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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. RAM RDA Description Summary: The primary focus of the RAM Applications team within High Volume Manufacturing (HVM) is to prevent process excursions and reduce defectivity in order to achieve Key Performance Indicator (KPI) targets. This objective is shared across the broader RAM organization. The Applications teams are responsible for developing inspection recipes used as line monitors and for driving Statistical Wafer Review (SWR) process improvements. By leveraging collected data, the team monitors process stability and reduces defectivity, leading to improved yield performance. Effective cross-functional communication is essential across the RAM organization, including coordination with equipment engineering, recipe development, process monitoring, and continuous improvement efforts. To support these objectives, equipment selection is critical for generating transfer parts and enabling future technology development. This may require selecting tools that do not exactly match those in the sending FAB, resulting in additional development work across multiple tools and process steps. RDA Description: In this entry level position, you will join Micron as an RDA Applications Engineer stationed in Taiwan remotely supporting our newest advanced manufacturing Fab in Idaho. You will work with state-of-the-art inline RDA inspection tools to monitor and maintain HVM line health. As an RDA Applications Engineer supporting Micron’s newest Fab, you will develop expertise in

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HVM Phase Sourcing, Selection, and Qualification Lead quality risk assessments and implement mitigation strategies to support qualification activities. Deploy AI-based risk scoring models and digital dashboards to prioritize qualification risks and drive faster decision-making. Provide quality-focused input on sourcing and segmentation strategies, including business continuity planning, benchmarking, and supplier selection. Incorporate advanced analytics and AI-assisted scenario modeling into RFQ/RFI and supplier selection processes. Conduct technical risk assessment audits for new suppliers and materials to evaluate capability and readiness for HVM. Leverage digital audit tools and AI-assisted pattern recognition to identify systemic risks and hidden gaps. Establish, communicate, and ensure compliance with Supplier Requirements Standards (SRS). Support cross fab technology transfer activities in terms of new technology Bill of Materials (BOM) and driving global specifications alignment. Supplier Development and Excursion Management Lead the definition and alignment of global material specifications for Target and Specs Gas categories Support development of smart specifications by integrating AI-driven process capability insights and predictive limits. Support Material Category Leads in shaping Category Quality Strategy, including Quality Roadmap and Defense Line Program. Embed AI/ML use cases into Quality Roadma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Support the New Production Introduction (NPI) / Tech Node (TN) Process - Coordinate and facilitate Phase Gate meetings - Work with Package Development Engineering (PDE) / Advance Product Technology Development (APTD) and define required Phase Gate / PMI milestones to meet HVM required date. - Work with Package Development Engineering (PDE) / Advance Product Technology Development (APTD) for PG/PMI report preparation, process flow & readiness check and E2E monitoring. - Work with Package Development Engineering (PDE) / Advance Product Technology Development (APTD) for LVM facilitator & healthy monitoring. - Partner with technology development teams on milestones and product validation. - Applying AI for NPI critical lot tracking and NPI tool fanout activities. - The other NPM PLM Track all Managed new product development against milestones - Plan and drive schedules to ensure on-time execution - Ensure the schedule and resource data is current, accurate and up to date - Ensure milestones are created for new product requests - Follow up on issues that delay project milestones - Ensure smooth execution of product requests and adherence to NPI methodology - Ensure methodology and process documentation adhere to the best quality standards About Micron Technology, Inc. We are an industry leader in innovative memory

Job Details: Job Description: Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a senior technical leader driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements. Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes. Key Responsibilities Process Innovation and Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules Drive defectivity reduction and uniformity improvements through systematic process enhancement Lead technical problem resolution and deliver solutions that meet aggressive technology node targets Optimize equipment performance working with internal teams and key suppliers Strateg

