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About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Role Summary Lead hardware development for next-generation NAS and enterprise storage platforms, from architecture through production. You'll design high-performance storage hardware, solve complex system-level challenges, and deliver reliable, scalable products. Responsibilities Architect, design, and develop NAS and enterprise storage hardware platforms utilizing PCIe, SATA, NVMe, DDR4/DDR5, USB, and high-speed Ethernet interfaces. Own schematic capture, component selection, and PCB design reviews, ensuring SI/PI, manufacturability, and product reliability. Lead hardware bring-up, debugging, and system validation, including functional, performance, thermal, and EMI/EMC testing. Collaborate with firmware, BSP, SI/PI, DQA, mechanical, manufacturing, and software teams throughout product development. Investigate and resolve hardware issues while continuously improving product performance, reliability, and cost. Requirements Bachelor's or Master's degree in Electrical Engineering or a related field. 3+ years of hardware design experience in NAS, enterprise storage, server platforms, or storage appliances. Strong foundation in digital and analog circuit design. Experience with PCIe, DDR4/DDR5, SATA, NVMe, USB, Ethernet, and SerDes. Experience designing power delivery systems with a solid understanding of SI/PI, thermal design

JOIN OUR TEAM As a Product Engineer Customisable Furniture , you will play a key role in the development of our future Westwing Collection products, with a focus on our new customisable and modular furniture systems. You will work closely with our Buying and Creative teams to help bring our latest ideas to life, ensuring that the furniture we are developing meets our high standards and delights our customers for many years to come. You will bridge the gap between design and manufacturing, taking ownership for the structural integrity, material selection, and technical execution of our configurable ranges from initial concept through to final production. This position is permanent and based in Munich . WHAT YOU'LL DO Translate design concepts from our creative team into detailed 3D CAD models, technical drawings, and precise product specifications for suppliers, focusing on new modular and customisable furniture systems Lead technical decision-making by selecting materials, finishes, and manufacturing processes that balance premium aesthetics with structural integrity, production feasibility, and multi-variant complexity Drive technical discussions with external suppliers to define product requirements, review manufacturing feasibility, and resolve production or quality issues across both standard and modular product lines Perform structural simulations and hands-on prototype reviews to ensure that all final products, including our customisable ranges, meet European safety, quality, and regulatory standards, paying particular attention to how components perform across different configurations Define and develop core modular components to ensure seamless configuration logic across the entire product range for all customer orders YOU COME WITH 3+ years of experience in product development, with a degree in Mechanical or Product Engineering (or similar) and exposure to modular/configurable systems Proficiency in 3D CAD software (e.g., SolidWorks, Fusion, CATIA, NX) for

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms. Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies. Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis. Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability. Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production. Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle. Q ualifications Bachelor’s degree or above in Electrical Engineering or a related discipline. 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment. Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules. Practical experience with complex power d

About the Team OpenAI, in close collaboration with our capital partners, is embarking on a journey to build the world’s most advanced AI infrastructure ecosystem. This team is central to this mission, setting the core infra strategy and implementing this vision. From site selection to the buildout process, this team sits at the intersection of commercial, technical, strategy, and operations, interacting with teams and executives inside and outside of OpenAI. About the Role We are seeking experienced Data Center Electrical Design Engineers with expertise in designing, operating, and maintaining large-scale data center campuses. The ideal candidate for this role will have extensive background and experience in design and managing critical equipment and facilities, design and operation of MEP (Mechanical, Electrical, Plumbing) systems, and overseeing operational activities from initial phases of Data Center build through delivery and ongoing maintenance. The ideal candidate will have a strong technical background, operational leadership experience, and a proven ability to collaborate with external vendors on critical infrastructure. This role offers the opportunity to lead transformative data center projects with high visibility and impact. If you are passionate about delivering cutting-edge infrastructure solutions, we encourage you to apply. Key Responsibilities Oversee building and MEP design, operation, and maintenance, including reviewing building and MEP drawings and proposals across all project phases. Lead operational activities for large-scale data center campuses, from early design phases through delivery and daily operation. Operate and maintain critical data center facilities and equipment, ensuring reliability and performance. Collaborate with external vendors to select, procure, and manage critical equipment, such as generators, UPS, chillers, and CDUs. Provide technical expertise on all aspects of data center building, equipment, and operational systems,

