Hvm Pee Cost Engineer Jobs

ENGINEER, OMT HVM PROD.(Tongluo) — Miaoli - Tongluo, Taiwan. Apply via Workday.

ENGINEER, HVM PROD. (Taichung/Taoyuan) — 2 Locations. Apply via Workday.

SR MANAGER , OCT FE CPEE HVM DIFFUSION — Fab 10N/X, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Strategic Manufacturing & Supplier Leadership ​ Develop and drive long-term manufacturing and equipment capability roadmaps to support future technology requirements, capacity expansion, and factory competitiveness. ​ Partner with strategic equipment suppliers to define and influence next-generation hardware, software, automation, and process capability improvements. ​ Translate Micron manufacturing challenges and future business needs into supplier development priorities and technology roadmaps. ​ Establish strategic partnerships with suppliers to accelerate deployment of innovative solutions that improve productivity, reliability, sustainability, and cost of ownership. ​ Evaluate emerging manufacturing technologies and assess their applicability to future Micron manufacturing needs. ​ ​ ​ Global Manufacturing Strategy ​ Influence manufacturing strategy across Micron&#39

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric

Job Details: Job Description: We are seeking experienced and highly driven individuals to support the Penang Assembly and Test Manufacturing facility as a New Product Integrator. This role is responsible for coordinating and executing New Product Introduction (NPI) activities to ensure successful product startup from engineering builds through high volume manufacturing (HVM). Responsibilities / Expectations: • Plan and manage NPI execution activities as a product integrator, supporting the development, implementation, and ramp of new technologies or products for external customers. • Act as the primary coordination point for NPI build execution, engaging cross functional teams across engineering, manufacturing, quality, and supply chain to enable successful product startup. • Develop and manage detailed NPI execution plans, including task identification, dependency definition, effort and duration estimation, and project schedule tracking. • Track and publish Performance Against Schedule, ensuring achievement of Critical Success Indicators (CSIs) across key NPI milestones, including: o Recipe Check Out o Power On o Engineering Sample o Quality Sample o Factory Certification o Manufacturing Validation • Ensure manufacturing readiness by coordinating system setup, process flow definition, material readiness, and capacity availability to support NPI builds and data collection. • Understand product and process challenges and work closely with technical experts across multiple groups to identify solutions and drive Design for Manufacturing (DFM) alignment during NPI execution. • Proactively identify improvement opportunities and support improvement actions to enhance NPI delivery effectiveness, predictability, and quality. • Lead investigation of issues impacting NPI deliverables, perform structured root cause analysis, align risk mitigation actions, and coordinate resolutio

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer, Photo EUV Technology, you will be responsible for EUV process module development for memory devices, in addition to other photolithography and process integration related activities. In this position, you will work with other Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors. Key Responsibilities Develop and optimize EUV process modules to meet the stringent requirements of advanced memory devices. Perform advanced process development tasks, including material evaluations, reticle and layout design, OPC development, process window analysis, and overlay optimization. Lead the successful introduction of new technologies to manufacturing, focusing on yield improvement, cycle time reduction, and tool expansion. Collaborate closely with R&D and high-volume manufacturing (HVM) partners in globally diverse locations to ensure seamless integration and flawless execution. Partner with DRAM Development site leaders to align development strategies, deliverables, and provide on-site support for various technology projects. Work alongside Micron’s Manufacturing and Central teams to implement outstanding methods for manufacturability. Qualifications Proven experience in EUV process development and photolithography. Outstanding problem-solving skills and the ability to successfu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we believe in encouraging a culture of innovation and excellence. The PDE Process Integration (PI) Senior Manager role offers an outstanding chance to lead a distributed team in defining, standardizing, and driving High Bandwidth Memory (HBM) New Product Introduction (NPI) success across several locations. This position blends strategic leadership, scaling of operations, and coordination across sites. It aims to ensure consistent PI readiness, faster yield ramp, and strong risk management from development through High Volume Manufacturing (HVM). Job Responsibilities Define and drive PI strategy, standards, and guidelines across HBM programs. Coordinate PI execution across multiple HBM NPI programs, ensuring delivery against network-level achievements and ramp targets. Ensure robust risk identification, early detection mechanisms, and mitigation strategies. Serve as the central PI leader collaborating with various engineering and manufacturing organizations. Champion the adoption of AI-enabled tools for yield analysis and risk prediction. Organizational Leadership & Talent Strategy Guide and grow a group of PI managers and senior engineers spanning several locations or departments.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in memory and storage innovation, accelerating the transformation of information into intelligence. About the Role Join Micron’s STPG Product Engineering team where you will apply advanced analytics, machine learning, and agentic AI to solve complex NAND product engineering and manufacturing challenges. This role focuses on developing data‑driven and AI‑enabled solutions that improve yield, reliability, defectivity, and test time across the NAND product lifecycle—from New Product Introduction (NPI) to High‑Volume Manufacturing (HVM). You will work closely with Product Engineering, Fab, Technology Development, Test, Quality, and System teams to deploy scalable AI solutions into real production workflows. In addition, you will play a key role in enabling and mentoring Citizen Data Scientists (CDS) within Product Engineering, strengthening the organization’s capability to apply machine learning and advanced analytics for domain‑specific problem solving. Key Responsibilities: Machine Learning & Advanced Analytics Development Develop and deploy predictive and diagnost

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which