Lead Mechanical Bop Jobs

About the Team DoorDash Labs is a team within DoorDash building autonomous delivery robots and other autonomy solutions from the ground up for DoorDash's core delivery platform. If you have a passion for applying autonomy and robotics in a service used by millions of people daily, then we want to talk to you! About the Role We are seeking a hands-on Electrical Engineer to review the design, drawings, and schematics of the electrical systems for our 4-wheeled autonomous delivery robot. This role is responsible for delivering robust, production-ready hardware across high-speed digital design, PCBAs, RF integration, harnessing, and board-level packaging. This is a deeply technical position for someone who can move seamlessly between system-level thinking and detailed circuit execution. You're excited about this opportunity because... Develop electrical systems for a complex mobile robotic platform from concept through production. Lead high-speed digital design efforts (PCIe, MIPI, Ethernet, DDR, multi-gigabit SERDES, etc.). Own PCBA development including schematic capture, stack-up definition, layout guidance, impedance control, and design-for-manufacture. Drive RF integration (Wi-Fi, LTE/5G, GNSS, Bluetooth, RADAR, and LiDAR), antenna placement, layout constraints, and signal integrity. Develop and review cable harness designs, connector selection, grounding strategy, and environmental robustness. Collaborate closely with mechanical engineering on board packaging, thermal management, vibration resistance, and environmental sealing. Define and implement power distribution architecture, battery interfaces, protection circuits, and system monitoring. Ensure compliance with EMI/EMC and regulatory requirements (FCC/CE) (CISPR-25 and FCC Part 15 Class A). Support prototype builds and bring-up, debug hardware/firmware interface issues, root-cause failures, and drive corrective actions quickly. Establish design standards and perform detailed design reviews across the EE team.

About the Team DoorDash Labs is an independent team within DoorDash. We are working on building autonomous delivery robots from the ground up and other automation solutions as part of DoorDash's core delivery platform. If you have a passion for applying AI and robotics solutions in a service used by millions of people, then we want to talk to you! Please Note: This role is based in San Francisco, CA, and requires in-person 5 days a week, plus availability for on-site interviews. No relocation assistance. About the Role We are seeking a highly motivated and detail-oriented Hardware Integration Engineer to join our team. You will work directly with our hardware team on the buildout, testing, and maintenance of the next generation of robotic systems within DoorDash Labs. Through your daily interactions with all aspects of the autonomous system, you will serve as the lead technical reference. You will work directly with our hardware/software engineers, engineering technicians, operations, and safety team to improve the utilization rate and safety of our autonomous vehicles. You’ll work closely with hardware and service engineering teams to tackle novel technical challenges in electromechanical systems and vehicle platforms. This is a role for someone who thrives in a fast-paced, hands-on environment and is passionate about building and refining robotic systems. You're excited about this opportunity because you will… Serve as the subject matter expert for autonomous robotic vehicles by developing deep familiarity with the entire system. Deliver vehicle integration support across the organization, including designing, prototyping, and installing proof-of-concept systems and sensors. Guide the vehicle through its lifecycle, from initial build-out and integration to final delivery and operational shakedown testing. Construct and engineer test benches to validate mechanical, electrical, embedded, and software systems. Create and maintain all necessary documentation pertainin

About the Team DoorDash Labs is an independent team within DoorDash. We are working on building autonomous delivery robots from the ground-up and other automation solutions as part of DoorDash's core delivery platform. If you have a passion for applying AI and robotics solutions in a service used by millions of people, then we want to talk to you! About the Role As the Hardware TPM at DoorDash Labs you will play a central role within the robotics hardware team and across all of DoorDash Labs as we improve last-mile deliveries using autonomy. You will report to the Lead of our Technical Program Management team. This role requires onsite presence in one of our two HW Labs in either San Francisco or Oakland minimum two days per week. You're excited about this opportunity because you will… Be part of an exciting effort to develop and manufacture an autonomous delivery robot Work with our robotics hardware, software, autonomy and operations teams on a daily basis to solve challenging technical autonomous vehicle problems Program manage and help lead development, testing, validation and manufacturing of our current and next generation mechanical, electrical and electronic robotics hardware Take hardware projects from product requirements or engineering concept to public roads driving Work with leaders and engineers across Hardware, Software, Firmware, Controls, Autonomy and Ops to plan, track, follow up and resolve issues Leverage your expertise not only in hardware but software and firmware integration as well Manage vendor relationships domestically and internationally, both for prototyping and mass production. We're excited about you because… B.S., M.S., or PhD. in engineering, e.g. robotics, mechanical, electrical or computer science 8+ years of industry experience working in engineering and program management Experience with software and hardware development processes Experience taking hardware from product requirements to mass production overseas,

