Principal Partner Solutions Architect Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advance

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Staff Engineer owns defined Realtime Defect Analysis (RDA) scope within NAND Technology Development, developing and sustaining advanced defect detection and inspection strategies that accelerate learning, improve yield, and support technology transfer to manufacturing. This role leads defect analysis, inspection recipe and sampling optimization, excursion containment, and cross-functional issue resolution. The position collaborates with Process Integration, Yield, Data Science, Global Manufacturing, and equipment suppliers to strengthen process monitoring, standardize Best Known Methods, and align inspection capability with future NAND technology nodes. Main Responsibilities Own the site-level RDA strategy and annual roadmap aligned with NAND Technology Development nodes. Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects. Establish, track, and report program health metrics, including baseline he

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal Engineer - Process Development, CMP, NAND Job / Role Summary The Principal Engineer provides technical leadership for Chemical Mechanical Planarization (CMP) process development supporting advanced 3D NAND and future technology nodes. This role leads process characterization, margin improvement, integration, and transfer readiness, while driving cross-functional alignment with global development, manufacturing, equipment, and supplier teams. The position resolves complex process, yield, defectivity, and manufacturability challenges, influences module and site-level technical direction, and advances robust CMP capability for high-volume production through disciplined experimentation, process control, and technology roadmap execution. Main Responsibilities · Lead CMP process characterization and advanced process development for 3D NAND and future technology nodes. · Define and execute CMP process strategies that improve process margin, robustness, manufacturability, yield, and performance. · Lead complex experiments and data analysis to validate process windows, technology scaling readiness, and integration requirements. · Drive transfer of developed CMP processes to high-volume manufacturing at Fab10N and lead cross-func

About Backblaze Backblaze is the object storage leader in the open cloud movement, fueling customer success with cloud storage built purposefully to unlock budgets, unburden administrators, and unleash innovators. Together with our partners, we’re helping customers break free from the restrictive, overpriced legacy solutions that hold them back, and blaze forward with the full power of the open cloud in their hands. Founded in 2007, we scaled the business with less than $3 million in outside funding until 2021, when we did a traditional IPO on the Nasdaq stock exchange. Today, Backblaze generates over $100m in revenue and is the leading specialized storage cloud, managing over three billion gigabytes of data storage for 500K+ customers in 175+ countries, including businesses, developers, IT professionals, and individuals. But while there is a lot to celebrate in our past, there is almost as much opportunity ahead of us. We’re seeking a B2 Principal Product Manager to join our team! About the Role We are seeking an ambitious and accomplished Principal Product Manager to join our Product team. Backblaze’s B2 cloud object storage offers multi-exabyte, S3-compatible, globally available object storage that unlocks app builder innovation across AI neoclouds and traditional hyperscalers at a fraction of the cost of traditional cloud infrastructure hyperscalers. The Principal Product Manager for B2 will work closely with key stakeholders to understand the evolution of cloud storage and the customer problems in the space, and determine product strategies and roadmap to address those problems. This person will work independently to lead efforts for new feature discovery and delivery, as well as improvements to execute on those strategies. Understanding customer problems through interviews and market research, and translating them into requirements, is critical. What You'll Do Drive B2 product strategy and roadmap development through delivery execution. Lead the end-to-end pro

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. As a Product Engineer working directly in support of the NAND Product Development Team Leader, your role involves collaborating with cross-functional teams to propel new product development and spearhead the integration of AI solutions into actionable strategies and plans. In this capacity, you represent the NAND engineering team, engaging with strategic partners such as business units, quality assurance, fabrication, testing, and supply chain to ensure a competitive time-to-market for the newest technology nodes, from silicon to system. This role is highly impactful, offering broad scope and high visibility. It presents an opportunity to contribute to Micron’s next generation of technology and product enablement alongside a dedicated and highly skilled cross-functional team. Key Responsibilities: Negotiate and align NAND requirements with business units and SSD development leads, transforming these requirements into qualification specs that guide NAND develop

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. A Principal Capital Supplier Manager is a global, senior individual‑contributor role accountable for end‑to‑end commercial ownership of one or more critical capital equipment categories and strategic suppliers. The role drives cost competitiveness, supply resilience, category strategy, and executive‑level supplier engagement for Micron’s manufacturing network. 1. Global Category Strategy & Market Leadership - Own and define global category strategies for capital equipment (e.g., Etch, Wet Process, CMP, Deposition, Implant, Fab Support, Photo, Metrology). - Lead market intelligence, including: Supplier landscape & capability mapping, Technology roadmaps & inflection points, Pricing models and long‑term cost curves. - Shape dual‑source / alternate‑source strategies and supply base optimization to mitigate concentration and continuity risks. 2. Executive‑Level Supplier Relationship Management - Act as Micron’s primary commercial lead for strategic capital suppliers, executive reviews, and escalation governance with supplier executives. - Drive alignment on Capacity commitments, Technology enablement and Long‑term partnership frameworks. 3. Complex Commercial Negotiation & Contracting - Lead high‑st

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Buyer within Micron's Capital Equipment Procurement organization, you will lead strategic supplier and category management initiatives supporting Micron's global technology development and manufacturing roadmap. The role is responsible for driving total cost competitiveness, supply assurance, supplier innovation, and long-term strategic partnerships across critical capital equipment categories! You will collaborate closely with Technology Development, Global Operations, Facilities, Manufacturing, and Executive Leadership teams to develop and implement sourcing strategies that support Micron's growth objectives. The successful candidate combines strong commercial and analytical skills with a digital-first outlook. They use AI-enabled tools, advanced analytics, and automation to improve decision quality, enhance efficiency, and speed up business results. Key Responsibilities Str

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are a global sales organization at Micron that partners closely with the world’s most influential OEM customers. We work across regions and business units to bring Micron’s full portfolio to market, tackle complex customer challenges, and drive long‑term growth. Our team values teamwork, accountability, and building relationships that last! As the Principal Global Account Sales Manager, you will own and grow one of Micron’s most strategic global OEM relationships. This role is central to driving revenue, crafting account strategy, and representing the voice of the customer across the company. You will lead opportunity execution, influence cross‑functional teams, and build trusted relationships at all levels of the customer organization. Responsibilities: Own and execute a global strategic account plan in partnership with Business Units and regional teams Build and maintain senior‑level customer relationships and a comprehensive global relationship map Manage and advance a multi‑product opportunity pipeline with strong forecast accuracy and CRM discipline Deliver quarterly revenue, gross margin, and TAM share objectives aligned to BU and corporate goals </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where breakthrough patterning technologies become manufacturing-ready solutions. Our team is shaping the future of memory by evaluating and enabling next-generation lithography technologies, including EUV and High NA EUV. We work closely with technology development, manufacturing, equipment suppliers, and industry partners to drive innovation and deliver scalable solutions for future memory products. As a Lithography Pathfinding Process Development Engineer, you will help define how advanced patterning technologies support Micron’s long-term roadmap. You will lead pathfinding activities, evaluate emerging lithography solutions, and develop implementation strategies that influence future technology decisions. This role is part of Micron’s Technical Leadership Program (TLP), offering the opportunity to grow as a technical leader, mentor others, and drive industry-changing innovation. Responsibilities: Define and lead pathfinding activities for advanced patterning technologies, including EUV and High NA EUV, and identify roadmap applications where they provide value Develop and optimize EUV lithography modules within Technology Development, partnering with process integration and adjacent process teams to meet manufacturing requirements Collaborate with defect inspection teams and mask suppliers to establish inspection and quality strategies for EUV masks Partner with manufacturing sites to align equipment, materials, a