Mechanical Simulation Engineer Jobs

Mechanical Simulation Engineer – Advanced Packaging — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Role Overview We are seeking a Staff Simulation Engineer to build an end-to-end aerial autonomy simulation stack at DoorDash Labs. This is a highly technical, hands-on leadership role focused on defining and implementing the simulation architecture that underpins autonomy development, validation, CI/CD testing, and pilot training. You will operate as the technical authority for simulation: owning core architecture decisions, developing key components yourself, and setting engineering standards. You will build and mentor a small, high-caliber simulation team while remaining deeply involved in implementation and system design. This role is ideal for someone who has built simulation systems from first principles, understands simulator internals deeply, and is excited to create a world-class platform from scratch. Key Responsibilities Architect and implement an end-to-end simulation stack for aerial autonomy at DoorDash Labs.. Develop high-fidelity simulation capabilities, including: Flight dynamics modeling Contact modeling and constraint handling Sensor and perception simulation Autonomy software-in-the-loop (SITL) integration Design and implement scalable simulation infrastructure to support: Regression testing in CI/CD pipelines Continuous validation of flight autonomy and autopilot software stack Mission-level testing and scenario generation Build cloud-deployed simulation systems to enable large-scale parallel testing and pilot training. Partner closely with autonomy, controls, and aircraft teams to ensure simulation fidelity and validation alignment. Establish technical direction, architecture standards, and performance benchmarks for simulation. Mentor and grow a small team of simulation engineers while remaining deeply hands-on. Required Qualifications Master’s or PhD in Computer Science, Electrical Engineering, Mechanical Engineering, Robotics, Aerospace Engineering, or a related field. 10+ years of experience in robotics or physics-based simulation. Deep expe

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve people's lives. About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will work closely with mechanical, electrical, controls, and robotics engineers to evaluate designs before hardware is built, identify risks early, and guide critical architecture decisions. This role spans structural and thermal analysis and design across robotic subsystems including actuators, mechanisms, structures, electronics, and integrated systems. You will develop simulation workflows that improve engineering velocity, increase confidence in design decisions, and help us build more capable, reliable, and manufacturable robotic platforms. This role is based in San Francisco, CA. This role will be expected to be in office 4 days per week and offer relocation assistance to new employees. In this role, you will: Perform thermal simulations to assess heat generation, cooling strategies, thermal interfaces, and system-level thermal performance Partner with mechanical, electrical, and controls engineers to influence design decisions early in development Build simulation models to evaluate robotic actuators, transmissions, mechanisms, structures, soft goods, and integrated assemblies Correlate simulation results with physical testing and develop methodologies to improve model accuracy Support architecture trade studies by evaluating design concepts before hardware is built Develop simulation workflows, standards, and best practices that scale across the robotics o

Systems Engineer (Modeling & Simulation) (Associate or Mid-Level) Company: The Boeing Company Boeing Defense & Security (BDS) is looking for an Associate or Mid-Level Systems Engineer (Modeling & Simulation) (Level 2 or 3) to join our multi-disciplined engineering team in Albuquerque, New Mexico designing and developing advanced concepts on a DOD propriety program . This position will join a multi-disciplined team of engineers and scientists to develop and test advanced concepts for the Department of Defense. Work could include such things as image processing and analysis, radiometry, modeling and simulation, evaluation of field data to anchor models, and wherever the data may lead throughout the program. The ideal candidate will have strong MATLAB or Mathematic skills, an interest in data analysis; modeling and simulation; and some knowledge of optics and electro-optics. Position Responsibilities: Assists in developing and validating requirements for various electro-optical systems and components Uses data analysis results and output of mod/sim tools to assist in the development and validation of requirements for electro-optical systems, mechanical systems, interconnects and structures Works with engineering teams to collect and analyze data used to anchor models Performs complicated trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts critical analyses of various kinds to validate performance of designs to requirements Defines and conducts tests to validate performance of designs to requirements and anchor models to fi

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a Mechanical Engineer to design, build, and own the mechanical side of our robotic actuator dynamometer and test infrastructure. You will create the test stands, couplings, fixtures, load paths, guarding, and serviceable lab hardware that enable rigorous characterization of robotic actuators. This role combines precision mechanical design with hands-on lab work. You will take robotic actuator test infrastructure from requirements and analysis through CAD, fabrication, assembly, commissioning, and iteration, partnering closely with electrical and software engineers to deliver safe, flexible, high-uptime test cells. In this role, you will Own the mechanical architecture of dynamometer and actuator test cells, including frames, bases, load paths, alignment, guarding, and serviceability. Design dynamometer structures, robotic actuator fixtures, load-motor mounts, couplings, shafts, bearings, adapters, and torque-reaction hardware. Translate robotic actuator test requirements into robust mechanical systems for torque, speed, thermal, durability, backdrive, efficiency, and failure testing. Perform first-principles analysis and simulation for stiffness, strength, fatigue, vibration, thermal growth, critical speed, and safety factors. Create precise, repeatable alignment strategies that protect test articles, load machines, sensors, and couplings. Design modular fixturing that supports rapid changeover across actuator and motor variants without compromising measurement quality. Work closely with electrical engineers on cable routing

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing: Titleist is seeking a passionate and driven Associate Research Engineer to help shape the future of golf club performance through innovation, engineering, and data-driven design. In this role, you will apply engineering principles, scientific methods, and advanced computational tools to explore emerging technologies, analyze golf club designs and biomechanical swing dynamics, and validate concepts that contribute to next-generation Titleist products. Working alongside world-class researchers, engineers, and product designers, you will leverage modeling, simulation, and testing techniques to solve complex design challenges and uncover new opportunities for performance advancement. You'll collaborate across Research, Design, Product Development, Testing, Manufacturing, Sales, and Marketing to evaluate concepts, support product innovation, and translate technical findings into meaningful product improvements. This is a unique opportunity to deepen your expertise in golf club research and development, contribute to patentable technologies, and play a direct role in creating the high-performance products trusted by golfers around the world. What You Bring: Bachelor’s degree in Mechanical Engineering, Engineering, Computer Science, or a related field required. Strong foundation in engineering analysis, problem-solving, and product development. Experience with MATLAB and/or Python required. Exposure

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a senior Actuator Electromagnetic Design Engineer to lead the development of custom electromechanical actuators for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, reliability, and manufacturing teams. This role focuses on the design, integration, and validation of precision electromechanical systems, including motors, transmissions, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuators, including the design, simulation, integration and sourcing of custom electromagnetic components. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-loop performance. Devel

Experienced or Senior Digital Design Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks a Digital Design Engineer to join our team in Huntsville, AL and play a vital role in the Patriot Advanced Capability-3 (PAC-3) program, one of the world's most advanced air and missile defense systems. This is your opportunity to work in a dynamic environment where your skills will directly contribute to protecting critical assets and ensuring mission success. If you are passionate about defense technology and want to make a real impact, we want to hear from you! Position Responsibilities: Design high speed digital circuits and perform signal integrity analysis Focus on electronic systems and electrical design, simulation and verification/validation testing of high-speed printed circuit boards (PCB) throughout full product development cycle Providing design guidelines and support for system architecture design, board layout, product bring-up, debug, validation, and factory builds This position requires obtaining a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement 3 or more years of related work experience Experience in digital circuit design Preferred Qualificatio

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. As a PCB Power Design Engineer, you will design and optimize power distribution systems for Tenstorrent’s next-generation AI accelerator cards, balancing performance, area, cost, and reliability. You will contribute across the full power design lifecycle, from component selection and simulation through board bring-up, validation, debugging, and production readiness. Working closely with hardware, firmware/software, thermal, mechanical, and validation teams, you will help deliver robust power architectures for high-performance AI systems. This role is hybrid, based out of Toronto, Canada. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An electrical engineer with experience designing, analyzing, and debugging power distribution systems for high-performance or high-power products. A hands-on engineer who enjoys moving from schematics and simulations into lab bring-up, testing, troubleshooting, and design validation. A systems-oriented collaborator who can work effectively across hardware design, firmware/software, thermal, mechanical, and validation teams. A detail-oriented problem solver who balances electrical performance, power integr

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer Company: The Boeing Company Boeing Defense, Space and Security (BDS) is looking for an Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer (Level 3) to join our team in Huntington Beach or El Segundo, California. This position will be joining a team of engineers, analysts and staff within the Space and Missile Systems (SMS) and Boeing Technology and Innovation (BTI) Mission Systems organizations in the development, assembly, integration, and test of a constellation of satellites. The SMS and BTI organizations develop and capture technology for designing disruptive Mission Systems solutions. Focused on visible and infrared spectrum Electro-Optics Infrared (EO/IR) sensors operating in Space and Air domains, our growing team is leaping ahead of our competition with an exceptional mix of mission architectures, sensor designs, and algorithms for advanced image and data processing. Position Responsibilities: Develops and validates requirements for various communication, sensor, electronic warfare and other electromagnetic systems and components Develops and validates electromagnetic requirements for electrical\electronic systems, mechanical systems, interconnects and structures Develops architectures to integrate systems and components into higher level systems and platforms Performs trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts tests to validate performance of designs to requirements Manages appropriate aspe

About the Team OpenAI’s Industrial Compute team is building and productizing infrastructure capabilities that help organizations deploy and operate advanced AI systems at scale. The team works across AI hardware, systems engineering, physical infrastructure, and customer delivery to turn emerging technologies into reliable, repeatable infrastructure solutions. Our work sits at the intersection of technical strategy, product development, engineering, and deployment. We partner closely with customers and internal engineering teams to solve complex infrastructure challenges spanning compute, power, cooling, controls, and facility efficiency. About the Role We are seeking a senior, hands-on Data Center Infrastructure Architect to develop and optimize the physical infrastructure required for large-scale AI deployments. This is a broad technical role spanning data center architecture, electrical and mechanical systems, high-density compute, controls, telemetry, and digital modeling. You will use simulation, operational data, and digital-twin approaches to evaluate infrastructure designs, identify system-level constraints, and improve efficiency, reliability, cost, and speed of deployment. The ideal candidate can move fluidly between first-principles analysis, facility and equipment design, computational modeling, engineering review, and real-world implementation. You should be comfortable working across disciplines rather than operating solely within electrical, mechanical, or software boundaries. Key Responsibilities Define system-level architectures for high-density AI data centers across power, cooling, IT equipment, controls, and facility infrastructure. Develop digital twins and other computational models that represent the behavior of data center systems under changing workloads, environmental conditions, equipment configurations, and failure scenarios. Use design and operational data to identify constraints, improve PUE and related efficiency metrics, and optimize

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Experienced or Senior Digital CCA Design Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks a Digital CCA Design Engineer who is a subject matter expert in high-speed digital circuit design , signal integrity analysis , and electrical design to join our time in Huntsville, AL. This position will p lay a vital role in the Patriot Advanced Capability-3 (PAC-3) program, one of the world's most advanced air and missile defense systems. This is your opportunity to work in a dynamic environment where your skills will directly contribute to protecting critical assets and ensuring mission success. If you are passionate about defense technology and want to make a real impact, we want to hear from you! Position Responsibilities: Focus on electrical design, simulation, verification, and validation testing of high-speed printed circuit board design and electronic system Lead product development cycles Collaborate with cross-functional teams, including other engineering disciplines Keeping current on related industry best practices and technological advancements This position requires obtaining a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement. 3 or more years of related experien