About the Team OpenAI is building the infrastructure foundation for the next generation of AI. The Data Center Engineering team defines the strategy, reference architectures, technical requirements, and delivery standards for the large-scale data centers that support OpenAI research, products, and infrastructure partners. As a Data Center Infrastructure Engineering Program Manager, you will help turn complex infrastructure strategy into executable programs across electrical, mechanical, controls, network, hardware, construction, commissioning, deployment, and operations workstreams. You will partner with research, hardware engineering, data center engineering, site development, supply chain, security, EHS, finance, legal, operations, and external delivery partners to bring OpenAI's infrastructure vision to life. About the Role We are looking for an Engineering Program Manager (EPM) to lead assigned infrastructure programs focused on production and non-production network integration, controls coordination, and the design and deployment of data hall or whitespace facilities. The EPM will support functional Directly Responsible Individuals (DRIs) across network, controls, structural, electrical, and mechanical disciplines. Key responsibilities include coordinating assigned workstreams and program controls, maintaining risks and interfaces, and supporting readiness within the network and data hall deployment track. The ideal candidate thrives on bringing structure to complex environments characterized by ambiguous technical requirements, large partner ecosystems, tight deadlines, and high operational stakes. This individual must be adept at keeping teams aligned on decisions, risks, dependencies, schedules, and readiness criteria, and escalating gaps or decision points when needed. Candidates should have a proven track record of managing technically challenging engineering programs across major lifecycle phases, including design, validation, procurement, construction, c

About the Team OpenAI, in close collaboration with our capital partners, is building the world’s most advanced AI compute infrastructure ecosystem. The InfraDev team is central to this mission, setting the strategy and executing the roadmap to scale our supercomputing footprint globally. From site planning to system integration, this team operates at the intersection of commercial, technical, and operational excellence, partnering with leaders across OpenAI and the industry. About the Role We are seeking a Strategic Sourcing Manager who is ready to take on global-scale challenges in AI compute supply and manufacturing — an opportunity to shape the future of supercomputing. As part of the Infrastructure Strategy & Delivery organization supporting Industrial Compute, OpenAI’s next-generation supercomputing platform, you will lead sourcing and strategic supplier engagements for compute infrastructure at hyperscale. This role will drive commercial strategy and supplier accountability across server platforms, accelerators, rack systems, and associated thermal & power delivery components. This is not traditional procurement — it is foundational work enabling OpenAI to deploy compute faster and more efficiently than anyone in the world, while building deeply-integrated partnerships with the global compute supply chain. Key Responsibilities Develop and execute sourcing strategies for the next generation of AI compute infrastructure in partnership with engineering and program leadership. Stay at the leading edge of industry and supply-chain trends to inform category strategy and long-range planning. Initiate, negotiate, and manage commercial agreements across OEM/ODM/JDMs for accelerators, GPUs/CPUs, server platforms, rack systems, liquid-cooling components, PSUs, and supporting mechanical/electrical subsystems. Secure capacity and optionality across a rapidly scaling compute supply chain while mitigating risk and ensuring manufacturing readiness. Partner cross-funct

About the Team OpenAI is building the infrastructure foundation for the next generation of AI. The Data Center Engineering team defines the strategy, reference architectures, technical requirements, and delivery standards for the large-scale data centers that support OpenAI research, products, and infrastructure partners. As a Data Center Controls Network Engineer, you will design, validate, and scale the controls and OT network architectures that support high-density AI data centers. You will work across controls systems, OT infrastructure, telemetry, commissioning, deployment, and operations, partnering with mechanical, electrical, IT/networking, security, and external delivery teams. About the Role We are seeking a mid to senior OT Network Engineer with a strong controls systems background to lead the design and operation of resilient, secure, and scalable OT network architectures for high-density AI data centers. This role translates compute, power, cooling, and operational requirements into practical OT network designs, evaluates vendor solutions, and drives technical decisions across controls infrastructure, telemetry, commissioning, and operations. The ideal candidate has strong hands-on experience in mission-critical OT environments, including industrial networking, virtualized infrastructure, and OT network operations, with expertise in routing, switching, segmentation, firewall policy, time synchronization, monitoring, and network lifecycle support. Key Responsibilities Define controls, automation, and OT network requirements for AI data center campuses. Develop reference architectures, engineering standards, and reusable design templates. Review and develop basis-of-design and functional design documents, including OT network diagrams, IP/VLAN schemes, telemetry architectures, data flow diagrams, and commissioning requirements. Design OT and infrastructure network architectures, including physical topology, logical topology, IP addressing, subnetting, VLA

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

Radiation Environmental Test Engineer (Mid-Level or Senior) Company: The Boeing Company Boeing Missile & Weapons Systems is seeking a Radiation Environmental Test Engineer (Mid-Level or Senior) to lead radiation and environmental test efforts supporting ICBM modernization at the Little Mountain Test Facility in Hill Air Force Base, UT. This hands-on role combines test design, execution, data analysis, and facility/test-stand maintenance. The position supports ongoing modernization efforts to enhance current test capabilities and new developing capabilities—identifying, designing, managing, and integration of new test stands, diagnostics, and data systems to meet evolving mission requirements. Position Responsibilities: Lead and execute complex radiation and environmental test machine design and facility integration Identify interface requirements, CDRLs, configuration control documentation, and change orders Design, specify, and integrate test hardware, sub-assemblies, fixtures, and instrumentation Assist in configuring, validating, and operating data acquisition systems and custom software (LabVIEW) for diagnostics and event capture Support pulse power and flash X-ray systems: theory, operation, diagnostics, and data capture Perform technical evaluation of subcontractors Basic Qualifications (Required Skills and Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement Level 3: 5+ years of related work experience and a bachelor’s degree or an equivalent combination of related work

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal Engineer - Process Development, CMP, NAND Job / Role Summary The Principal Engineer provides technical leadership for Chemical Mechanical Planarization (CMP) process development supporting advanced 3D NAND and future technology nodes. This role leads process characterization, margin improvement, integration, and transfer readiness, while driving cross-functional alignment with global development, manufacturing, equipment, and supplier teams. The position resolves complex process, yield, defectivity, and manufacturability challenges, influences module and site-level technical direction, and advances robust CMP capability for high-volume production through disciplined experimentation, process control, and technology roadmap execution. Main Responsibilities · Lead CMP process characterization and advanced process development for 3D NAND and future technology nodes. · Define and execute CMP process strategies that improve process margin, robustness, manufacturability, yield, and performance. · Lead complex experiments and data analysis to validate process windows, technology scaling readiness, and integration requirements. · Drive transfer of developed CMP processes to high-volume manufacturing at Fab10N and lead cross-func

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13+ years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Shift Engineer, your duties will include: Partnering with IT support to solve issues currently affecting Micron production activities Proactively monitoring and driving performance of AMHS and equipment benchmarks, addressing any issues in a timely manner to achieve Fab quality, cycle time, yield, and cost Scheduling and performing preventative maintenance on assigned tool sets, using mechanical, electronic, and PC/software skills to troubleshoot and repair equipment issues Assisting in AMHS/tool installation, relocation, and upgrades Supporting AMHS equipment and vendor on long-term down equipment and chronic process issues Improving tool uptime through quality workmanship, detailed problem solving, and troubleshooting Detailing all maintenance conducted in established check sheets and tracking programs, and regularly reviewing maintenance check sheets and procedures Keeping the Lead Engineer/Manager updated on all AMHS-related issues and long-term down status Following all safety and environmental procedures to ensure compliance with applicable regulations Actively participating in the EHSS program by reporting all EHSS-related concerns or problems immediately to the appropriate individual (ERT, Supervision, etc.) Being proactive in reducing incidents of personal injuries, safety hazards, or environmental relea

