Module Quality Engineer Jobs

About the team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the role: We are seeking an experienced Optical Network Engineer to lead Laser related work within our optical interconnect efforts for large-scale compute systems. The role also requires broad, hands-on optical validation experience across IM/DD-based interconnects, working from lab characterization through production readiness and scaled deployment. In this role you will: Drive laser-focused requirements and technical direction within the broader optical interconnect roadmap. Lead evaluation and validation of optical components and subsystems, including laser-based elements, in lab and production-representative environments. Support end-to-end optical testing for IM/DD interconnects (e.g., module/system bring-up, characterization, debug, and readiness for scale). Work with external partners to align on development milestones, performance targets, and quality expectations. Own technical issue triage and resolution across performance, reliability, and manufacturability topics. Collaborate across internal teams to support integration, rollout, and operational success at scale. You might thrive in this role if you have: Strong experience in laser-focused optical engineering (development, validation, manufacturing readiness, or field support). Broad hands-on background with IM/DD optical technologies and optical test/debug workflows. Experience working with external suppliers/manufacturing partners and production-oriented execution. Demonstrated ability to debug complex t

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Design, develop, and debug real-time embedded firmware for IoT systems, including gateways, lighting control, and environmental monitoring and control solutions. Maintain, optimize, and improve firmware for existing RTOS-based devices. Collaborate cross-functionally with BSP, HW, ID, Backend, Mobile, FE, PM, and PA teams to deliver high-quality products. Contribute to system-level architecture decisions for multi-module communication Document software architecture, tuning methods, and test results. Perform code reviews, ensuring best practices in coding standards. Participate in troubleshooting and root-cause analysis for firmware issues. Collaborate with QA and manufacturing teams for production firmware validation, factory firmware, and calibration procedures. Requirement (Must-Haves) Strong knowledge of networking fundamentals and protocols like TCP/IP (IPv4 and IPv6), socket programming, and higher-level protocols such as HTTP, WebSockets, or MQTT used in IoT systems. Experience developing firmware in a Real-Time Operating System (RTOS) environment (such as FreeRTOS or Zephyr). Proficient in C/C++ programming in embedded environments with RTOS. Understanding of memory management, interrupt handling, and power management in constrained systems. Familiarity with Git version control. A team player, who is self-m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Seeking a Principal Engineer – ASIC SoC Design to drive IP, Subsystem, and SoC development for next‑generation memory and storage products, requiring strong hands‑on expertise in micro‑architecture, RTL design, and end‑to‑end SoC execution, along with close collaboration across global teams. Key Responsibilities Own end‑to‑end IP and SOC development from micro‑architecture through RTL compose, integration, and physical hardware assistance. Own IP and Subsystem design from scratch, ensuring high‑quality, reusable RTL. Drive SoC integration, including CDC, lint, synthesis, STA, and power analysis. Define and review module interfaces and system‑level architecture. Collaborate closely with Architecture, Verification, FW, DFT, Synthesis, and Physical Design teams. Support post‑silicon debug and bring‑up activities. Provide technical mentorship and participate in design and methodology reviews. This role is expected to utilize Micron-approved AI tools and AI-enabled workflows to improve engineering productivity, design quality, automation, and decision-making across the SoC development lifecycle. The engineer will apply AI-assisted solutions for design analysis, documentation, coding, debug, and workflow optimization while ensuring compliance with Micron AI governance standards. Required Qualifications 12+ years of hands‑on IP & SoC RTL design experience. Strong expertise in micro‑architecture, Verilog/System Verilog, and RTL integration. Solid kn

