Principal Hbm Design Architect Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology has delivered world‑leading memory and semiconductor solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will design, simulate, optimize, and floorplan advanced DRAM circuits for next‑generation High Bandwidth Memory products. You will work across digital, analog, and mixed-signal domains to ensure functional correctness, performance, and power efficiency. Your role includes collaborating with globally distributed teams developing modern HBM solutions for AI and ML applications. Responsibilities • Design, simulate, and optimize DRAM memory arrays, data paths, ECC, command/control logic, and high‑speed interface circuits • Evaluate block‑level and full‑chip functionality and propose solutions to ensure functional correctness • Analyze timing, area, power, and complexity trade‑offs in high‑speed DRAM and mixed‑signal designs • Perform pathfinding and feasibility studies for new architectures and future HBM products • Contribute to the design, layout, and optimization of memory, logic, and analog circuits • Support large‑scale verification, debug, and silicon validation activities • Collaborate across multi-functional teams involved in TSV‑based 3D stacking and vertical integration • Participate in design reviews and drive continuous improvement of design methodologies Minimum Qualifications • BSEE with 7+ years or MSEE with 5+ years of relevant engineering experience • Strong knowledge of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You will evaluate block-level and full-chip functionality, perform architectural pathfinding, and contribute to the development of next‑generation high‑bandwidth DRAM solutions. This role works across diverse engineering teams to deliver functionally accurate, low‑power, and high‑performance HBM products by bringing to bear 3D stacking and TSV-based integration. Responsibilities • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high‑speed timing structures • Evaluate full‑chip and block‑level functionality and propose solutions to achieve correct circuit and system behavior • Perform timing, area, power, and complexity analysis for high‑speed DRAM and mixed‑signal circuits • Conduct pathfinding studies and feasibility analyses for future HBM architectures • Contribute to the development, layout, and optimization of memory, logic, and analog circuits • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation • Collaborate with multi-functional teams across build, verification, product engineering, process, and packaging • Support design reviews, documentation, and continuous improvement of design methodologies Minimum Qualifications • BSEE with 7+ years, or MSEE with 5+ years of releva

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology, Inc. has advanced the world’s most innovative memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for next‑generation high‑bandwidth memory products. You will evaluate block‑level and full‑chip functionality, solve complex challenges in building, and collaborate with a distributed team to deliver highly reliable, industry‑leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV‑based 3D integration, and high‑speed mixed‑signal architectures supporting Machine Learning and AI applications. Responsibilities Design and analyze digital, analog, and mixed‑signal circuits for HBM DRAM products. Perform schematic entry, simulation, and optimization of DRAM blocks including data path, ECC, command control, and clocking circuits. Evaluate full‑chip and block‑level functionality and deliver solutions ensuring functional accuracy. Conduct pathfinding and feasibility studies for next‑generation HBM architectures. Optimize circuit timing, area, power, and complexity across high‑speed DRAM designs. Support design floor planning, layout reviews, and cross‑domain integration of memory, logic, and analog circuits. Collaborate with global engineering teams to drive innovation and support vertical integration across design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, as well serializing and de-serializing scheme. You will collaborate with a highly creative and motivated development team applying brand-new memory technologies to build groundbreaking HBM products! Responsibilities: Responsible for the high-speed DRAM and Base die interface in HBM cube. Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface. Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG Collaborate with data path design on floor planning and full chip testbench. Analyze timing/area/power in high-speed DRAM or mixed-signal design. Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits. Qualifications: Extensive experience with DRAM operation and JEDEC specifications across DDR, LPDDR, GDDR, and HBM product families. Strong technical expertise in analog and mixed-signal circuit design. Hands-on proficiency in DRAM command decoding, bank logic, and RAS/CAS chain design. Demonstrated innovation and problem‑solving capabilities in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate relevant experience in at least three of the five focus areas outlined below. Job Responsibilities Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundry

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Job Description The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below. Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HBM Core-Die Architecture & Circuit Design Engineer This role owns next‑generation HBM core‑die architecture and critical DRAM circuit design that directly impact bandwidth, power, area, thermal efficiency, and long‑term reliability. The engineer will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development across advanced 3D‑stacked HBM products. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Key Responsibilities Own HBM core‑die architecture including Bank/Bank‑Group organization, array partitioning, datapath, refresh, and reliability features Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade‑offs Define and validate refresh, row‑hammer mitigation, data‑retention, and power‑efficient operation schemes Lead architecture feasibility studies using transistor‑level simulation and physical implementa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Title: Principal Engineer – HBM Verification Location: Hyderabad, India Experience : 12+ years in Design Verification (experience with Pre-Silicon Verification OR DDR/GDDR/LPDDRmemory/SerDes PHY IP Verification is preferred) Role Description Join the Micron HBM team where you will drive verification architecture for next-generation HBM, ensuring robust methodologies and sign-off strategies. This role is perfect for a hands-on silicon verification expert who is passionate about developing best-in-class verification methodologies, testbench design, AI enabled verification and developing novel solutions to improve quality and efficiency of verification workflows. Key Responsibilities Define and drive verification architecture and methodology for next generation HBM designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Apply Formal Verification techniques for critical Collaborate strictly with build teams to ensure verification completeness and quality. Mentor a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer , you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products . You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability. Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple doma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Title: Principal Engineer – HBM Verification Location: Hyderabad, India Experience : 12+ years in Design Verification (experience with Pre-Silicon Verification OR DDR/GDDR/LPDDRmemory/SerDes PHY IP Verification is preferred) Role Description Join the Micron HBM team where you will drive verification architecture for next-generation HBM, ensuring robust methodologies and sign-off strategies. This role is perfect for a hands-on silicon verification expert who is passionate about developing best-in-class verification methodologies, testbench design, AI enabled verification and developing novel solutions to improve quality and efficiency of verification workflows. Key Responsibilities Define and drive verification architecture and methodology for next generation HBM designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Apply Formal Verification techniques for critical Collaborate strictly with build teams to ensure verification completeness and quality. Mentor a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Engineer, Principal Engineer, or Member of Technical Staff, Design Architect in the Next-generation HBM Architecture Team, you will design, simulate, analyze, and optimize the architecture of 3D-stacked, high-performance memories. Apply your knowledge to explore trade-offs in 3D-stacked logic and memory designs in close collaboration with peer architecture and design teams. Your responsibilities will include definition of, evaluation of, and specification of circuit implementations, technology requirements, thermal performance improvements, power delivery architectures, and on- and off-chip interfaces. Responsibilities: Design, optimize, and simulate critical analog and/or mixed-signal circuits. Architect and design power delivery for high-performance, stacked memories. Analyze, specify, and prototype on-/off-chip interfaces. Perform timing, area, power, and complexity analysis for high-performance, low-power circuits. Define architectures for improved thermal management. Conduct pathfinding activities for future-generation stacked-memory products. Com

