Mts Rtl Verification Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Build What’s Next in Spares Engineering Your Opportunity Join a high-impact engineering team where your ideas can shape performance across a global semiconductor manufacturing network. In this role, you will lead Spares Engineering initiatives across cost, productivity, quality, and supply resilience , while owning broader strategic programs that extend beyond spares. You will combine technical expertise, data-driven decision-making, and program leadership to solve complex challenges, influence stakeholders across sites and functions, and deliver scalable solutions with measurable business impact. What You Will Lead Spares Engineering Leadership Lead end-to-end Spares Engineering programs that improve equipment availability, cost efficiency, quality, productivity, and supply resilience across the network Serve as the network technical expert and trusted advisor to drive assigned spares categories and related programs Set and execute global category strategies, including lifetime extension, CCRR, alternate sourcing, consumption reduction, and other priority initiatives Use performance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Your Opportunity Join a high-impact engineering team where your ideas can shape performance across a global semiconductor manufacturing network. In this role, you will lead Spares Engineering initiatives across cost, productivity, quality, and supply resilience , while owning broader strategic programs that extend beyond spares. You will combine technical expertise, data-driven decision-making, and program leadership to solve complex challenges, influence stakeholders across sites and functions, and deliver scalable solutions with measurable business impact. What You Will Lead Spares Engineering Leadership Lead end-to-end Spares Engineering programs that improve equipment availability, cost efficiency, quality, productivity, and supply resilience across the network Serve as the network technical expert and trusted advisor to drive assigned spares categories and related programs Set and execute global category strategies, including lifetime extension, CCRR, alternate sourcing, consumption reduction, and othe

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities · Serve as the site technical authority for electrical infrastructure up to 230kV, setting strategy, design criteria, engineering standards, protection philosophies, and technical direction. · Lead long-term planning for electrical capacity, reliability, resilience, asset lifecycle, power quality, energy performance, and technology deployment to support manufacturing growth. · Provide authoritative technical recommendations and assurance for major capital projects, brownfield expansions, utility interfaces, substations, emergency generation, DUPS, protection systems, and power quality solutions. · Own site-wide electrical reliability and risk management, including FMEA, system modelling, protection coordination, contingency planning, lifecycle management, and elimination of single points of failure. · Lead resolution of unprecedented or high-impact technical issues and major incidents, driving root cause analysis, recovery, sustainable corrective actions, and organizational learning. · Provide technical assurance for critical designs, commissioning, switching, energization, temporary configurations, operational readiness, and safe integration of new systems. · Influence critical engineering

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Summary As an APTD MTS (Member of Technical Staff) based in Taiwan, you will lead and develop the IoT engineering team delivering Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will set technical direction and priorities, drive execution from proof-of-concept through deployment, and build scalable, secure solutions that improve quality, productivity, and early risk detection. You will partner cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while building a culture of safety, accountability, and continuous learning. Key Responsibilities Lead, coach, and develop the IoT engineering team; set clear expectations, provide regular feedback, and build growth plans aligned to APTD needs. Own team execution: define goals/KPIs, prioritize the IoT roadmap, assign ownership, and ensure high-quality, on-time delivery from concept to factory deployment. Drive end-to-end IIoT solution development: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Drive machine vision solutions: guide hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm approach, performance validation, and deployment readiness. Partner with process, equipment, automation, quality, and IT/data platform stakeholders to tra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Develop system-level solutions, tools, and methodologies to optimize DRAM performance, power efficiency, and cost. Collaborate with multi-functional teams to ideate, evaluate, and implement innovative DRAM and memory system solutions. Analyze system behavior and assess solution effectiveness, making data-driven optimizations and trade-offs. Drive architectural innovation for current and future generations of DRAM technologies. Communicate complex technical concepts clearly and mentor team members through training and technical guidance. Using AI in applicable job functions Minimum Qualifications: Proven experience in memory design and product engineering, memory specifications and operations, or memory system architecture and usage. Minimum of 7 years of experience in the memory or semiconductor industry. Strong understanding of DRAM architectures and system-level interactions. Ability to analyze complex technical problems and drive solutions. Bachelor’s degree in Electrical Engineering, Physics, Computer Engineering, or a related field, or equivalent experience. Preferred Qualifications: Experience with advanced memory technologies such as LPDDR5/6, DDR5/6, GDDR6/7, or HBM3E/4. Strong analytical and problem-solving skills with a passion for innovation. Ability to identify complex technical challenges and develop creative, scalable solutions. Deep under

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary The Process Integration team drives process and structural optimization across semiconductor technologies to improve yield, quality, and reliability. The team partners with process engineering, technology development, manufacturing, and supplier teams to solve complex integration challenges and accelerate technology ramps through data-driven decision making and continuous improvement. Position Overview As a Process Integration Engineer, you will lead multi-functional efforts to improve structural uniformity, process integration, and product performance across critical semiconductor modules. You will apply engineering fundamentals, modeling techniques, and data analysis to identify root causes, develop innovative solutions, and drive manufacturing excellence. This role provides the opportunity to influence technology development, improve yield and quality outcomes, and shape standards across Micron's global manufacturing network. Responsibilities Lead process integration strategies for critical semiconductor modules to improve yield, quality, and reliability Develop and implement physics-based and process-based solutions to address structural uniformity and integration challenges Partner with process engineers, integration teams, and suppliers to optimize process interactions and achieve business objectives Apply model-based root cause analysis techniques to identify and resolve complex manufacturing issues</

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets . Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise , maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration , including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets . Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise , maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration , including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp. Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. This job requisition is to seek senior technical leaders in the field of process engineering to join ID1, reporting directly to Director of DE/WP/CMP. As a member of technical staff (MTS) or Senior member of technical staff (SMTS), you will play a pivotal role in driving innovation, leading technical projects, defining the technical roadmap, and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge DRAM process solutions to support yield ramp-up. Your contribution will have a lasting impact on the DRAM industry! Responsibilities for Process Engineering MTS/SMTS include (but not limited to): Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute

DRAM Architect – Principal Engineer | MTS - TPG — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Package Pathfinding Architect We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next‑generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further. This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end‑to‑end memory system architectures, to guide long‑term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron. Main Responsibilities: Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance. Lead cross‑stack co‑optimization across silicon, package, board, and system with package ce

Principal Device Engineer, or MTS — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal/Member of Technical Staff (MTS) IO/Clock Design Engeer to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Frontend Central Product Integration Engineering team strives to deliver leading edge process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with cross functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6, ID1), Taiwan (OMT), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central Process Integration Senior Engineer, you will be responsible to develop best optimum process to achieve product maturity. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline visibility to e