Npi Pm Jobs

Who We Are Verkada is transforming how organizations protect their people and places with an integrated, privacy-sensitive AI-powered platform that includes solutions for video security, access control, air quality sensors, alarms, intercoms, and visitor management. We’ve got serious momentum in the market: more than 30,000 customers (including 100+ of the Fortune 500), a $5.8B valuation , more than $1 billion in annualized bookings, and backing from CapitalG, Sequoia Capital, General Catalyst, Felicis Ventures, Next47 and more. Physical AI is one of the most consequential technology shifts of our time, and Verkada is at the center of it. You can look at all kinds of communities to see our platform’s impact in the world. It's the retailer that uses our agentic AI to deter theft before it happens. The warehouse that uses AI-powered alerts to make sure its team is protected on the floor with proper PPE. The school that’s alerted to a threat in real-time and triggers a lockdown in seconds, not minutes. We’re rapidly scaling this impact: today, more than 2 million Verkada devices are deployed across 170+ countries. About the Role The Cameras team is the cornerstone of Verkada's product ecosystem. We are looking for a Director of Firmware Engineering to lead the embedded software organization behind our flagship camera line. In this role, you will oversee multiple specialized firmware groups, driving the development of highly reliable, performant, and secure firmware deployed to hundreds of thousands of devices worldwide. You will manage and mentor a team of engineering managers and senior individual contributors, partnering closely with Hardware, Cloud, Product, and QA teams to define the roadmap and deliver cutting-edge edge-computing and imaging capabilities. What You’ll Do Partner on New Product Development (NPI): Work side-by-side with the Hardware and Electrical Engineering teams from the conceptual phase through mass production. You will co-design syst

The following description is not intended as an exhaustive list of all responsibilities, duties and skills required of personnel so classified. Management retains the discretion of adding or changing the duties of the position at any time. Key Responsibilities Lead end-to-end project management for (Client) and other Tier-1 OEM customers, from project initiation through FATP ramp-up and mass production. Act as the primary customer interface, managing project timelines, deliverables, and communication to ensure alignment with client expectations. Collaborate with cross-functional teams (engineering, operations, supply chain, quality, procurement, and finance) to drive successful program execution. Manage project schedules, risks, and resource allocation to ensure on-time delivery and cost targets are met. Support contract negotiations and business terms with (Client) customers, ensuring alignment with company goals and profitability. Provide technical and business support during customer meetings, audits, and on-site visits. Drive NPI (New Product Introduction) readiness, FATP line setup, and factory ramp-up by coordinating between client teams and internal operations. Monitor material readiness, demand planning, and capacity to support business continuity and minimize production risks. Conduct regular project reviews with internal stakeholders and clients, escalating risks and driving corrective actions. Support business development initiatives by analyzing (Client)/OEM roadmaps, identifying growth opportunities, and contributing to proposals and pricing strategies. Benchmark industry practices and client requirements to optimize cost structure, quality, and efficiency across FATP programs. Build and maintain strong client relationships, serving as the liaison to ensure clear communication between client, internal teams, and contract manufacturers. Qualifications Bachelor’s degree in Business, Supply Chain Management, Engineering, or related field. 2+ years of exper

The following description is not intended as an exhaustive list of all responsibilities, duties and skills required of personnel so classified. Management retains the discretion of adding or changing the duties of the position at any time. Position Overview BYD Electronics is seeking a Technical Program Manager (TPM) to support the development and delivery of thermal solutions for data center and server platforms. As an OEM supplier, this role will act as the technical interface between our engineering teams and our data center/server customers, ensuring successful product development, integration, and deployment. The TPM will coordinate cross-functional teams across thermal engineering, mechanical design, manufacturing, and customer engineering teams to drive programs from concept through mass production while meeting customer performance, quality, and schedule requirements. Key Responsibilities Customer Technical Interface Serve as the primary technical and program contact for data center/server customers. Work closely with customer engineering teams to understand system thermal requirements, server architecture, and integration constraints. Support technical discussions, design reviews, and issue resolution throughout the product lifecycle. Program Management Manage end-to-end programs for thermal solutions including heat sinks, heat pipes, vapor chambers, liquid cooling components, and related assemblies. Develop and maintain program schedules, milestones, and deliverables. Track risks, issues, and dependencies to ensure successful program execution. Cross-Functional Coordination Coordinate internal teams including thermal engineering, mechanical design, manufacturing, quality, and supply chain. Drive alignment between product design, testing, and manufacturing readiness. Facilitate cross-functional communication to resolve technical and program challenges. Product Development & NPI Support product development phases including design validation, prototy

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Role description: Ubiquiti Riga office is looking for an Electronics Hardware Engineer who shares our passion for innovation and technology and desire to do something extraordinary. You will participate in hardware design and hardware design audits/validations for UniFi products, like Ethernet Switches, Gateway routers, Access Points and Cameras with worldwide impact. Working closely with our R&D labs from different countries around the globe. We expect you to bring your experience, enthusiasm, and creativity wherever you go and put them into your work. You should think out of the box when finding solutions to new problems and make things work. Responsibilities: Design and verify electronic PCBs (considering HW, SW, FW, ME, SI, thermal, and acoustic possible issues) ensuring they meet high standards of performance and reliability, and work closely with BSP and FW team to figure out issues and system bring up. Be involved into product life phases from NPI, MP, to EOL. Co-work with function teams, PCB layout, component engineering, firmware, mechanical engineering, electrical power engineering, thermal engineering, QA, software engineering, project management, ID, compliance engineering, etc. to achieve cost-efficient, high-quality, and robust HW design. Work with OEM/CM on manufacturing definition, tests, efficienc

