Manufacturing Alignment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Job Description The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below. Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Construction & Engineering team drives the delivery of world‑class facilities that power Micron’s manufacturing and innovation. We work across disciplines to build safe, efficient, and reliable environments that enable teams across the company to do their best work. We are looking for a Project Manager who will lead complex construction projects from concept through completion. In this role, you’ll own scope, schedule, and budget while coordinating multi-functional teams and ensuring that safety, quality, and technical excellence are built into every step. Your leadership will make a direct impact on Micron’s ability to grow and operate at scale. Responsibilities: Lead assigned construction projects, managing scope, schedule, budget, resources, and vendor performance Ensure all work follows Micron safety, environmental, and quality standards; drive proactive hazard identification and resolution Develop and maintain project financials including estimates, forecasts, cash flow, and cost controls Build and manage detailed project schedules; remove roadblocks and coordinate multi-functional alignment Lead design reviews, competitive bidding, contract execution, and project programming and development activities Minimum Qualifications: Degree in Engineering, Construction Management, Project Management, or related field; or relevant certification/licensing 5+ years as a primary project

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Construction & Engineering team drives the delivery of world‑class facilities that power Micron’s manufacturing and innovation. We work across disciplines to build safe, efficient, and reliable environments that enable teams across the company to do their best work. We are looking for a Project Manager who will lead complex construction projects from concept through completion. In this role, you’ll own scope, schedule, and budget while coordinating multi-functional teams and ensuring that safety, quality, and technical excellence are built into every step. Your leadership will make a direct impact on Micron’s ability to grow and operate at scale. Responsibilities: Lead assigned construction projects, managing scope, schedule, budget, resources, and vendor performance Ensure all work follows Micron safety, environmental, and quality standards; drive proactive hazard identification and resolution Develop and maintain project financials including estimates, forecasts, cash flow, and cost controls Build and manage detailed project schedules; remove roadblocks and coordinate multi-functional alignment Lead design reviews, competitive bidding, contract execution, and project programming and development activities Minimum Qualifications: Degree in Engineering, Construction Management, Project Management, or related field; or relevant certification/licensing 5+ y

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Engineering Execution Manager within Compute DRAM Product Engineering , you will lead engineering program execution for assigned DRAM products from pre-silicon readiness through qualification, production ramp, and transition to sustaining teams. This is an individual contributor leadership role, you will lead product execution across functional engineering teams through influence, technical judgment, and accountability. You will also collaborate across engineering and business organizations to build integrated plans, solve complex execution challenges, and deliver products that meet quality, yield, schedule, supply, and business requirements. Your work will have a direct impact on bringing innovative memory products to market! This technical leadership opportunity will allow you to develop broad product knowledge, strengthen your leadership skills across different functional groups, and learn across the semiconductor product lifecycle. Responsibilities Lead product execution from pre-silicon readiness through qualification and production ramp, building integrated schedules, dependencies, actions and decision points. Collaborate across Product Development, Design, Technology Development, Test, Package, Module, Quality, Manufacturing, Planning, and business teams to align technical and product achievements. Drive problem-solving for product risks and failures by facilitating issue triage, root-cause alignmen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data ‑ driven root ‑ cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo yield, quality, productivity, and cost improvement initiatives Resolve complex photo process issues (overlay, CDU, EPE, MMM, destack, RWC, yield matching) through data ‑ driven root ‑ cause analysis Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex lithography customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT Photo in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo process engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Probe process Engineering team member in Micron's Global Probe process team will have responsibilities for supporting and maintaining Probe processes and software that are codeveloped with Micron’s Global Manufacturing sites or directly sent to the Manufacturing sites around the world. Managing, validating and coordinating releases of global processes and software ensuring that the resulting Manufacturing Quality meets or exceeds customers’ requirements. Day-to-day they will manage critical projects for optimal probe process. Developing software solutions & processes to promote greater quality, efficiency and standardization of automated semi-conductor Probe operations. Supporting and maintaining the Global Probe Data Crunching Process (i.e. post processing probe test data). Developing, coding, validating and coordinating timely software releases. Generating metric reports (Efficiency & Effectiveness) for Probe processes domain. Collaborating with global teams in the Probe network to establish and implement Best Known Method of Global Probe Processes. Conducting statistical data analysis of Probe data sets in support of process. Promote and drive Continuous Improvement. Following tools will be applied during the assignment Project Management system, Probe Test Data system, Probe product disposition system, Manufacturing Execution System and statistical data analysis/reporting systems. Position requires up to 20% of travel. Domestic and International. Employer will accept a Bachelor’s degree in Computer Engineering, Computer Science, Eng

