Packaging Research And Development Engineer Jobs

Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Metro RDA Senior Manager (Package Development for Advanced Packaging) — Fab 10A, Singapore. Apply via Workday.

MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT — Taichung - Fab 16, Taiwan. Apply via Workday.

Equipment Technician, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Director, PDE Advance Packaging — Fab 10A, Singapore. Apply via Workday.

Process Technician, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Sr RDA Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Shift Process Engineer, Advanced Packaging Technology Development (APTD) — Boise, ID - Main Site. Apply via Workday.

Staff Process Engineer, Advanced Packaging CMP — Boise, ID - Main Site. Apply via Workday.

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer — Fab 10A, Singapore. Apply via Workday.

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing We’re seeking a skilled and self-motivated Electrical Mechanical Specialist to join our golf ball manufacturing operations, where you’ll play a vital role in maintaining and optimizing complex production equipment. In this hands-on position, you’ll independently troubleshoot, repair, and rebuild electrical, electronic, hydraulic, and pneumatic systems with precision and versatility. You’ll perform preventive and predictive maintenance, rebuild and calibrate electromechanical devices, and collaborate with Engineering to design or adapt equipment for evolving production needs. Your ability to plan work efficiently, minimize downtime, and maintain accurate maintenance records will directly support operational excellence. This role also involves testing and calibrating instruments to meet performance standards, while fostering a culture of continuous improvement through effective communication with team members and leaders. What You Bring Must meet one of the following education and experience combinations: 100% completion of TPC curriculum and 3+ years of electrical maintenance experience in an industrial setting Approved technical associate degree or certificate in an electrical/electronic discipline and 3+ years of relevant experience Minimum of 7 years of industrial electrical experience in a skilled tr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop