Intel Foundry Ltd Product Yield Engineer Jobs

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Join Intel's Silicon and Platform Engineering Group (SPE) as an Exempt Tech Contract Employee, The Role and Impact :As a Power Integrity Engineer, you will play a pivotal role in ensuring Intel's platforms and products meet the highest standards of performance and reliability. This position offers you the opportunity to work on cutting-edge technologies, designing and optimizing power delivery networks for complex high-speed platforms, boards, packages, and silicon. Your contributions will directly impact Intel's ability to deliver industry-leading solutions to its customers, driving innovation in power integrity and enhancing the performance and functionality of our silicon and systems. Join us to tackle exciting challenges and create impactful solutions that push technological boundaries. The primary responsibilities for this role will include, but are not limited to: Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards. Define power grid specifications and power and area targets to achieve optimal balance between power integrity and performance. Design test structures, electrical analysis methodologies, and verification plans to address power integrity challenges. Perform measurements to characterize power noise profiles across frequency, ground bounce, and other critical metrics, verifying power delivery networks post-design. Correlate measurements back to presilicon analysis and estimations for improved accuracy. Apply expertise in power integrity design and tradeoffs to guide simulations of power networks and physical implementations for packages and platforms. Ensure on-die power noise meets system-on-chip (SoC) functionality an

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Responsible for managing the relationship between Intel Data Center and AI (DCAI) and Dell ISG with focus on driving sales strategy of existing Xeon and AI product offerings while expanding Intel design portfolio within Dell's future roadmap to ensure the acceleration of Xeon and AI adoption. Through the design-in process, demonstrate the skills to showcase a quantifiable preference to Intel technology and integrate key learnings into Intel and Dell marketing organizations. The role is critical to establish great relationships and trust with key individuals at Dell and Intel business units and help both companies understand each other's challenges, opportunities to work towards a solution(s) that allows both companies to succeed. The candidate will have enough technical depth to understand the Intel product roadmap, the customer roadmap needs and what the competition is offering and intelligently recommend how to sell the Intel value proposition. Key Responsibilities include: Serve as sales and technical lead for multiple Dell PowerEdge and AI server programs based on Intel Xeon processors and AI accelerators, and collaborate with marketing team to drive complete end-to-end execution. Partner closely with Intel and Dell engineering, product, marketing, and program teams worldwide to align on features, schedules, quality, and issue resolution, ensuring successful product execution. Drive strategic design-win engagements for future Intel Xeon and AI accelerator products, influencing both Intel and Dell roadmaps through deep customer insight, competitive analysis, and early requirements gathering. Act as the primary interface between Intel and Dell, rapidly resolving business and technical issues, managing escalations, and ensuring the highest levels of cus

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a SoC Power Thermal Performance Validation and Optimization Engineer, you will play an essential role in ensuring Intel's products achieve optimal power, thermal, and performance benchmarks at the system-on-chip (SoC) level. In this position, you will develop and execute validation methodologies, optimize hardware/software solutions, and perform SoC-level debugging to address power, thermal, and performance challenges. Your contribution will directly impact Intel's ability to deliver competitive, high-performing products to market. Business Group This role is part of Intel's Data Center Group (DCG), which focuses on designing innovative solutions to power the next generation of computing platforms for data centers. As a member of the PTP PreSi Correlation Solution team, you will contribute to shaping the development and validation processes for cutting-edge technologies, ensuring Intel meets and exceeds industry standards for performance and efficiency. Key Responsibilities: Develop and execute SoC-level power, thermal, and performance validation and

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Job Details: Job Description: As a Facilities Mechanical Engineer, you will play a pivotal role in ensuring the reliable operation and maintenance of Intel's advanced mechanical systems, supporting our cutting-edge manufacturing, cleanroom, and research and development activities. Your work will directly impact Intel's ability to innovate and deliver world-class technologies by maintaining the critical infrastructure that enables peak operational performance. This role offers a unique opportunity to drive engineering excellence, collaborate with cross-functional stakeholders, and shape the future of Intel's facilities globally. Key Responsibilities: Ensure the availability, reliability, and maintenance of mechanical systems such as oil-free air systems, HVAC systems, chilled water plants, boilers, environmental abatement systems, and compliance exhaust systems. Support daily tactical efforts to meet safety, reliability, and environmental targets for mechanical systems. Design and analyze mechanical systems and equipment, troubleshoot systematic issues, and provide evaluations, recommendations, and solutions to resolve problems. Develop engineering scopes of work for mechanical projects and conduct design reviews to ensure system integrity and performance. Conduct feasibility studies and testing on new and modified designs, while overseeing prototype fabrication and design testing. Partner with internal business units and operations teams to deliver engineering solutions tailored to their specific needs.

