Packaging Module Development Engineer Salary India Jobs

Senior Packaging Technical Engineer - Hardware — 3 Locations. Apply via Workday.

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

SINGAPORE REQUIREMENT GET PERMIT IN 30 WORKING DAYS NO HIDDEN CHARGES NOT MORE COSTLY W.P (WORK PERMIT) COST - ( 1.7 LAKH WITH DOCUMENTS 35 THOUSAND REQUIRED ) S PASS COST - ( 2.5 LAKH WITH DOCUMENTS 40 THOUSAND REQUIRED ) E PERMIT COST - (3.2 LAKH WITH DOCUMENTS 50 THOUSAND REQUIRED ) IF ANY ONE INTERESTED THEN CONTACT ME AS SOON AS POSSIBLE. WORK PERMIT,S PASS, E PERMIT COMPANY DRIVER ( LIGHT ) INDIAN LICENCE HOLDER CAN APPLY - W.P BIKE RIDER FOR FOOD DELIVERY - W.P ADMIN CUM RECEPTIONIST - W.P & S PASS BOTH LABORATORY TECHNICIAN - S PASS ADMIN ASSISTANT - W.P Contact Us -

Cleanroom/ Packaging Operations Manager — Skawina, Poland. Apply via Workday.

Fulfillment Packaging Assistant — MD - Columbia. Apply via Workday.

Fulfillment Packaging Assistant — TN - Bartlett. Apply via Workday.

Fulfillment Packaging Assistant — MA - Milford. Apply via Workday.

ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION — Taichung - Fab 16, Taiwan. Apply via Workday.

Internship Packaging — Drachten. Apply via Workday.

Substrate Packaging Defect Metro Tool Owner — Arizona, Phoenix. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Global Procurement team and help shape the future of Advanced Packaging technology. In this role, you will drive global sourcing and procurement strategy for process equipment capital supporting Technology Development (TD), with a focus on cost leadership, supplier strategy, and technology enablement. Through strong partnerships with internal stakeholders and strategic suppliers, you will accelerate innovation and readiness for next-generation packaging solutions. As part of an inclusive, high-performing team, you will leverage your expertise to support Micron’s relentless pursuit of innovation for customers and partners, including enabling Generative AI and Agentic AI-driven solutions that power future Advanced Packaging technologies. At Micron, you will contribute to a culture built on integrity, sustainability, collaboration, and community impact while helping drive the breakthroughs that fuel the next era of innovation About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G

We anticipate the application window for this opening will close on - 28 Sep 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we not only get the opportunity to manage categories for the largest medical device company in the world, but we also get to experience the immense sense of purpose that comes from knowing that the money we save is reinvested into technology that helps alleviate pain, restore health and extend lives of millions of patients across the world. The work we do supports the Medtronic Mission and it matters. This is a global role that allows you to partner with stakeholders across many functions, regions, and businesses to drive value. Strong business acumen and prior sourcing experience are a must as you will be called upon to support complex engagements with strategic partners. The Associate Category Management Specialist is a key contributor within Medtronic’s Global Materials & Contract Manufacturing organization. In this role, you will help shape and execute category strategies, manage inflationary pressures, drive cost‑savings initiatives, support contract negotiations, and enable pan‑Medtronic category management processes. Your work will directly influence cost, continuity of supply, and supplier performance across the enterprise. At Medtronic, we bring bold ideas forward with speed and decisiveness t

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

About the Team DoorDash Labs, established in 2018, serves as the innovation hub for DoorDash, focusing on developing automation and robotics solutions to enhance last-mile logistics. The team's mission is to create technologies that support and augment human networks, aiming to improve efficiency for Dashers, merchants, and consumers alike. We’re ruthlessly focused on business impact. We are a highly senior team composed of former pioneers from a variety of different robotics industries. As of 2025, DoorDash has completed 10B lifetime deliveries. We’re focused on how to do the next 10B even better About the Role As a Hardware Engineer, Electronics Packaging & Vehicle Integration, you will lead the mechanical architecture, design, and delivery of electromechanical systems for DoorDash’s next-generation autonomous delivery vehicle. You will develop robust packaging solutions for compute, electrical, communications, and sensor-related hardware that operate reliably in demanding real-world fleet environments. This role sits at the intersection of mechanical engineering, vehicle integration, and product reliability. You will partner closely with electrical engineering, PCB design, industrial design, systems engineering, manufacturing, supplier partners, reliability, and operations teams to turn system requirements into durable, manufacturable, serviceable, and cost-effective product designs. You will own designs from concept through launch, including electronic enclosures, housings, mounting systems, seals, connector interfaces, and vehicle-level integration features. Success in this role requires strong mechanical design judgment, practical experience with production processes, and the ability to resolve cross-functional packaging tradeoffs. Responsibilities: Own the mechanical design and release of electronic packaging, housings, enclosures, and vehicle integration solutions in support of program timing and product launch. Design components

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character