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Working place : Hiroshima Manufacturing site (Fab15) 勤務地：広島製造拠点(Fab15) As a Process Integration Engineer at Micron Fab15, you will help ensure process stability and drive yield/quality improvements by leveraging standard procedures, data analysis, and cross-functional collaboration. You will support early detection, root-cause isolation, and corrective/preventive actions for process deviations in a high-volume manufacturing environment. 職務概要 Micron Fab15 プロセスインテグレーションエンジニアとして、標準手順データ分析、ならびに部門横断的な協業を活用し、プロセス安定性を確保するとともに、歩留まりおよび品質改善を推進します。 Job role more in detail, Optimizing Device performance to improve not only yield but also repair density consumption. Need to think about appropriately HVM DRAM process condition especially focusing on Device process condition. Need to collaborate with other PI module teams and Each Area teams and also discuss with PE/GQ/ Design and TD device teams to take balance for deciding HVM device process condition Need to collaborate with other site OMT, ID1 and TD. By utilizing AI, summarize evaluation data and suggest new idea for device performance improvement and yield. 職務内容詳細 歩留まり改善を行うだけでなく、Repair Density消費の最適化を含めたデバイス性能の最適化を行う。 特にデバイスプロセス条件に注目し、HVM DRAM プロセス条件を適切に検討する。 他のPI moduleチームおよび、各エリアチームと連携し、さらにPE/GQ/Design /TDデバイスチームと議論しながら、HVMデバイスプロセス条件のバランスを取った意思決定を行う。 他サイトのOMT,ID1,TDチームとも連携する。 AIを活用し、評価データのまとめ、さらには、deviceのper

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are undergoing a historic expansion with our new fabrication facility in Boise, ID. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry and AI. We’re building a next-generation manufacturing capability in Boise (ID1), partnering closely with global teams to bring advanced DRAM technology into a greenfield fab. This is a highly collaborative environment where we solve complex integration challenges and directly impact yield, cost, and product quality. If you enjoy working at the intersection of device physics and manufacturing, you’ll find strong ownership and technical depth here. As a Senior Process Integration Engineer in our Advanced Technology and Engineering group, you will play a key role in transferring and scaling advanced DRAM nodes into high-volume production. You’ll lead integration efforts across modules, drive yield ramp, and resolve complex process interactions. This role is critical to achieving production readiness and sustaining best-in-class performance as we launch a state-of-the-art fabrication facility. Responsibilities: Lead module ownership including root cause analysis and fast-paced failure investigation Drive yield, cost, and quality improvements using data-driven met

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Engineering Execution Manager within Compute DRAM Product Engineering , you will lead engineering program execution for assigned DRAM products from pre-silicon readiness through qualification, production ramp, and transition to sustaining teams. This is an individual contributor leadership role, you will lead product execution across functional engineering teams through influence, technical judgment, and accountability. You will also collaborate across engineering and business organizations to build integrated plans, solve complex execution challenges, and deliver products that meet quality, yield, schedule, supply, and business requirements. Your work will have a direct impact on bringing innovative memory products to market! This technical leadership opportunity will allow you to develop broad product knowledge, strengthen your leadership skills across different functional groups, and learn across the semiconductor product lifecycle. Responsibilities Lead product execution from pre-silicon readiness through qualification and production ramp, building integrated schedules, dependencies, actions and decision points. Collaborate across Product Development, Design, Technology Development, Test, Package, Module, Quality, Manufacturing, Planning, and business teams to align technical and product achievements. Drive problem-solving for product risks and failures by facilitating issue triage, root-cause alignmen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Process Integration (PI) team is at the forefront of technology development and manufacturing excellence. We focus on optimizing semiconductor processes to improve yield, reduce costs, and enable next-generation memory devices. By collaborating with cross-functional teams—including Technology Development, Product Engineering, and Manufacturing—the PI team ensures seamless technology transfer and drives continuous improvement in quality and reliability. Join our dynamic Process Integration team and contribute to the development and optimization of advanced semiconductor processes. This entry-level role offers hands-on experience in yield improvement, cost reduction, and technology transfer for next-generation devices. You will work in a fast-paced environment, collaborating with cross-functional teams to ensure best-in-class quality and performance. Responsibilities Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality. Run Design of Experiments (DOE) to enhance process capability and margin. Monitor trends and sustain line stability. Address top detractors to improve device yield and reliability. Lead workshops during technology transfer for next-generation devices. Start up, develop, and optimize processes for product quality and reliability.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Working place : Hiroshima Manufacturing site (Fab15) 勤務地：広島製造拠点(Fab15) As a Process Integration Engineer at Micron Fab15, you will help ensure process stability and drive yield/quality improvements by leveraging standard procedures, data analysis, and cross-functional collaboration. You will support early detection, root-cause isolation, and corrective/preventive actions for process deviations in a high-volume manufacturing environment. 職務概要 Micron Fab15 プロセスインテグレーションエンジニアとして、標準手順データ分析、ならびに部門横断的な協業を活用し、プロセス安定性を確保するとともに、歩留まりおよび品質改善を推進します。 Job role more in detail, Optimizing Device performance to improve not only yield but also repair density consumption. Need to think about appropriately HVM DRAM process condition especially focusing on Device process condition. Need to collaborate with other PI module teams and Each Area teams and also discuss with PE/GQ/ Design and TD device teams to take balance for deciding HVM device process condition Need to collaborate with other site OMT, ID1 and TD. 職務内容詳細 歩留まり改善を行うだけでなく、Repair Density消費の最適化を含めたデバイス性能の最適化を行う。 特にデバイスプロセス条件に注目し、HVM DRAM プロセス条件を適切に検討する。 他のPI moduleチームおよび、各エリアチームと連携し、さらにPE/GQ/Design /TDデバイスチームと議論しながら、HVMデバイスプロセス条件のバランスを取った意思決定を行う。 他サイトのOMT,ID1,TDチームとも連携する。 Job responsibilities Take responsibility for creating SWR for device performance improvement proactively. Take responsib