Job Details: Job Description: About the Role Join Intel's Client Computing and Physical AI Group and help enable the next generation of mobile and desktop client platforms. We are seeking a Senior Customer Solutions Engineer to serve as a key technical leader responsible for customer platform enablement, architecture collaboration, and execution across Intel's client platform ecosystem. In this role, you will work closely with OEM customers, engineering teams, and program stakeholders to drive the successful delivery of innovative platform technologies. You will play a critical role in platform planning, issue resolution, customer engagement, and cross-functional execution from product definition through product launch and production. What You’ll Do Key responsibilities will include but not limited to: Serve as the primary technical interface between customers and Intel engineering teams, driving platform enablement and customer success. Lead cross-functional execution across platform technologies including hardware, firmware, graphics, connectivity, and I/O technologies. Drive resolution of critical platform issues, customer escalations, and technical challenges throughout the product lifecycle. Represent customer readiness, platform health, and execution status in program reviews and leadership forums. Develop technical assessments, customer enablement plans, and supporting documentation to accelerate design wins and product launches. Drive technical program execution across customer and engineering teams by aligning milestones, dependencies, risks, priorities, and deliverables. Behavioral traits that we are looking for: Strong customer focus and the ability to build trusted partners

Job Details: Job Description: About the Role The Client Computing and Physical AI Group (CCG) is shaping the future of AI-enabled computing experiences. We are seeking a highly motivated Senior Customer Solutions Architect, Graphics & AI to drive customer adoption of Intel's graphics and AI technologies across next-generation client platforms. In this role, you will serve as a trusted technical advisor to strategic customers and ecosystem partners, helping define, architect, validate, and optimize innovative graphics and AI solutions. You will work across hardware, firmware, software, and platform teams to translate customer requirements into scalable product solutions while influencing future technology roadmaps. This position blends deep technical expertise, customer engagement, cross-functional leadership, and innovation to accelerate the deployment of Intel AI and graphics technologies. What You’ll Do Key responsibilities will include but not limited to: Be the center point of contact for technical collaborations with the customer and with various internal teams. Own end to end architecture of customer solution in alignment with product and IP architectures, and its translation to product requirements. Co define test vehicle and validation strategy, and collaboratively manage the execute schedule and resource negotiation. Drive technology tradeoff decisions ensuring customer needs are met, along with satisfying standards and specifications, and execution reality. Be the customer voice and collaborate heavily with internal execution teams and manage customer dashboards. Participate and contribute in identifying critical technology solutions for future product needs and influence roadmap.

Job Details: Job Description: The Role and Impact As a Module Engineer, you will play a pivotal role in enabling Intel's cutting-edge manufacturing processes by ensuring the seamless operation and optimization of critical high-volume equipment. Your day-to-day responsibilities will focus on conducting tests, measurements, and maintenance activities to ensure the equipment meets stringent safety, quality, and efficiency standards. By driving process improvements and collaborating with global teams, you will contribute to the successful production of advanced integrated circuits and help shape technological innovation in the semiconductor industry. Business Group You will be part of Intel's Manufacturing and Operations organization, which is central to Intel's mission of creating world-changing technology. The group specializes in scaling advanced manufacturing techniques, ensuring high product quality, and delivering cost-effective solutions that support Intel's growth. Through its close collaboration with global teams, this organization fosters technological innovation and operational excellence across Intel's manufacturing sites worldwide. Key Responsibilities - Conduct equipment tests and measurements to ensure control over critical dimensions, registration and defectivity of the production line. - Recommend and implement modifications to improve production efficiency, manufacturing techniques, and output quality. - Own and execute maintenance and repair activities for manufacturing equipment, ensuring minimal downtime. - Lead continuous improvement initiatives for safety, quality, cost, productivity, defects, and yield metrics. - Collaborate with equipment suppliers to enhance manufacturing tools and processes. - Develop and optimize systems for preventing excursions and detecting process or equipment discrepancies. - Participate in technology transfers t

Job Details: Job Description: Intel India Customer Engineering Team is in a mission to create successful Original Design Manufacturers (ODMs) from India across their customer base. We are seeking a Hardware Board Design Engineer specializing in Power Delivery design and debug experience to help Intel customers design and debug their hardware platforms based on Intel Core and Atom CPUs. Qualifications: • Education : Bachelor's or Master's degree in Electronics/Electrical Engineering or related field • Experience : 7-12 years of industry experience (preferably 5-6 years designing and debugging hardware boards with Power Delivery focus using Intel Core/Atom CPUs) • Power Delivery Expertise : Deep understanding of system Power Delivery requirements and familiarity with Intel Core/Atom processor Power Delivery guidelines including IMVP specifications and PDN analysis • Circuit Design : Extensive experience with Buck, Boost, and Multi-phase Power Delivery Network design, including control loop understanding and very high current/low-voltage power delivery design • Design Tools : Proficiency in schematic capture using ind