Packaging Utility Operator Jobs

Cleanroom/ Packaging Operations Manager — Skawina, Poland. Apply via Workday.

SINGAPORE REQUIREMENT GET PERMIT IN 30 WORKING DAYS NO HIDDEN CHARGES NOT MORE COSTLY W.P (WORK PERMIT) COST - ( 1.7 LAKH WITH DOCUMENTS 35 THOUSAND REQUIRED ) S PASS COST - ( 2.5 LAKH WITH DOCUMENTS 40 THOUSAND REQUIRED ) E PERMIT COST - (3.2 LAKH WITH DOCUMENTS 50 THOUSAND REQUIRED ) IF ANY ONE INTERESTED THEN CONTACT ME AS SOON AS POSSIBLE. WORK PERMIT,S PASS, E PERMIT COMPANY DRIVER ( LIGHT ) INDIAN LICENCE HOLDER CAN APPLY - W.P BIKE RIDER FOR FOOD DELIVERY - W.P ADMIN CUM RECEPTIONIST - W.P & S PASS BOTH LABORATORY TECHNICIAN - S PASS ADMIN ASSISTANT - W.P Contact Us -

Substrate Packaging Defect Metro Tool Owner — Arizona, Phoenix. Apply via Workday.

Fulfillment Packaging Assistant — MD - Columbia. Apply via Workday.

Internship Packaging — Drachten. Apply via Workday.

Fulfillment Packaging Assistant — MA - Milford. Apply via Workday.

Fulfillment Packaging Assistant — TN - Bartlett. Apply via Workday.

ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION — Taichung - Fab 16, Taiwan. Apply via Workday.

Senior Packaging Technical Engineer - Hardware — 3 Locations. Apply via Workday.

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

We anticipate the application window for this opening will close on - 28 Sep 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we not only get the opportunity to manage categories for the largest medical device company in the world, but we also get to experience the immense sense of purpose that comes from knowing that the money we save is reinvested into technology that helps alleviate pain, restore health and extend lives of millions of patients across the world. The work we do supports the Medtronic Mission and it matters. This is a global role that allows you to partner with stakeholders across many functions, regions, and businesses to drive value. Strong business acumen and prior sourcing experience are a must as you will be called upon to support complex engagements with strategic partners. The Associate Category Management Specialist is a key contributor within Medtronic’s Global Materials & Contract Manufacturing organization. In this role, you will help shape and execute category strategies, manage inflationary pressures, drive cost‑savings initiatives, support contract negotiations, and enable pan‑Medtronic category management processes. Your work will directly influence cost, continuity of supply, and supplier performance across the enterprise. At Medtronic, we bring bold ideas forward with speed and decisiveness t

Title: AI Application Packaging Engineer Location: Andheri (East), Mumbai Reports to: Service Director ABOUT BLENHEIM CHALCOT: As part of the Blenheim Chalcot portfolio, we benefit from the expertise, infrastructure, and scale of the leading global venture builder. With over 25 years of experience creating and growing SaaS businesses powered by Generative AI, Blenheim Chalcot has built 60+ ventures across sectors such as financial services, education, health, and marketing. Our global ecosystem—including Scale Space in London, the Rajasthan Royals in Mumbai, and a go-to-market base in Austin—enables us to access world-class talent, tools, and support to accelerate our growth and build a market-leading business. THE ROLE: We’re looking for an AI-first ITS Engineer with strong Application Packaging expertise to join our growing team at Agilisys. In this role, you’ll work across Application Packaging, Endpoint Management, Cloud Deployment, and Automation, helping modernise IT operations through AI-driven and scalable solutions. This is an opportunity to work in a fast-paced environment where automation, innovation, and operational efficiency are at the core of what we do. ABOUT YOU: Must-Have's 5+ years of hands-on experience with SCCM and/or Microsoft Intune for application packaging, deployment, and endpoint management. Strong experience with PowerShell scripting and a good understanding of Windows Registry, File System internals, and deployment workflows. Experience managing application packaging, deployment, patching, and remediation processes in enterprise environments. Exposure to vulnerability management and patch lifecycle activities using tools such as WSUS, Active Directory, or endpoint security solutions. An AI-first mindset with interest or experience leveraging Generative AI tools to improve efficiency across packaging, testing, deployment, troubleshooting, and operational tasks. Hands-on experience using automation or AI-assisted tools

Director - Foundry Advanced Packaging Business Development — US, California, Santa Clara. Apply via Workday.

Package Architect – Advanced Packaging & System Exploration — 2 Locations. Apply via Workday.

Senior Advanced Packaging Material Category Supplier Manager (HBM) — Taichung - MTB, Taiwan. Apply via Workday.