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron’s core memory technology serving AI-enabled customers. The R&D development takes place in an industry leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on the development and integration of critical technology which enables future DRAM memory scaling for Micron. You will develop the structural and electrical requirements for one or more modules and work in conjunction with Process Development and supporting teams to seamlessly integrate new module solutions into the entire process flow. Responsibilities include, but not limited to: Engineer and develop novel process flows for critical modules. This includes creating structural and electrical specifications as well as design rules for new process flows. Utilization of creative problem-solving skills to develop and optimize new process flows which improve performance and reduce the cost of future memory chips. Design experiments and analyze results using statistical analysis software. Results are applied to directly enhance yield. (DOE) Work cross-functionally with multiple groups including Design, Product Engineering, Process Development, Modeling, Yield Enhancement, Electrical and Physical Failure Analysis, Parametric, and Quality te

About the Team Frontier Systems Foundations, part of Compute Foundations at OpenAI, builds the systems software foundation that turns new compute infrastructure into reliable, usable capacity for frontier model training. Our mission is to make some of the world's largest GPU clusters work reliably for frontier training. We bring new platforms and clusters online, safely maintain installed fleets, and partner with hardware, infrastructure, and research teams to resolve the system-level issues that keep jobs from running. That means building and maintaining the software closest to the machine: Linux and Ubuntu operating-system images, kernels and modules, drivers, packages and repositories, disks and boot configuration, firmware integration, provisioning, and system-level validation. We make these components reproducible, compatible, and safe to operate across heterogeneous fleets. About the Role We are looking for systems software engineers with deep Linux and host-systems experience to build, qualify, and maintain the operating-system foundation for OpenAI's frontier compute fleet. Relevant backgrounds include kernel and module development, Linux distribution or image engineering, package management, firmware and driver integration, disks and boot, and bare-metal provisioning. You'll work closely with hardware engineers, vendors, and infrastructure teams to bring up new platforms, integrate system components, and debug failures across firmware, disks, boot, operating systems, kernels, drivers, and workload interactions. Your work will directly influence how quickly new capacity becomes usable and how reliably large GPU fleets operate. You should be comfortable writing and maintaining production-quality systems software and automation, but we do not expect expertise across every layer. This is an opportunity to go deep on challenging systems problems while building the image, package, qualification, and recovery paths that power the next generation of frontier models

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities and Tasks • Collaborate with multi-functional network teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. • May require travel to global Micron sites to foster collaboration and drive execution. • Communicate module related issues to the Fab engineering and leadership teams. • Design, execute, and analyze experiments to improve fab process, yield, and quality. • Collect and interpret complex data to optimize Fab processes and increase yields. • Engage and/or lead cross-area engineering teams to tackle process issues. • Work closely with global partners to stay ahead of on module related topics and process alignment projects. • Collaborate with other PI module owners and sister fabs to drive business process alignment • Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues • Promote network synergy through improved benchmarking and standardization of known engineering best-known methods (BKMs), business process. Requirements: • Bachelor’s or advanced degree in Engineering or Science is required • Strong a

MeltPlan | Planning Engine for the Built Environment MeltPlan is building the “planning engine” for the $14 Tn construction industry, an AI system designed specifically to optimize decisions before construction begins. While design software optimizes use and aesthetics and construction software optimizes execution and control, MeltPlan is building the missing layer - software that optimizes decisions and tradeoffs upstream, before scope is locked, procurement begins, and change orders become inevitable. MeltPlan’s long-term goal is to help teams make construction “boring” by making planning more intense: surfacing constraints and tradeoffs early, aligning stakeholders before plans are frozen, and reducing the need for late-stage redlines, rework, and change orders. MeltPlan is founded by operators who have built at scale. Kanav previously co-founded Innovaccer, a $3Bn health-tech company focused on making US healthcare more affordable and accessible. He’s now applying that systems-level thinking to construction.He’s joined by Tanmaya Kala, former Project Executive at DPR Construction, who led large commercial, healthcare, and life sciences projects. We combine deep tech scale with real construction execution. What This Role Really Is We are hiring a UI Engineering Lead with minimum 10 years of work exp , to drive frontend architecture scalable UI systems, and user experience across internal and external applications. The role involves building modern web applications using React, TypeScript, Next.js, Vite, and TailwindCSS, while leading reusable component development and microfrontend architecture using Module Federation. You will work closely with product and engineering teams, integrate Firebase services, and ensure frontend quality through Playwright and Vitest testing frameworks. The ideal candidate should have strong expertise in frontend engineering, scalable design systems, and modern UI architecture. What You’ll Do Build and maintain scalable frontend

Education: Degree, Post graduate in Computer Science or related field (or equivalent industry experience) Experience: Minimum 5 years of Product experience in Finacle Core Banking product (Infosys/Edgeverve) Working experience on Finacle 11 requirement and product capability along with Customization architecture Experience in handling Finacle Interfacing requirements (Custom and Product APIs/Connect 24/Finacle Integrator) Need to have experience of direct interaction with Clients Technical Skills: Good understanding of Finacle Product Architecture & Customization layers. Finacle customization flow understanding (New custom menu, Reports - MRT & Jasper, Batch job, Product menu customization, FI, EOD-BOD process and debugging) Experience in best practices to be followed in Oracle (SQL, PL/SQL, Stored Procedures, Triggers, Functions) related to Finacle application. Experience in Finacle scripting, Unix shell scripting and Report designing. Good understanding of Finacle Integrator and feasible enhancements to the same. Functional Skills: Finacle Core Banking Functional knowledge Good understanding of Banking domain and terminologies used. Finacle certification from Infosys will be added advantage Finacle CRM and Admin module (FINFADM/SSOADM) Experience in following best Coding, Security, Unit testing and Documentation standards and practices Experience in Agile methodology. Ensure quality of technical and application architecture and design of systems across the organization. Effectively research and benchmark technology against other best in class technologies. Soft Skills: Able to influence multiple teams on technical considerations, increasing their productivity and effectiveness by sharing deep knowledge and experience. Self-motivator and self-starter, Ability to own and drive things without supervision and works collaboratively with the teams across the organization. Have excellent soft skills and interpersonal skills to interact and present the ideas

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Global Quality (GQ) Non-Volatile Memory Quality Reliability Assurance (NVMQRA) Returned Material Authorization (RMA) Failure Analysis (FA) Engineer at Micron Technology, you will perform advanced system-level failure analysis of customer-returned products while leveraging AI-enabled diagnostic tools, data analytics, and automation technologies to accelerate root-cause determination. You will collaborate with cross-functional engineering teams to drive corrective actions, quality improvements, and customer satisfaction initiatives. In addition, you will lead strategic projects focused on AI transformation, process automation, operational excellence, and continuous improvement of Failure Analysis capabilities across the organization. Responsibilities and Tasks Perform FA of Customer Returns • Understand customer failure mode and observed fail conditions • Perform initial FA, including usage of Agentic-AI tool • Replicate customer test environment • Perform Automated Test Equipment (ATE) analysis and interpret results • Perform detailed fault isolation once failure has been confirmed • Collaborate with cross-functional resources and support groups to identify root cause and corrective action • Summarize findings and submit for Component / Firmware / Module FA Provide FA Diagnostic Reports to Internal Customers • Verify summarize analysis at electrical and physical level • Identify potential risks