What you’ll do Own and evolve the Quality Management System (QMS) to support a regulated medical device development program, including design controls and DHF maintenance. Establish and enforce requirements traceability: user needs → design requirements → verification/validation artifacts and change control. Define and run the program-level V&V strategy (verification, validation, and test coverage), including test plans, protocols, reports, and acceptance criteria. Drive risk management activities (e.g., DFMEA / PFMEA, hazard analyses) and ensure mitigations are reflected in requirements and verification. Lead document control: reviews, approvals, training, retention, and audit readiness. Partner with engineering to make quality “native” to the dev workflow (automated testing, release gates, software configuration management). Prepare the program for audits and inspections, including hands-on audit leadership. What we’re looking for Senior experience leading quality for complex hardware + software products in a regulated environment. Deep familiarity with design controls, DHF, document control, risk management, and verification planning. Strong systems thinking and the ability to translate ambiguous product intent into testable requirements. Comfortable collaborating directly with multidisciplinary engineering (recon/ML, embedded, mechanical, EE, cloud). Useful experience Regulated product quality leadership (ISO 13485 / 21 CFR 820 or equivalent), including audit readiness and FDA-facing work. eQMS + document control fluency (e.g., Greenlight Guru) that integrates cleanly with modern engineering workflows.

About the Team DoorDash Labs is an independent team within DoorDash. We are working on building autonomous delivery robots from the ground up and other automation solutions as part of DoorDash's core delivery platform. If you have a passion for applying AI and robotics solutions in a service used by millions of people, then we want to talk to you! Please Note: This role is based in San Francisco, CA, and requires in-person 5 days a week, plus availability for on-site interviews. No relocation assistance. About the Role We are seeking a highly motivated and detail-oriented Hardware Integration Engineer to join our team. You will work directly with our hardware team on the buildout, testing, and maintenance of the next generation of robotic systems within DoorDash Labs. Through your daily interactions with all aspects of the autonomous system, you will serve as the lead technical reference. You will work directly with our hardware/software engineers, engineering technicians, operations, and safety team to improve the utilization rate and safety of our autonomous vehicles. You’ll work closely with hardware and service engineering teams to tackle novel technical challenges in electromechanical systems and vehicle platforms. This is a role for someone who thrives in a fast-paced, hands-on environment and is passionate about building and refining robotic systems. You're excited about this opportunity because you will… Serve as the subject matter expert for autonomous robotic vehicles by developing deep familiarity with the entire system. Deliver vehicle integration support across the organization, including designing, prototyping, and installing proof-of-concept systems and sensors. Guide the vehicle through its lifecycle, from initial build-out and integration to final delivery and operational shakedown testing. Construct and engineer test benches to validate mechanical, electrical, embedded, and software systems. Create and maintain all necessary documentation pertainin

About the Team OpenAI, in close collaboration with our capital partners, is building the world’s most advanced AI compute infrastructure ecosystem. The InfraDev team is central to this mission, setting the strategy and executing the roadmap to scale our supercomputing footprint globally. From site planning to system integration, this team operates at the intersection of commercial, technical, and operational excellence, partnering with leaders across OpenAI and the industry. About the Role We are seeking a Strategic Sourcing Manager who is ready to take on global-scale challenges in AI compute supply and manufacturing — an opportunity to shape the future of supercomputing. As part of the Infrastructure Strategy & Delivery organization supporting Industrial Compute, OpenAI’s next-generation supercomputing platform, you will lead sourcing and strategic supplier engagements for compute infrastructure at hyperscale. This role will drive commercial strategy and supplier accountability across server platforms, accelerators, rack systems, and associated thermal & power delivery components. This is not traditional procurement — it is foundational work enabling OpenAI to deploy compute faster and more efficiently than anyone in the world, while building deeply-integrated partnerships with the global compute supply chain. Key Responsibilities Develop and execute sourcing strategies for the next generation of AI compute infrastructure in partnership with engineering and program leadership. Stay at the leading edge of industry and supply-chain trends to inform category strategy and long-range planning. Initiate, negotiate, and manage commercial agreements across OEM/ODM/JDMs for accelerators, GPUs/CPUs, server platforms, rack systems, liquid-cooling components, PSUs, and supporting mechanical/electrical subsystems. Secure capacity and optionality across a rapidly scaling compute supply chain while mitigating risk and ensuring manufacturing readiness. Partner cross-funct