Who we are Samsara (NYSE: IOT) is the pioneer of the Connected Operations™ Cloud, which is a platform that enables organizations that depend on physical operations to harness Internet of Things (IoT) data to develop actionable insights and improve their operations. At Samsara, we are helping improve the safety, efficiency and sustainability of the physical operations that power our global economy. Representing more than 40% of global GDP, these industries are the infrastructure of our planet, including agriculture, construction, field services, transportation, and manufacturing — and we are excited to help digitally transform their operations at scale. Working at Samsara means you’ll help define the future of physical operations and be on a team that’s shaping an exciting array of product solutions, including Video-Based Safety, Vehicle Telematics, Apps and Driver Workflows, and Equipment Monitoring. As part of a recently public company, you’ll have the autonomy and support to make an impact as we build for the long term. About the role: We're building the next chapter: an agentic platform that understands operational context and takes action, with the ambition to make physical operations increasingly autonomous. External Platform EMEA owns critical capabilities behind that transition. Depending on the team, your work could include: Reporting and intelligence. Own the reporting engine and products that turn the complexity of a fleet into answers customers can act on. Enterprise administration. Build how customers configure and control Samsara at scale, from permissions and device metadata to AI-assisted onboarding. Developer and agent platform. Build APIs, event systems, integrations, and tools that give applications and AI agents access to operational data and actions. Business-critical infrastructure. Own billing, license assignment, and usage metering: systems central to how Samsara sells, delivers, and grows its products. The long-term opportunity is rooted in t

Work Flexibility: Hybrid Stryker is delighted to share that we are now accepting applications for our Stryker GQO Manufacturing Operations Development Programme – to begin in September 2027. The programme is a 23-month structured programme that provides participants the opportunity to be part of a site based Operations and Manufacturing team, with exposure to cutting edge technology varying from traditional manufacturing processes to additive manufacturing and robotics, across the Joint Replacement Stryker division T in Ireland. The programme focuses on developing the skillset, mindset and toolkit of each participant to enable them for success within Manufacturing Operations to support our wider business to be successful. During each rotational assignment participants will be responsible for (not limited to): Participating in various project teams. Work with a highly creative manufacturing team to invent and develop innovative new product concepts. Implementation of new manufacturing processes and technology. Implement quality systems and work closely with Engineering, Operations, Quality and Advanced Operations Provide process validation support both internally and with vendors. Develop and qualify new test equipment and methods. Research, specify and qualify new test or prototyping equipment. Participate in various trainings to develop your skillset, mindset and toolkit. What Are We Looking For? Dedicated achievers: People who thrive in a fast-paced environment and are determined & driven to ensure commitments are met, projects are delivered and meets regulations and expectations. Curious learners: People who seek out cutting-edge research and inform

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

Senior Configuration Management Engineer Company: The Boeing Company The Boeing Global Services (BGS) Government Training Engineering organization is seeking a Senior Configuration Management Engineer for the Product Lifecycle Management (PLM) team in Berkeley, MO . As part of our team, you will be focused on configuration management ensuring engineering changes are documented and managed throughout the development lifecycle. You will be a part of an organization that provides industry leadership in commercial and defense aviation training and capabilities, including custom software development, engineering and technical services, and a range of services to support training centers and pilot provisioning worldwide. Position Responsibilities: Support assignment of configuration items/computer software configuration items (CS/CSCI) identifiers Manage program technical baselines and interfaces Prepare and coordinate change documentation and Engineering Change Proposals (ECP) / Contract Change Proposals (CCPs) Perform configuration audits and verification activities for hardware, software, systems Prepare metrics and status reports Attend Engineering and Configuration meetings, working groups and boards. Work with Boeing program teams, Business Partner, Customer and Suppliers Educate and/or train others on program CM processes Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering, Engineering Technology (including Manufacturing Technology), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement 5+ years

Work Flexibility: Hybrid Stryker are delighted to be hiring talented Electrical Engineers for our “R&D Graduate Programme” – to begin in September 2027. . Please ensure your CV includes your academic results or current trending results (if final results are not yet available). The “R&D Graduate Programme” is a 24-month structured graduate development programme in the R&D function. The programme rotates on a 6-month rotating assignment basis in order to learn and develop the basic knowledge and skills in the various engineering areas of expertise. The position rotates on a 6 monthly assignment basis: Design Advanced Operations / Research and Technology Development Advanced Quality Engineering Engineering Services (CAD/Prototype/Test Lab) What Are We Looking For? Dedicated achievers : People who thrive in a fast-paced environment and will stop at nothing to ensure a project is complete and meets regulations and expectations. Curious learners . People who seek out cutting-edge research and information to expand and enhance their ability to develop new ideas into reality. Collaborative partners . People who build and leverage cross-functional relationships to bring together ideas, information, use cases, and industry analyses to develop best practices. During each rotational assignment participants will be responsible for: Electrical: Investigating, designing, developing and implementing new devices and technology. Accelerating the launch of new products by removing the technology unknowns Working within the quality systems and work closely with Design, Quality and Manufacturing Engineering. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron's core memory technology critical for AI-enabled customers. The R&D development takes place in an industry-leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on driving front-end process integration for future DRAM technology nodes, owning integration schemes, DOEs, and silicon learning from development through transfer to manufacturing. You will strengthen that work with device and process modeling, using simulation and device physics to build predictive insight, shorten learning cycles, and guide integration decisions. This is an integration role first; modeling is a tool you bring to it, not a standalone assignment. Responsibilities include, but not limited to: Own process integration for assigned DRAM FEOL modules: define integration schemes, drive unit process and module interactions, and deliver on technology node milestones. Design and execute DOEs on silicon, analyze inline, parametric, and yield data, and drive root cause to resolution. Apply device and process modeling (TCAD, Silvaco, Sentaurus, or comparable) to evaluate process interactions, device behavior, and scaling options, and to prioritize experiments before committing silicon. Correlate simulation results with experimental and silicon data to improve model accuracy and deepen process understanding.</li

JOB DESCRIPTION: Program Highlights Abbott’s 3-year accelerated development program that builds broad Operations experience through three rotational assignments. Upon completing the program, OPDP members transition into full-time roles and continue building their careers at Abbott, leveraging the skills, experience, and network gained through the program. Program Overview Over the course of the 3-year program, OPDP members complete three key developmental experiences designed to accelerate learning and career growth. PDP members rotate through three assignments across different divisions or functional areas, including Technical, Supervisory, and Operations Excellence roles. Rotation opportunities may include Engineering, Materials Management, Project Management, Plant Quality and Operational Excellence, providing broad exposure to manufacturing and operations. Program Rotation Model Three 12-month assignments across different divisions and/or functional areas. Gain diverse experiences with each assignment led by a different Assignment Manager. Complete the program with an international assignment in the final year, graduating the program in June 2030 for those starting in July 2027. Requirement Bachelor’s degree/master’s in engineering or related disciplines (Only for graduates of 2025 to 2027 only) Interest in pursuing a career in Operations – Engineering, Manufacturing Production, Plant Quality, Supply Chain, etc. Track record of outstanding academic performance and co-curricular activiti

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The TSE Technician – HBM Probe supports Test Solutions Engineering (TSE) activities for High Bandwidth Memory (HBM) products at wafer probe. The role executes operational, data, and system‑level tasks that enable efficient HBM probe evaluations, production releases, and yield/debug activities , working closely with TSE engineers across NPI and high‑volume manufacturing phases. This position is critical in supporting fast‑paced HBM development cycles where tight execution, data discipline, and cross‑functional coordination are essential. Key Responsibilities Support HBM probe activities by executing requests from TSE engineers, including: Evaluation and production lot assignment, tracking, and coordination Lot handling, status monitoring, and execution follow‑up Attribute tagging, traveler setup, and hold / release execution Support experiments and investigations related to: Yield improvement Test time optimization Test errors and probe‑related issues Perform data mining and generate reports with basic analysis to support: Engineering debug and root‑cause investigations NPI learning cycles and ramp readiness Production