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is undergoing a historic expansion with a new fabrication facility in Boise, ID, and we are building a strong remote technical network to accelerate capability, ramp readiness, and line health. We are seeking a RAM Applications Manager to provide technical leadership and operational ownership across metrology and inline optical inspection (RDA) while working remotely from Taiwan in direct support of the Boise fab. In this role, you will lead measurement and inspection strategy, drive tool and recipe readiness, and ensure data quality and process control for high-volume manufacturing (HVM), production ramp, and technology development. You will work hands-on with advanced metrology platforms (e-beam, optical, x-ray, etc.) and RDA optical inspection toolsets (eScan/Brightfield/Darkfield/Macro/SP) to develop robust line monitors, establish statistical controls, detect excursions early, and reduce defectivity. You will partner closely with Process Integration, Manufacturing, Process Development, Equipment Engineering, Yield, and Data/Automation teams across Boise and the global network to standardize best-known methods, enable effective tool matching, and ensure scalable solutions for ramp and long-term sustainment.. Key Responsibilities Leadership Provide technical leadership for metrology + RDA strategy, sustainment, and readiness within assigned technology areas. Own end-to-end readiness: recipe maturity, measurement methodology, standards, control plans,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Support, develop, and maintain software solutions for Technology Development (TD) and future HVM facilities. Work on critical manufacturing software, databases, and data-analysis systems, collaborating with cross-functional teams to ensure high-quality support, delivery, and uptime. Drive efficiency and change by applying worldwide BKMs, build strong relationships with customers, developers, and infrastructure teams across sites, and deliver a high-quality customer experience. Minimize IT impact and reduce support levels. Resolve critical IT downtime issues through repairs or workarounds. Monitor and respond promptly to line and IT system performance. Contribute to AI systems and workflows to improve team effectiveness. Develop permanent software solutions for critical business needs. Design and build support, maintenance, and metric-gathering utilities. Collect, analyze, and present data, including efficiency improvements and root-cause analysis. Recommend solutions to improve production, engineering, and process efficiencies. Learn new tools to maintain and troubleshoot existing software. Create and manage training documentation for 1st- and 2nd-level IT support. Create and maintain KPIs and ITSI monitoring solutions. Employer will accept a Bachelor’s degree in Computer Science, Software Engineering, or related field and 3 years of experience in the job offered or related occupation. Position requires: 1. C# 2. Perl 3. Bash 4. Visual Basic (.NET) 5. SQL 6. XML 7. Linux 8. Unix 9. Pyt

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an NVM QRA Engineer in Global Quality, you will be responsible for conducting electrical failure analysis and data analysis on next-generation 3D NAND memory devices to support product quality and reliability. You will play a key role in sustaining and improving Micron’s memory quality by developing, implementing, and overseeing outgoing monitor plans. In a high-volume manufacturing (HVM) environment, you will manage deviations through structured risk assessments and provide data-driven product disposition decisions. Responsibilities and Tasks Develop, validate, and maintain test methodologies and coverage to ensure robust product quality and reliability. Provide release documentation upon achieving qualification and set up plans to monitor the quality and reliability of the products in the HVM phase. Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions. Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials. Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High‑Volume Manufacturing (HVM) team is responsible for delivering stable, high‑yield semiconductor manufacturing to support Micron’s long‑term DRAM production strategy. The photolithography organization partners closely with operations, equipment engineering, and integration to maintain safe, efficient, and repeatable manufacturing. The Photolithography Process Engineer supports day‑to‑day health and capability of assigned, non‑critical lithography processes and tools. This role executes established control plans and standard work, monitors manufacturing signals, and supports issue resolution and continuous improvement activities with guidance from more experienced engineers. Responsibilities Execute established control plans and standard work to support stable lithography manufacturing. Monitor SPC, metrology, defect, and tool health indicators and escalate risks appropriately. Support excursion response activities, including containment, data collection, and documentation. Partner with shift operations and equipment engineering to support tool recovery and daily priorities. Complete well‑defined improvement tasks related to yield, output, cycle time, or cost with guidance. Minimum Qualifications B.S or M.S in Electrical/Electronics Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Computer Engineering, or a related technical field.. Understanding of high‑volume manufacturing execution, including SPC mon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are a team that thrives on uncovering the unseen. Using advanced inspection technologies, data analytics, and innovative defect detection methodologies, we protect the health of our manufacturing lines and enable world-class yield performance. We collaborate across global sites to share knowledge, develop best known methods, and accelerate learning through data-driven decision making. If you enjoy solving complex manufacturing challenges and influencing improvement at scale, we invite you to join us. As a Principal Realtime Defect Analysis (RDA) HVM Process Engineer, you will serve as a technical leader responsible for driving defect reduction strategies across high-volume manufacturing. You will influence inspection roadmaps, develop innovative approaches for defect detection and excursion prevention, and partner with global stakeholders to improve process capability and manufacturing performance. Your expertise will help shape RDA strategy, accelerate technology transfer, and enable proactive identification of critical process issues before they impact production. Responsibilities: Lead defect reduction initiatives through analysis of inline defect signals, process flows, and equipment performance across manufacturing sites Develop and implement advanced inspection strategies, methodologies, and controls to improve defect visibility and prevent process excursions Drive root cause investigations for complex defect and yield challenges while influencing corrective actions across cross

