08:15（実働10時間15分、休憩120分） 主要な役割 シフト時間帯におけるFab運用の責任者として、安定稼働を確保 緊急対応時の判断とリカバリー実施 KPI達成に向けた改善活動の推進 チームメンバーとの協働によるFabPace改善 必須条件 Excel・SQLを用いたKPI分析のデータ分析スキルと、異常時の原因分析に迅速に対応できる問題解決能力を持ち、なおかつ3年以上の実務経験がある方 日本語：ネイティブレベル （JLPT N1相当） シフト勤務が可能な方 歓迎条件 製造オペレーション知識：半導体製造プロセス、ライン管理、サイクルタイム改善 コミュニケーション能力：現場オペレーター、DXチームとの協働 基本ITスキル：MES操作、レポート作成、標準ツールの活用 英語スキル：メールや簡単な報告対応が可能なレベル（業務内で英語の報告書作成あり。翻訳ツール使用可） Job Summary The Production Engineer (Shift Work) is responsible for managing operations on the Fab15 HVM production line during shift hours. This role focuses on ensuring stable line performance, maximizing throughput, and reducing cycle

Job Details: Job Description: We are seeking experienced and highly driven individuals to support the Penang Assembly and Test Manufacturing facility as a New Product Integrator. This role is responsible for coordinating and executing New Product Introduction (NPI) activities to ensure successful product startup from engineering builds through high volume manufacturing (HVM). Responsibilities / Expectations: • Plan and manage NPI execution activities as a product integrator, supporting the development, implementation, and ramp of new technologies or products for external customers. • Act as the primary coordination point for NPI build execution, engaging cross functional teams across engineering, manufacturing, quality, and supply chain to enable successful product startup. • Develop and manage detailed NPI execution plans, including task identification, dependency definition, effort and duration estimation, and project schedule tracking. • Track and publish Performance Against Schedule, ensuring achievement of Critical Success Indicators (CSIs) across key NPI milestones, including: o Recipe Check Out o Power On o Engineering Sample o Quality Sample o Factory Certification o Manufacturing Validation • Ensure manufacturing readiness by coordinating system setup, process flow definition, material readiness, and capacity availability to support NPI builds and data collection. • Understand product and process challenges and work closely with technical experts across multiple groups to identify solutions and drive Design for Manufacturing (DFM) alignment during NPI execution. • Proactively identify improvement opportunities and support improvement actions to enhance NPI delivery effectiveness, predictability, and quality. • Lead investigation of issues impacting NPI deliverables, perform structured root cause analysis, align risk mitigation actions, and coordinate resolutio

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: New Product Operations (NPO) Product Manager (HBM) plays a critical role in driving successful planning and execution of early lifecycle phases for New Product Introduction (NPI) products and this role will support the enablement of industry leading High Performance memory products (HBM). This position ensures alignment across the value chain to achieve predictable manufacturing readiness and seamless transition to High Volume Manufacturing (HVM). Key Responsibilities: • Be the program Operations liaison in core HBM Product Development Teams (PDT’s) driving all Operations Requirements (Supply Chain, Manufacturing, Procurement, Compliance, Logistics) and representing Operations in executive reporting forums. • Participate early in the Product Lifecycle Management (PLM) process to address manufacturing operations and enterprise system concerns for new products. • Maintain schedules for ramp and a smooth transition to HVM, ensuring milestones are met. • Oversee sample processes, ensuring delivery meets specifications, customer expectations, and On-Time Delivery (OTD) performance metrics. • Ensure product Bill of Materials (BOM) complies with Design for Supply Chain (DfSC) and Bill of Material Risk Review (BRR) guidelines. Facilitat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 F15 DXチームは、Fab15のHVM領域におけるデジタル化・自動化を推進し、サイクルタイム短縮、ライン安定化、FabPace改善を目的としたソリューション開発を担当します。製造現場の課題を分析し、データ駆動型の改善策を実装することで、Fabの競争力強化に貢献します。 職務内容 製造KPI（サイクルタイム、スループット等）の分析と改善策提案 自動化アプリケーションの開発（例：Lot Priority Auto Upgrade、FQ Postpone） データ可視化ダッシュボードの設計・構築（例：In-Time Delivery、Photo DBR） API開発およびUI設計による業務効率化 DX関連プロジェクトの要件定義、設計、UAT、導入 OMT DXチームとの連携によるFab全体のオートメーション推進 推奨Skill SQL/Python/Power BI/Streamlit/Tableau/Omelekでのダッシュボード構築 Job Summary The F15 DX team drives digitalization and automation initiatives in Fab15’s HVM area, focusing on cycle time reduction, line stability, and FabPace improvement. The team analyzes manufacturing challenges and implements data-driven solutions to strengthen Fab competitiveness. Key Responsibilities Analyze manufacturing KPIs (cycle time, throughput) and propose improvement actions Develop automation applications (e.g., Lot Priority Auto Upgrade, FQ Postpone) Design and build data visualization dashboards (e.g., In-Time Delivery, Photo DBR) Develop APIs and user interfaces to streamline operations Define requirements, design, conduct UAT, and deploy DX projects Collaborate with the OMT DX team to drive automation across Fab operations Recommended Skills Dashboard development using SQL / Python / Power BI / Streamlit / Tableau/Omlek Using AI: Experience in utilizing AI for work process improvements

