HVM Production, Production Control Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
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Hvm Production Jobs
68 active opportunities · Updated for October 2026
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HVM Production Supervisor (Tainan) — Tainan, Taiwan. Apply via Workday.
HVM Production Operator (Tainan) — Tainan, Taiwan. Apply via Workday.
F16N_HVM _ Production/ Equipment/ Process Engineer — Miaoli - Tongluo, Taiwan. Apply via Workday.
OMT HVM TY Production Engineer — Taoyuan - Fab 11, Taiwan. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As a Fab Production engineer at Micron Technology, Inc., you will supervise, manage and lead a team of operators to meet production schedules, production standards, and operational costs to achieve production goals. You are responsible include : Supervise, manage, and lead a team of operators to meet production schedules, production standards, and operational cost targets in order to achieve overall production goals. Set clear expectations for team members, provide continuous performance feedback, and develop and implement improvement plans. Foster teamwork, build trust, and enhance employee engagement while recognizing and rewarding outstanding performance. Ensure all required training is effectively conducted and supported to meet site objectives. Establish and maintain clear, professional communication and strong engagement with peers, customers, team members, and management. <span
Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and
HVM PEE Bench Engineer (内製修理最適化エンジニア) — Hiroshima - Fab 15, Japan. Apply via Workday.
HVM PEE WP PR ENG — Hiroshima - Fab 15, Japan. Apply via Workday.
HVM PEE PH PR ENG — Hiroshima - Fab 15, Japan. Apply via Workday.
HVM Photo Scanner MTS — Taichung - Fab 16, Taiwan. Apply via Workday.
HVM PEE Dry Etch MTS/SMTS — Taichung - Fab 16, Taiwan. Apply via Workday.
HVM Cost program Engineer (半導体製造コスト分析エンジニア) — Hiroshima - Fab 15, Japan. Apply via Workday.
HVM PEE Cost Engineer (半導体製造工場コスト最適化エンジニア) — Hiroshima - Fab 15, Japan. Apply via Workday.
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