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Realtime Defect Analysis (RDA) and Metrology team plays a critical role in enabling world-class semiconductor manufacturing through advanced defect detection, process monitoring, and quality systems. We partner closely with manufacturing, process integration, process development, yield engineering, data science, and global high-volume manufacturing (HVM) sites to ensure process stability, defect visibility, and continuous improvement. Our team is passionate about innovation, collaboration, and delivering data-driven solutions that help prevent excursions and improve factory performance. As an ID1 RAM Quality Engineer, you will help define and maintain quality standards, monitoring systems, and best-known methods that support defect detection and metrology operations. You will analyze quality performance metrics, drive excursion mitigation, improve sampling strategies, and collaborate across global teams to identify and resolve process anomalies. This is an exciting opportunity to make a global impact through technical leadership, data analysis, and continuous improvement initiatives. Responsibilities: Develop and maintain quality control systems, sampling strategies, SPC compliance, and Wafer at Risk (WaR) processes for RDA and Metrology Analyze defect and process data to identify anomalies, drive excursion mitigation, and improve defect detection effectiveness Conduct audits, FMEA activities, and quality assessments while recommending and implementing process improvements

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High-Volume Manufacturing (HVM) fab is at the leading edge of DRAM technology, driving sophisticated semiconductor innovation through EUV lithography. We operate in a fast-paced, data-driven manufacturing environment focused on achieving extraordinary yield, process capability, and operational excellence while maintaining strict safety and contamination-control standards. For this great opportunity as an EUV Photolithography Engineer, you will lead the development, optimization, and sustainment of EUV processes and scanner performance critical to advanced DRAM nodes. You will be responsible for ensuring process stability, improving yield and throughput, and driving continuous improvement through data analysis, multi-functional teamwork, and sophisticated process control techniques in a high-volume manufacturing environment. Responsibilities Own EUV lithography processes and scanner fleets, ensuring stable high-volume manufacturing performance through SPC monitoring, overlay/CD optimization, defectivity reduction, and tool matching. Lead rapid response to process excursions, including containment, root-cause analysis, wafer disposition, and implementation of corrective and preventive actions (CAPA). Collaborate with Operations, Equipment Engineering, Integration, and Metrology teams to align on production priorities, resolve risks, and optimize cycle time, capacity, and output. Drive continuous improvement of process capability, yield, and equipment productivity using sophist

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a PDE MRDA KEG Engineer / Senior Engineer , you will be responsible for developing, qualifying, deploying, and sustaining advanced defect inspection and metrology solutions that support New Product Introduction (NPI), HBM technology ramps, and High Volume Manufacturing (HVM). You will drive inspection capability readiness, equipment performance improvement, and defectivity reduction through close collaboration with cross functional team. The role requires strong expertise in semiconductor manufacturing, defect inspection technologies, data analytics, equipment qualification, and cross-functional problem solving to enable industry-leading process control and yield performance. Inspection Technology & Equipment Ownership Manage advanced inspection and metrology platforms throughout package development and manufacturing. Develop technology roadmaps and capability strategies to meet future packaging requirements. Drive equipment lifecycle management, capacity planning, and technology insertion activities. Equipment Qualification & Deployment Lead tool installation, qualification (TIQ), release, and production readiness activities. Establish equipment acceptance criteria, qualification methodologies, and deployment pla

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an OCT CPEE Photo Metrology Principal/Senior Engineer, you will lead HVM photo metrology (especially overlay metrology) yield, quality, productivity, and cost improvement initiatives, and serve as the technical authority for resolving complex photo metrology related issues across fabs, and drive photo metrology supplier roadmap and engagement. You will be responsible for defining and deploying photo metrology Best Known Methods (BKM) for HVM and NPI, driving MOR‑POR gap closure, and enabling cross‑fab and cross‑node process alignment. You will also be acting as a key technical escalation point, and collaborate closely with internal partners and suppliers to improve photo metrology capability, process margin, and execution consistency, while representing OCT in technical reviews, workshops, and governance forums. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure an