Intern Collection Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Thin Films Equipment Engineering team at Micron develops and enhances advanced semiconductor manufacturing equipment in a fast-paced research and development environment. The team works closely with Process Engineering, Facilities Engineering, and equipment suppliers to enable next-generation memory technologies and achieve world-class equipment performance. Through innovation, collaboration, and data-driven decision-making, the team plays a critical role in advancing semiconductor technology development. As a Thin Films Equipment Engineering Intern, you will gain hands-on experience working with groundbreaking semiconductor equipment and processes. You will support engineering projects focused on equipment optimization, data analysis, and technology development while collaborating with multi-functional teams. This role provides exposure to semiconductor manufacturing, experimental design, and the application of advanced analytics to solve complex engineering challenges. Responsibilities Collect, analyze, and interpret equipment and process data to find opportunities for performance optimization and continuous improvement. Support structured engineering experiments, document findings, and communicate results through technical reports and presentations. Collaborate with Equipment Engineering, Process Engineering, Facilities Engineering, and equipment suppliers to address technology-development challenges and improve equipment performance. Develop an understanding of equipment hardware,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About the Team At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops future High-Bandwidth Memory (HBM) architectures, PHY design methodologies, and automation solutions that enable next-generation AI, high-performance computing, networking, and data center applications. The team works closely with Architecture, Design Engineering, Verification, Product Engineering, and external partners to advance memory technologies while improving design quality, productivity, and development efficiency. Position Overview As a Senior or Graduate Engineering Intern, you will collaborate with experienced HBM architects and engineers to support the development of digital design methodologies, automation frameworks, timing analysis flows, and architecture validation solutions for next-generation HBM PHY and IO subsystems. This role offers hands-on experience in digital design, verification, automation, and timing analysis, while providing opportunities to leverage AI Assisted engineering workflows, Large Language Models (LLMs), and Generative AI tools to enhance engineering productivity and design efficiency. Responsibilities Support digital design, integration, and timing analysis activities for HBM PHY and IO subsystems, including timing constraint development and timing closure efforts. Develop an

Job Title Intern - HIC - Pune (Only for Selected Students - Others PLZ DO NOT APPLY) Job Description Job Posting Description 📌 10-Month Internship Program (BTech / MTech) Eligibility: This internship is open only to students from Philips-selected colleges . Duration: 🗓️ 10 months Disciplines We Hire From: Mechanical Engineering Electrical Engineering E&TC (Electronics & Telecommunication) Project Management Design Engineering Conversion Opportunity: Upon successful completion of the internship, high-performing interns may be considered for full-time roles , subject to performance and position availability at that time. #LI-DNI

Intern - Digital Automation & Solutions Team — Fab 10N/X, Singapore. Apply via Workday.

Intern - Wafer Bonding Process Development — Boise, ID - Main Site. Apply via Workday.

Intern - DRAM Process Integration — Boise, ID - Main Site. Apply via Workday.

Intern – ML/AI Engineer (Product Engineering, STPG) — Fab 10N/X, Singapore. Apply via Workday.

Intern - Digital Automation & Solutions Team — Fab 10N/X, Singapore. Apply via Workday.

Intern - Systems Safety Engineering — ESP - Madrid, Spain. Apply via Workday.

Intern – Process Development Engineer, 3D DRAM Wet Etch — Boise, ID - Main Site. Apply via Workday.

Intern - Software Engineering — ESP - Madrid, Spain. Apply via Workday.

Intern - Wet Process Fab 4 EDE — Boise, ID - Main Site. Apply via Workday.

Intern - YE Physical Failure Analysis Engineer — Boise, ID - Main Site. Apply via Workday.

Intern - Metrology Process Development Engineer — Boise, ID - Main Site. Apply via Workday.

Intern - DRAM IP Circuits Design Engineer — Boise, ID - Main Site. Apply via Workday.