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through different phases of a product i.e. concept, build, NPI and HVM by facilitating multi-functional life-cycle management. You will help build and maintain a detailed development schedule and guide the vital tactical progress. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and work you're doing. Responsibilities: Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations. Partner with the Technology Development, Build, Process, APTD, PE and Manufacturing teams to drive development progress and alignment. Collaborate with PMO org to build and sustain a detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM. Provide regular communication of development status, priorities, and challenges across the broader organization. Set and prioritize tactical expectations across development activities, according to defined achievements and collaborator needs and expectations. Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and leading development documentation. Consolidate a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role Summary The PDE PCS IIoT Senior Manager is responsible for leading the validation, industrialization, and high-volume manufacturing (HVM) enablement of Industrial IoT solutions across the enterprise. This role ensures that IIoT solutions developed through early pathfinding and solution development phases are scalable, robust, compliant, and standardized for global deployment. The position plays a critical governance role across the IIoT lifecycle—driving design-for-scale alignment, enforcing validation rigor, and enabling consistent fanout across sites. The role partners closely with APTD IIoT, site engineering teams, and central functions to deliver production-grade IIoT capabilities that achieve yield, productivity, and operational performance targets. Key Responsibilities 1. IIoT Validation and Industrialization Leadership Own end-to-end IIoT solution validation from pilot through industrial deployment. Ensure solutions are robust, scalable, and meet defined performance targets (e.g., DOC, latency, reliability). Establish and enforce validation frameworks including: Data quality and integrity checks Algorithm robustness and drift validation False positive/false negative performance thresholds Drive cybersecurity, compliance, and enterprise governance sign-off prior to deployment. 2. HVM Fanout and Standardization Lead SOAK fanout governance and ensure control

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Director, Package Quality & Reliability Engineering Job Summary The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC. Working closely with Package Development Engineering (PDE), front-end fabrication, manufacturing, and quality teams, the role drives Design for Reliability (DFR), qualification rigor, and structured problem-solving at the chip-to-package interface, while building strong team capability and operational excellence. Main Responsibilities Package Quality & Reliability Engineering Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical str

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As RAM (RDA and Metrology) Central Team Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers as well as process integration team, responsible for starting up, developing and optimizing detection to improve product yield, quality, and cost. This position will identify, diagnose and resolve detection gaps, as well as improving current detection. Responsibilities include working closely with the NAND and DRAM sites, HVM and TD, and even suppliers, to achieve Inline Visibility and Inline Control for Detection enablement and improvement. This position is responsible in setting up and aligning BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement. Responsibilities and Tasks: • Establish Detection to have 100% Inline Visibility and Inline control • Improve Detection strategy, system, and methods to continuously strengthen detection performance. • Enhance Detection capability and strategy to enable Yield improvement, improve Cycle of Learning and strengthen Defense Line. • Establish and improve BKM (Best Known Method) related to RAM Detection performance, RAM dete

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron Technology as a Staff/Senior Engineer for Automated Material Handling Systems (AMHS), based at Hiroshima plant, where you will serve as the on-site technical anchor while simultaneously leading Global AMHS network initiatives. This role is pivotal in driving KPI improvements, ensuring operational excellence, and establishing scalable best practices across Micron's worldwide fab network. This position bridges site-level execution at Hiroshima plant with global AMHS strategy — accelerating issue resolution, reducing systemic risk, and elevating automation maturity across all high-volume manufacturing (HVM) sites — without increasing headcount at individual sites. Hiroshima Plant Operations & KPI Ownership Act as the global technical lead for AMHS operational governance across all Micron manufacturing sites Drive alignment and standardization of wafer transport, storage systems, and carrier purge solutions spanning the network Partner with site AMHS teams globally for real-time issue resolution and partner concern management Develop and deploy global operational response strategies and standardized critical metric frameworks Serve as the primary AMHS technical lead stationed at Fab15, owning day-to-day system performance and availability Define, monitor, and drive improvement of AMHS critical metrics, including: Overall Equipment Efficiency (OEE) System uptime and reliability Carrier purge efficiency (