Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.
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Principal Asic Design Engineer Jobs
1,487 active opportunities · Updated for October 2026
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Explore current principal asic design engineer jobs. Use filters to narrow by work mode, employment type, experience and date posted.
Principal Process Engineer, Die Bonding — Boise, ID - Main Site. Apply via Workday.
Principal Engineer- HIG HBM Layout — Hyderabad - Phoenix Aquila, India. Apply via Workday.
Principal Engineer- HIG HBM Layout — Hyderabad - Phoenix Aquila, India. Apply via Workday.
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1mo agoPrincipal/Senior Engineer, Dry Etch Tool Installation Qualification — Taichung - Fab 16, Taiwan. Apply via Workday.
Principal Device Engineer — 2 Locations. Apply via Workday.
Principal Program Manager, Construction, Electrical — Fab 10N/X, Singapore. Apply via Workday.
Principal Engineer – Process Development, Dry Etch, NAND — Fab 10N/X, Singapore. Apply via Workday.
Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND — Fab 10N/X, Singapore. Apply via Workday.
Principal / Staff Engineer, Embedded Security, Firmware Development (SSD) — MSB, Singapore. Apply via Workday.
Principal/Staff ML/AI Engineer, Product Engineering, STPG — Fab 10N/X, Singapore. Apply via Workday.
Principal Engineer – Process Development, Cell Film, NAND — Fab 10N/X, Singapore. Apply via Workday.
Principal Engineer – Process Development, Wet, NAND — Fab 10N/X, Singapore. Apply via Workday.
PRINCIPAL ENGINEER, SSD VALIDATION — MSB, Singapore. Apply via Workday.
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1mo agoPrincipal Engineer/MTS, Process Development, Photolithography, NAND — Fab 10N/X, Singapore. Apply via Workday.
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