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a product manufacturing engineer, who will be responsible for driving technical initiatives related to manufacturing to ensure product success from concept to launch and through mass production with a specific focus on PCB and PCBa manufacturing and process. You’ll have the opportunity to work with a wide range of stakeholders, from design engineering and operations teams,TPMs, external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: In this role, you’ll be responsible for driving manufacturing and quality initiatives to ensure product success from concept to launch Lead the product design and the manufacturing process for next-gen AI hardware system development, you will have the opportunity to work with a wide range of stakeholders, from design engineering and operations teams, TPMs and external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. Lead the team to establish NPI product manufacturing process, systems and quality controls, defining clear milestones and deliverables, drive internal process improvements across multiple terms and functions Provide hands-on product manufacturing analysis during desi

Who We Are HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates. We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless. We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset. By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work. Join us as we reinvent work, so people everywhere can do their best work. About The Role HP IQ is seeking a Senior Power Systems Engineer to drive end to end system architecture, modeling, and optimization for wearable platforms. The candidate will build power models, define system use cases and operating modes, partner with product and engineering teams to meet aggressive power targets, and define manufacturing tests and field telemetry for NPI. The ideal candidate brings strong systems thinking, hands-on experience with low power architectures, and the ability to build models and telemetry to drive tradeoffs from SOC level to board level to maximize user runtime. What You Might Do: Power architecture responsibility for a wearable device covering SoC states, sensor, audio, and memory architecture tradeoffs at board level. Battery, PCM, and charging profile definition and validation Design power experiments, test plans, and measurement & telemetry mechanisms across firmware and hardware to optimize power and performance. Build and maintain system-level power models to model expected power consumption for user profiles. Map power models by subsystem, correlating

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

The following description is not intended as an exhaustive list of all responsibilities, duties and skills required of personnel so classified. Management retains the discretion of adding or changing the duties of the position at any time. About the Role We’re looking for a Mechanical Engineer who brings a strong foundation in mechanical or manufacturing engineering and thrives in a customer-facing, product-driven role. This is a unique opportunity for someone who understands how things are made—but is equally comfortable engaging with clients, coordinating across departments, and driving products from idea to mass production. Key Responsibilities Own the end-to-end mechanical component lifecycle —from concept validation through to mass production—focused on enclosures and structural parts. Act as a technical liaison between internal teams (design, procurement, sales) and external stakeholders (customers, suppliers, factories). Collaborate with clients to define product requirements, ensuring feasibility across design, cost, and manufacturing capabilities. Support business development teams by offering technical insights during customer meetings, RFQ responses, and project scoping. Translate technical needs into action plans , guiding suppliers and contract manufacturers to align with quality, cost, and timeline expectations. Perform mechanical feasibility assessments including Design for Manufacturability (DFM) and Design for Assembly (DFA) reviews. Oversee supplier coordination , particularly for processes such as CNC machining, metal forming, die-casting, and surface finishing. Contribute to pricing strategies by analyzing material costs, process efficiencies, and competitive benchmarks. Lead or support new product introduction (NPI) activities, ramp-up phases, and factory readiness initiatives. Stay up to date on manufacturing trends , technologies, and customer needs across consumer electronics and related sectors. Qualifications Bachelor’s degree in Mechanical

The following description is not intended as an exhaustive list of all responsibilities, duties and skills required of personnel so classified. Management retains the discretion of adding or changing the duties of the position at any time. Please see the job descriptions below: Engineer Project Manager Key Responsibilities Lead mechanical engineering projects from concept to mass production, focusing on metal and enclosure components. Collaborate with design, manufacturing, and supply chain teams to optimize mechanical structures for cost, durability, and manufacturability. Work with suppliers and factories to ensure quality control, material selection, and efficient production processes. Define mechanical specifications, drawings, and documentation for enclosure components, ensuring compliance with manufacturing and industry standards. Engage with customers to understand technical requirements and translate them into feasible engineering and manufacturing solutions. Support business development efforts by providing technical expertise in client meetings, proposals, and product demonstrations. Work closely with sales and procurement teams to define competitive pricing strategies based on material costs, production feasibility, and market trends. Identify new business opportunities by staying up to date with industry trends in metal and enclosure technologies. Act as a liaison between customers, internal teams, and contract manufacturers to align project goals and expectations. Conduct DFM (Design for Manufacturability) and DFA (Design for Assembly) and CAD reviews to streamline production and reduce costs. Support new product introduction (NPI) and factory ramp-up, troubleshooting mechanical or assembly issues. Optimize metal forming, CNC machining, die-casting, and surface treatment processes to enhance quality and efficiency. Qualifications: Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, or a related field. 5+ years of ex

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op