Packaging Area Shift Engineer Jobs

Substrate Packaging Defect Metro Tool Owner — Arizona, Phoenix. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s growth depends heavily on the Global Procurement team, which delivers powerful cost management and supply chain resiliency. We apply pioneering predictive capabilities and risk assessment with a strong focus on sustainability and diversity. Our business goals align with the importance we place on our team members – our greatest asset. We invest in people through a skill-based learning and development model to establish clear career paths. We also promote an engaging and inclusive culture by building camaraderie and recognizing diverse perspectives among all our distributed team members. Join us to discover why Micron’s Global Procurement team is the preferred place to advance your talent! Serving as Senior Category Supplier Manager for Advanced Packaging Material at Micron, you will gain a remarkable chance to lead a major strategic supplier or group of suppliers. You will contribute to Micron’s outstanding data retention and data management offerings. Your role includes collaborating with colleagues from multiple categories to maintain outstanding supplier support for goods and services. You will also partner internally to define and track crucial performance metrics. Your expertise will play a key role in directing supplier approaches to optimize cost, supply, and quality. Responsibilities Global Category Strategy & Market Leadership: Own and establish global category strategies for Advanced Packaging Material to foster innovation in solutions for HBM and wafer-level packaging technology. L

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Global Procurement team and help shape the future of Advanced Packaging technology. In this role, you will drive global sourcing and procurement strategy for process equipment capital supporting Technology Development (TD), with a focus on cost leadership, supplier strategy, and technology enablement. Through strong partnerships with internal stakeholders and strategic suppliers, you will accelerate innovation and readiness for next-generation packaging solutions. As part of an inclusive, high-performing team, you will leverage your expertise to support Micron’s relentless pursuit of innovation for customers and partners, including enabling Generative AI and Agentic AI-driven solutions that power future Advanced Packaging technologies. At Micron, you will contribute to a culture built on integrity, sustainability, collaboration, and community impact while helping drive the breakthroughs that fuel the next era of innovation About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Director - Foundry Advanced Packaging Business Development — US, California, Santa Clara. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Global Category Strategy & Market Leadership - Own and define global category strategies for Advanced Packaging Material to drive innovation in solutions for HBM and wafer-level packaging technology. - Lead market intelligence, including: Supplier landscape & capability mapping, Technology roadmaps & inflection points, Pricing models and long ‑ term cost curves. - Shape dual ‑ source / alternate ‑ source strategies and supply base optimization to mitigate concentration and continuity risks. 2. Executive ‑ Level Supplier Relationship Management - Act as Micron’s primary commercial lead for strategic material suppliers, executive reviews, and escalation governance with supplier executives. - Drive alignment on Capacity commitments, Technology enablement and Long ‑ term partnership frameworks. 3. Commercial Negotiation & Contracting - Lead sourcing events/RFQ process into bundled negotiation - Lead negotiations for contract extensions and renewals, renegotiation of prices, transfers, etc - Apply should ‑ cost, total cost of ownership (TCO), and global benchmarking models to negotiations. - Own strategy, governance, and renegotiations as market or capacity conditions shift. 4. Cost,

Title: AI Application Packaging Engineer Location: Andheri (East), Mumbai Reports to: Service Director ABOUT BLENHEIM CHALCOT: As part of the Blenheim Chalcot portfolio, we benefit from the expertise, infrastructure, and scale of the leading global venture builder. With over 25 years of experience creating and growing SaaS businesses powered by Generative AI, Blenheim Chalcot has built 60+ ventures across sectors such as financial services, education, health, and marketing. Our global ecosystem—including Scale Space in London, the Rajasthan Royals in Mumbai, and a go-to-market base in Austin—enables us to access world-class talent, tools, and support to accelerate our growth and build a market-leading business. THE ROLE: We’re looking for an AI-first ITS Engineer with strong Application Packaging expertise to join our growing team at Agilisys. In this role, you’ll work across Application Packaging, Endpoint Management, Cloud Deployment, and Automation, helping modernise IT operations through AI-driven and scalable solutions. This is an opportunity to work in a fast-paced environment where automation, innovation, and operational efficiency are at the core of what we do. ABOUT YOU: Must-Have's 5+ years of hands-on experience with SCCM and/or Microsoft Intune for application packaging, deployment, and endpoint management. Strong experience with PowerShell scripting and a good understanding of Windows Registry, File System internals, and deployment workflows. Experience managing application packaging, deployment, patching, and remediation processes in enterprise environments. Exposure to vulnerability management and patch lifecycle activities using tools such as WSUS, Active Directory, or endpoint security solutions. An AI-first mindset with interest or experience leveraging Generative AI tools to improve efficiency across packaging, testing, deployment, troubleshooting, and operational tasks. Hands-on experience using automation or AI-assisted tools

About the Company: Nivagen is a global company devoted to improving lives by developing high-quality, affordable generic prescription drugs and over-the-counter products for the North American market. For over a decade, we have remained committed to our core values of excellence, integrity, and respect for people. Our dedicated team works collaboratively to advance manufacturing, distribution, and quality control, taking a comprehensive approach to healthcare. Through vertical integration of the pharmaceutical supply chain, state-of-the-art technology, and an unwavering focus on excellence, we continually strive to enhance medication accessibility and affordability. We prioritize our employees' well-being by offering competitive pay, comprehensive benefits, and strong training and development programs. By investing in our workforce and nurturing a culture of growth and support, we empower our team to drive innovation and make a positive impact in healthcare. Our mission at Nivagen is clear: to improve lives by providing high-quality, affordable medications while upholding the highest standards of integrity and excellence. As a leader in pharmaceutical manufacturing, Nivagen is committed to producing sterile products that meet the healthcare industry’s rigorous demands. Specializing in the production of vials, pre-filled syringes (PFS), and IV bags, we aim to make a meaningful impact on patient care. Join our team to help push the boundaries of sterile manufacturing, achieving the highest standards in safety, quality, and operational efficiency. Job Location: Nivagen Pharmaceuticals Inc., Sacramento, CA 3900 Duckhorn Dr, Sacramento, CA 95834 About the Job: Title of the Position : Equipment Maintenance Technician – Aseptic & Packaging Systems Department: Maintenance/Engineering/Manufacturing Operations Reports to: Maintenance Supervisor/ Facilities & Engineering Ma

Category Supplier Manager – Adv Packaging TD Capital Equipment — Boise, ID - Main Site. Apply via Workday.

Principal/Staff Advanced Packaging Development Process Engineer — Fab 10A, Singapore. Apply via Workday.

Package Architect – Advanced Packaging & System Exploration — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Category Sourcing Manager, you will be responsible for developing plans and approaches for strategic sourcing initiatives while developing and implementing negotiation schemes that leverage industry wide supplier landscape analysis. Inclusion of cost analysis and cost benchmarking to enable best in class results is a significant and key aspect of this position and a requirement to enable Micron to maintain cost leadership synergistically with technology leadership. Through management of a Category Strategy for Technology Development, you will also be building trusted partnerships with internal customers as well as external suppliers and drive best in class technology, cost, and supply chain resilience. AI Relevant Job Responsibilities: - Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. - Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. - Ability to apply baseline digital fluency and role ‑ appropriate AI literacy to use AI ‑ enabled tools responsibly and effectively for research, analysis, content creation, problem ‑ solving, operational tasks, and achieving business About Micron Technolog

Job Details: Job Description: The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros). This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology. You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly. The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement. You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers. Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications. Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies. Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality. Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps. Support manufacturing excursion management, including MRB facilitation, cont