Hvm Process Engineer Jobs

HVM Process (Shift) Engineer(Taichung/Taoyuan) — 2 Locations. Apply via Workday.

OMT HVM Process (Shift) Engineer — 2 Locations. Apply via Workday.

Fab15 HVM - WET Process Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

F16N_HVM _ Production/ Equipment/ Process Engineer — Miaoli - Tongluo, Taiwan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer, Photo EUV Technology, you will be responsible for EUV process module development for memory devices, in addition to other photolithography and process integration related activities. In this position, you will work with other Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors. Key Responsibilities Develop and optimize EUV process modules to meet the stringent requirements of advanced memory devices. Perform advanced process development tasks, including material evaluations, reticle and layout design, OPC development, process window analysis, and overlay optimization. Lead the successful introduction of new technologies to manufacturing, focusing on yield improvement, cycle time reduction, and tool expansion. Collaborate closely with R&D and high-volume manufacturing (HVM) partners in globally diverse locations to ensure seamless integration and flawless execution. Partner with DRAM Development site leaders to align development strategies, deliverables, and provide on-site support for various technology projects. Work alongside Micron’s Manufacturing and Central teams to implement outstanding methods for manufacturability. Qualifications Proven experience in EUV process development and photolithography. Outstanding problem-solving skills and the ability to successfu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and