Intel Manager Jobs

Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Join us as a Manufacturing Failure Analysis Engineer, where you'll play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products. The ideal candidate brings hands-on experience in probing, strong understanding of device behavior, and the ability to independently execute complex debug workflows. Business group You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future. Key Responsibilities: • Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes. • Perform electrical probing an

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Job Details: Job Description: The world is transforming and so is Intel. Here at Intel, we believe the world needs technology that can enrich the lives of every person on Earth. The E-Core CPU team is a CPU Core development team in Guadalajara, Mexico. We believe that developing these technologies takes a team of exceptionally talented individuals who work together to visualize, innovate, and make the future of computing possible. If you are excited about advanced development of breakthrough technologies for future-generation CPU cores, we welcome you to join us, to do something wonderful. The focus of this role is to be part of a team of pre-silicon verification engineers to verify new and existing features for Intel's next generation CPU IP resulting in bug free final design. You will be responsible for exhaustively validating the RTL implementation of new architecture and microarchitecture capabilities using a combination of standalone and top-level test environments as well as formal verification. This team is responsible to ensure the highest quality of Intel's CPU designs, in a dynamic cross-team environment. Role responsibilities include although not limited to: Developing pre-Si validation test plans and test scenarios to prove the correctness of the design. Development of components for a simulation-based environment: bus functional models, trackers, checkers, scoreboards, and test benches. Performing and debugging digital simulations and driving to closure of bugs. Development of functional coverage and achieving coverage goals. Working closely with design engineers, micro-architects, and other team members to ensure high quality of test plans, functional coverage, and tests. Deliver high-quality output against

Job Details: Job Description: The Intel Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap. We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work. As a Process Integration Development Engineer, you will play a pivotal role in advancing Intel's semiconductor process technologies within the Logic Technology Development (LTD) group. Your day-to-day involves designing, optimizing, and implementing integrated process solutions that drive Intel's next-generation technology. By leveraging your expertise in process integration, yield analysis, and data-driven problem solving, you will contribute directly to the seamless transition of emerging technologies from development to high-volume manufacturing, ensuring Intel remains at the forefront of semiconductor innovation. Job Responsibilities include but are not limited to: ​ LTD Semiconductor Senior Process Integration Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: Lead scientific research enabling the manufacture of innovative device architectures coupled with the realization of these architectures. <li

Job Details: Job Description: The Role and Impact As a Sr Deep Learning Hardware Verification Engineer, you will play a pivotal role in shaping the future of AI hardware by validating and optimizing next-generation NPU silicon solutions. In this role you will join the NPU Hardware Pre-Silicon Validation team working closely with design engineers, model engineers and AI architects to validate components of the next generation NPU IP portfolio, your contributions will directly shape Intel's advancements in AI technologies. Your responsibilities will include: • Functional Verification of complex digital design block(s) on the latest generations of Intel's NPU AI accelerators. • Architect, development and implementation of verification environments from initial planning through the validation lifecycle to review and signoff. • Development of test plans and test cases. • Implementation of random test generators, high level transactional models, bus functional models (BFMs), functional/formal constraints, checkers and scoreboards, coverpoints/covergroups and SVA properties. • Implementation of software based testcases for functional and performance based testing of the NPU AI accelerators. • Collaborate with cross-functional teams to analyses and address next-generation AI requirements, influencing the AI product roadmap. Leixlip is the primary location for this position, however, we offer some flexibility to support your work/life balance arrangements. Business group The Artificial Intelligence and Deep Learning team drives innovation in AI hardware development, aligning with Intel's mission to deliver world-class solutions in the AI domain. With a focus on building state-of-the-art hardware that supports cutting-edge AI models, the team collaborates across Intel to en

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: Intel Foundry Automation - Back End Automation Group is seeking a talented student to support our Automation Integrators in advancing manufacturing automation systems. Key Responsibilities: • Assist Automation Integrators with troubleshooting, system upgrades, user training, and root cause analysis to improve efficiency and reduce waste. • Enable Automation Integrators in designing, developing, testing, and debugging software for factory operations, wafer processing, and packaging across multiple software layers. • Support client-based Station Controller systems through validation, troubleshooting, and quality control. Collaborate with global cross-functional teams to drive automation projects and integrate machine learning and AI solutions as needed. Qualifications: Candidates must be currently pursuing a bachelor's degree in computer science, Data Science, Computer Engineering, or a related discipline. They should possess strong analytical, problem-solving, and communication skills, along with hands-on programming experience in languages such as Python, C, and C#. Knowledge of Agile software development methodologies and experience with manufacturing systems are highly desirable. Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Malaysia, Kulim Posti

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

Job Details: Job Description: Join Intel's Silicon and Platform Engineering Group (SPE) as an Exempt Tech Contract Employee, The Role and Impact :As a Power Integrity Engineer, you will play a pivotal role in ensuring Intel's platforms and products meet the highest standards of performance and reliability. This position offers you the opportunity to work on cutting-edge technologies, designing and optimizing power delivery networks for complex high-speed platforms, boards, packages, and silicon. Your contributions will directly impact Intel's ability to deliver industry-leading solutions to its customers, driving innovation in power integrity and enhancing the performance and functionality of our silicon and systems. Join us to tackle exciting challenges and create impactful solutions that push technological boundaries. The primary responsibilities for this role will include, but are not limited to: Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards. Define power grid specifications and power and area targets to achieve optimal balance between power integrity and performance. Design test structures, electrical analysis methodologies, and verification plans to address power integrity challenges. Perform measurements to characterize power noise profiles across frequency, ground bounce, and other critical metrics, verifying power delivery networks post-design. Correlate measurements back to presilicon analysis and estimations for improved accuracy. Apply expertise in power integrity design and tradeoffs to guide simulations of power networks and physical implementations for packages and platforms. Ensure on-die power noise meets system-on-chip (SoC) functionality an

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a SoC Power Thermal Performance Validation and Optimization Engineer, you will play an essential role in ensuring Intel's products achieve optimal power, thermal, and performance benchmarks at the system-on-chip (SoC) level. In this position, you will develop and execute validation methodologies, optimize hardware/software solutions, and perform SoC-level debugging to address power, thermal, and performance challenges. Your contribution will directly impact Intel's ability to deliver competitive, high-performing products to market. Business Group This role is part of Intel's Data Center Group (DCG), which focuses on designing innovative solutions to power the next generation of computing platforms for data centers. As a member of the PTP PreSi Correlation Solution team, you will contribute to shaping the development and validation processes for cutting-edge technologies, ensuring Intel meets and exceeds industry standards for performance and efficiency. Key Responsibilities: Develop and execute SoC-level power, thermal, and performance validation and

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As