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HBM Design Architecture — Principal Engineer Role Overview We are seeking a highly motivated HBM Design Architecture Engineer (Principal Engineer) to drive exploration and definition of next‑generation AI memory and system environments. In this role, you will analyze emerging infrastructure trends, build performance models, and develop/extend tooling that informs HBM architecture decisions and system‑level trade‑offs. You will work closely with architects and senior engineers across DTPCO, Design, and Product/System teams to translate AI workload requirements into actionable memory subsystem and architectural intercept strategies. Key Responsibilities You will own and contribute to projects such as: Research and synthesize emerging trends in compute, networking, and storage infrastructure to anticipate how future AI systems will evolve. Lead HBM architecture analysis by defining bandwidth/latency targets, identifying constraints, and translating workload and system data into actionable memory requirements. Develop and maintain simulation frameworks to model AI cluster performance and memory subsystem behavior; validate models against internal and external benchmarks. Build and apply first‑order performance models spanning HBM bandwidth/latency, GPU/CPU interactions, and memory hierarchy trade‑offs to guide architectural decisions. Create and curate trend dashboards using CSP benchmar

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal HBM RTL Designer, you will serve as a technical leader driving the front‑end digital design of next‑generation High Bandwidth Memory (HBM) products. This role requires deep expertise in RTL architecture, build methodology, and multi-functional technical leadership. You will own complex design blocks end‑to‑end—from architectural definition through production‑quality implementation—while mentoring engineers, influencing design strategy, and ensuring world‑class design execution. Responsibilities: Define, architect, and lead the development of advanced RTL blocks for HBM subsystems, ensuring alignment with product requirements and architectural goals. Own end‑to‑end front‑end design, including micro‑architecture, RTL development, simulation strategy, and design quality. Drive technical decisions across circuit development, synthesis, constraints, and physical‑design integration, ensuring timing, power, and area compliance. Champion design methodologies, develop reusable frameworks, and improve RTL design flows, validation strategies, and sign‑off processes. Collaborate closely with physical design, verification, architecture, and product engineering to integrate subsystems and deliver high‑quality silicon. Lead root‑cause analysis and corrective actions for complex design issues, ensuring long‑term design robustness. Communicate effectively at all levels, contributing to technical planning, project execution, and cross‑organizational alignment. Minimum Qu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions for AI, machine learning, and high-performance computing applications. We are seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products. This role focuses on PHY IO architecture, timing methodology, analog calibration schemes, and silicon learning frameworks that enable industry-leading bandwidth, power efficiency, and robustness. The successful candidate will collaborate across Design, Product Engineering, Modeling, Verification, Packaging, and System Architecture teams to define architectural requirements, drive technology innovation, and ensure successful translation from concept to silicon. As a technical leader, you will influence future HBM roadmap decisions, develop engineering methodologies, and mentor design teams on architectural principles, calibration strategies, and best practices for high-speed IO design. Key Responsibilities Define and drive next-generation HBM PHY and IO architecture , balancing performance, power, area, reliability, and manufacturability requirements. Architect high-performance transmit and receive paths , including clocking, signaling, equalization, timing alignment, and interface optimization. Define and optimize analog calibration architectures , including impedance calibration, reference v

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Verify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness, performance, power efficiency, and product quality. Develop comprehensive verification plans from architecture and functional specifications in collaboration with architecture and design teams. Create, enhance, and maintain verification environments, UVM testbenches, test suites, and automated regression infrastructures. Define and execute coverage-driven verification strategies to achieve functional, assertion, and code coverage goals. Lead debug and root-cause analysis of complex design issues, drive bug resolution, and ensure verification closure. Apply advanced digital and mixed-signal verification methodologies using industry-standard simulation and verification tools. Drive continuous improvements in verification methodologies, automation, regression efficiency, and AI-assisted verification workflows. Collaborate closely with global design, architecture, product engineering, and system engineering teams to ensure successful project execution. Lead verification efforts for major HBM development programs and mentor engineers through technical leadership and knowledge sharing. Minimum Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience. 10+ years of experience in digital and/or mixed-signal design verification with a proven record of deli