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1.Partner with IT support to solve issue that is currently affecting Micron production activities. 2.Proactively monitor and drive performance of AMHS and equipment KPI and address any issues in a timely manner to achieve Fab quality, cycle time, yield and cost. 3.Schedule and perform preventative maintenance on assigned tools sets, and use mechanical, electronic and PC/software skills to troubleshoot and repair equipment issues. 4.Assist in AMHS/tool installation, relocation and upgrades. 5.Assist AMHS equipment and vendor support on long term down equipment and chronic process issue. 6.Improve tool uptime through quality workmanship, systematic problem solving and troubleshooting. 7.Document all maintenance performed in established check sheets and tracking programs, and routinely review maintenance check sheets and procedures. 8.Keep the Lead Engineer/Manager updated on all AMHS related issue and long term down status. 9.Follow all safety and environmental procedures to ensure compliance with applicable regulations. 10.Be an active participant in the EHSS program by reporting all EHSS-related concerns or problems immediately to the appropriate individual (ERT, Supervision, etc.). 11.Be proactive in reducing incidents of personal injuries, safety hazards or environmental releases (Job Hazard Analysis; JHA). 12.Take the initiative to assume added responsibilities. 13.Set up equipment maintenance guideline. 14.Establish and improve equipment repair system. 1

About Hark Hark is an artificial intelligence company building advanced, personalized intelligence. One that is proactive, multimodal, and capable of interacting with the world through speech, text, vision, and persistent memory. We're pairing that intelligence with next-generation hardware to create a universal interface between humans and machines. While today's AI largely operates through chat boxes and decade-old devices, Hark is focused on what comes next: agentic systems that interact naturally with people and the real world. To get there, we're developing multimodal models and next-generation AI hardware together - designed from the ground up as a single, unified interface for a new era of intelligent systems. About the Role We're looking for a world-class Engineering Program Manager to lead system builds for our AI consumer products, from early local prototypes through Proto, xVT, ramp, and launch. You'll partner closely with every engineering discipline to architect and execute builds that cover all validation needs and run efficiently on the floor. Location is flexible, with up to 30% in-region travel to ensure every build runs as planned. Requirements 6+ years executing and shipping high technology consumer electronics systems at large OEMs BS in Electrical, Mechanical, or related engineering discipline Proven track record leading hardware builds end-to-end with contract manufacturers, and driving critical supply chain components Experience with high technology manufacturing processes, component lead times, PCB technologies Experience driving programs through prototype, xVT, ramp, and mass production Excellent interpersonal communication and information visualization skills Ability to travel in-region including extended stays during critical builds Responsibilities Lead build planning and execution from early local prototypes through Proto, xVT, ramp, and launch Collaborate closely with EE, ME, SI, RF, thermal, and reliability teams to strateg

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Lead hardware circuit design, schematic development, and PCB layout review to ensure robust system performance and manufacturability Drive design verification, system bring-up, debugging, and root cause analysis, including RMA failure resolution Own BOM management and support production to ensure smooth transition from NPI to mass production Evaluate and integrate new technologies, components, and platforms to enhance product competitiveness Participate across the full product lifecycle from NPI, MP to EOL Collaborate with cross-functional teams including layout, component engineering, firmware, mechanical, power, thermal, QA, software, PM, ID, and compliance Qualifications Bachelor’s degree or above in Electrical Engineering or a related field 5+ years of hands-on experience in system-level hardware design Experience with networking products such as Ethernet gateway, switch, or NAS platforms Solid understanding of Ethernet technologies including 802.3 PoE (PSE/PD), 1G/10G PHY, and switching or routing fundamentals Experience in hardware validation, debugging, and failure analysis in production environments Familiarity with compliance requirements including ESD, surge protection, and safety standards Proficiency in hardware design tools such as OrCAD Capture, Cadence Allegro, or Mentor PADS Nice to Have Experienc

Who we are Lab37 Robotics , is a technology company focused on the development and deployment of robots designed specifically for direct-to-customer food production. Our mission is to revolutionize the food industry by creating innovative robotic solutions that enhance efficiency, quality, and customer satisfaction. We are passionate about pushing the boundaries of technology to deliver cutting-edge products that meet the evolving needs of our industry. What you’ll do Take on ownership of the on-robot software stack. This spans low level sensor interfaces and motor control, up through higher level state machines, up to managing, controlling, and offloading data to the cloud. Work with a team to both lead and provide feedback on new designs, triage issues, and analyze system performance. Responsibilities Build out on the on-robot software stack, including implementing support for new hardware modules, triaging failures on existing modules, and implementing higher level state machines to efficiently manage incoming orders. Collaborate with culinary and product teams to gather requirements and translate them into technical solutions Integrate with delivery service providers to receive orders and provide status updates Create and integrate with the on-robot control panel interfaces Work alongside firmware, mechanical, electrical, and front end engineers to ensure cohesive system functionality Contribute to code reviews and architectural decisions What we’re looking for Comfortable with C++ and Linux. Familiarity with documentation tools (for example wikis, markdown, docs) and writing design documents and playbooks. Ability to work collaboratively in a team environment and communicate effectively with both technical and non-technical team members. Desirable Skills Experience with ROS or similar robotics development frameworks. Experience with Vue3 and TypeScript for writing frontend web applications. Experience with Docker, Protobuf, Python, Ter

About Us: Samara Aerospace is revolutionizing satellite design by addressing the challenges of deploying and managing large satellite constellations. Our innovative Hummingbird spacecraft bus offers a modular and scalable platform that streamlines satellite production and deployment, significantly reducing launch costs. Hummingbird's compact architecture maximizes launch capacity, making it the most efficient and agile spacecraft in the industry. At the core of our technology is the patented Multifunctional Structures for Attitude Control (MSAC) system. Unlike traditional wheel-based pointing control systems, MSAC utilizes actuators embedded in the hinges of deployable solar panels to provide 3-axis attitude control and active jitter cancellation. This design eliminates the need for spinning wheels, reducing mass and potential points of failure, while enhancing pointing precision. Role: The Electrical Engineering team at Samara is seeking an Electrical Engineer to lead the design, layout, and testing of printed circuit boards for spacecraft electronics at our headquarters in San Francisco. This is a startup environment where you will own designs end-to-end, from early concept through production. A strong problem-solving background, hands-on testing skills, and experience with high-density PCB design and electronics integration. You'll work closely with experienced electrical, mechanical, and embedded software engineers to ensure the Hummingbird satellite's electronics are robust, manufacturable, and ready for the space environment. Responsibilities: Own PCB Design from circuit design, schematic capture, and PCB layout through bring up testing. Conduct trade studies that balance electrical performance, signal integrity, thermal management, manufacturability, cost, and schedule. Collaborate with embedded software engineers during board bring-up, debugging, and hardware-software integration. Support spacecraft and board-level integration, including hands-on assi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

About the Team OpenAI is building the infrastructure foundation for the next generation of AI. The Data Center Engineering team defines the strategy, reference architectures, technical requirements, and delivery standards for the large-scale data centers that support OpenAI research, products, and infrastructure partners. As a Data Center Controls Network Engineer, you will design, validate, and scale the controls and OT network architectures that support high-density AI data centers. You will work across controls systems, OT infrastructure, telemetry, commissioning, deployment, and operations, partnering with mechanical, electrical, IT/networking, security, and external delivery teams. About the Role We are seeking a mid to senior OT Network Engineer with a strong controls systems background to lead the design and operation of resilient, secure, and scalable OT network architectures for high-density AI data centers. This role translates compute, power, cooling, and operational requirements into practical OT network designs, evaluates vendor solutions, and drives technical decisions across controls infrastructure, telemetry, commissioning, and operations. The ideal candidate has strong hands-on experience in mission-critical OT environments, including industrial networking, virtualized infrastructure, and OT network operations, with expertise in routing, switching, segmentation, firewall policy, time synchronization, monitoring, and network lifecycle support. Key Responsibilities Define controls, automation, and OT network requirements for AI data center campuses. Develop reference architectures, engineering standards, and reusable design templates. Review and develop basis-of-design and functional design documents, including OT network diagrams, IP/VLAN schemes, telemetry architectures, data flow diagrams, and commissioning requirements. Design OT and infrastructure network architectures, including physical topology, logical topology, IP addressing, subnetting, VLA