We anticipate the application window for this opening will close on - 10 Oct 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life The Neuromodulation Research & Development organization develops therapies and technologies that address chronic pain and other neurological conditions. Within the Interventional Pain portfolio, teams focus on minimally invasive therapies used to treat musculoskeletal pathologies, including vertebral compression fractures, nerve pain, metastatic bone tumors, and benign bone tumors. This role supports the development of system-level verification and validation strategies for new products and enhancements across mechanical, electrical, and software components. This position is based in Santa Clara, California, and follows an onsite work model. No travel is required for this role. As a Research & Development Test Engineer, you will lead and execute verification and validation activities that support the development of interventional pain therapies and associated medical device systems. You will collaborate with cross-functional partners to define test strategies, evaluate product performance, manage technical risks, and generate evidence needed to support product development and regulatory requirements. Primary Responsibiliti

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Manager, Electrical Engineering is responsible for the electrical systems of the KARNO generator, including high-voltage power electronics, battery systems, low- and high-voltage architecture, wiring harnesses, and the hardware that converts linear motion into electrical output. This is a working manager role: the position leads and develops a team of electrical engineers while remaining directly involved in technical execution, including circuit architecture, schematic review, and hardware bring-up in the lab. The Manager is accountable for the technical excellence, safety, and reliability of the electrical engineering function, and for establishing the design standards and review practices the team works to. The position plans team capacity, owns hiring and development for the electrical engineering staff, and partners with mechanical, controls, supply chain, and program management on system integration. KARNO systems are deployed in data center, military, and industrial applications. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Own critical electrical designs personally, including regular time at the bench and in the test cell, while leading the team as a practicing engineer. Lead the electrical engineering team in the design and development of KARNO generator electrical systems, including high-voltage power electronics, battery systems, linear generator power stages, and low-voltage controls hardwar

About Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a TPM to drive development and integration of a range of sensor systems for robotics. This role will drive cross-functional alignment across requirements, engineering design, integration, validation, manufacturing, supply chain, and release processes, helping turn complex sensor-system needs into clear plans, decisions, and milestones. Location and in-person expectations: This role is based in San Francisco, CA and requires in-person presence 4 days a week. In this role you will: Drive requirements alignment across engineering design, integration, testing, and validation for camera modules, LiDAR, IMUs, RADAR, proximity sensors, audio components and the systems they interact with. Coordinate the integration of modules including electrical, mechanical, harnessing, and software interfaces with the full robotic system with deep understanding of timelines to drive the respective PCBAs, enclosures, build and test fixtures, connectors and cables. Establish effective cadences for technical reviews, BOM readiness, change management, production releases, approvals, and decision tracking. Align harnesses, fasteners, assembly fixtures, test fixtures, and documentation so cross-functional teams can execute against a clear plan. Lead validation planning around functional, reliability, NVH failure modes, including testing needs, schedules, and exit criteria. Partner with manufacturing and supply chain to manage handoffs, lead times, dependencies, and production readiness. Drive tradeoff decisions across cost, qua

About the Team OpenAI is helping build the infrastructure that powers the next generation of artificial intelligence. Through Stargate, we are developing and operating large-scale AI compute campuses that require world-class execution across data center design, construction, commissioning, and operations. The Infrastructure Operations team is responsible for bringing AI infrastructure online and ensuring it operates reliably at scale. We partner closely with hardware, network, deployment, construction, and operations teams to deliver mission-critical environments capable of supporting frontier AI workloads. As our footprint expands, operational excellence becomes increasingly important to ensuring safe, reliable, and efficient campus operations. About the Role We are seeking a Facilities Operations Manager to support the commissioning, operational readiness, and long-term operation of next-generation AI data center campuses. This role sits at the intersection of construction, commissioning, hardware deployment, and facilities operations. You will be responsible for ensuring mission-critical infrastructure is prepared to support hardware deployment, transitioned successfully into production operations, and maintained to the highest standards of reliability and availability. You will lead day-to-day operational execution across electrical, mechanical, controls, and supporting infrastructure systems while partnering closely with commissioning teams, site operators, vendors, and engineering organizations. This role requires a strong blend of technical depth, operational leadership, and cross-functional execution. Key Responsibilities Lead day-to-day operations of mission-critical facility infrastructure across AI compute campuses. Own operational readiness activities supporting new campus deployments and infrastructure expansion. Partner with commissioning teams to transition facilities from construction and startup into steady-state operations. Develop, implement, and