Principal Services Solutions Manager Jobs

Principal Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer Company: The Boeing Company Boeing Defense, Space and Security (BDS) is seeking a Principal Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer (Level 6) for a satellite development program in Huntington Beach or El Segundo, California. This position will lead a team of engineers, analysts and staff within the Space and Missile Systems (SMS) and Boeing Technology and Innovation (BTI) Mission Systems organizations in the development, assembly, integration, and test of a constellation of satellites. The SMS and BTI organizations develop and capture technology for designing disruptive Mission Systems solutions. Focused on visible and infrared spectrum Electro-Optics Infrared (EO/IR) sensors operating in Space and Air domains, our growing team is leaping ahead of our competition with an exceptional mix of mission architectures, sensor designs, and algorithms for advanced image and data processing. Position Responsibilities: Drives technical excellence throughout all Optical Sensor development activities Troubleshoots sensor design and integration issues with the telescope and sensor focal plane Provides technical leadership to SMS and BTI sensor teams Serves as the primary technical interface with the EO/IR suppliers Provides oversight and approval of technical approaches, products and processes. Works closely with program manager, program chief engineer, and other Boeing teams Ensure mission success and prompt resolution of anomalies Provides mentoring and coaching to Optical Sensor Engineers and Technicians Performs Technical Lead Engi

Drata is building the trust layer between great companies - automating compliance, managing risk, and helping organizations prove trust continuously as they scale. We're Dratanauts: a global crew of 600+ professionals united by a culture that rewards integrity, ownership, and raising the bar, no matter where in the world we're working from. Why Join the Drata Team? At Drata, you're not maintaining legacy compliance software - you're building the agentic AI platform defining what trust looks like for the next generation of companies. Here's what makes the work itself worth showing up for: Problems without a playbook: You'll work at the edge of AI and security, building agentic governance, continuous compliance, and real-time trust verification to solve problems that don't have an established answer yet. You're writing it as you go. Real ownership, not just process: Our values center on owning outcomes and raising the bar, not checking boxes. You're expected to have opinions and back them. A seat at the table: Your perspective is unique and valued. Open debate and diverse viewpoints are built into how decisions actually get made here, at every level. Growth at rocketship speed: Drata is scaling fast, which means scope grows fast too. High performers get more ownership, visibility, and experience. A crew, not just coworkers: Dratanauts consistently describe a "come as you are" culture with sharp, curious people—the kind of team that makes hard problems genuinely fun to solve. See what they say here and follow us on LinkedIn for company news, employee stories, and career updates. Job Summary: We’re looking for a Principal Product Manager, Agentic AI Platform to lead Drata’s Agentic AI strategy and execution. In this role, you will own a multi-year AI vision that spans product lines and influences company-level strategy, building AI-native experiences that help customers get real GRC work done—not just chat with their data. You’ll sit in the AI Pillar , working across Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Operations Central Team (OCT) Dry Etch Tool Installation Qualification (TIQ) Engineer at Micron Technology, Inc., you will be building growth mindset, facilitate and drive improvement on Micron TIQ engineering globally, driving global business processes, and enabling the leverage of world-wide resources to deliver industry benchmark methods. And you are also responsible for leading the activities to achieve the Best in Class (BIC) TIQ performance (cost and schedule) across the network and industry. You are encouraged to work closely with the key partners (sites, central team partners and suppliers) to identify areas of opportunities and analyze their performance-to-plan data to improve TIQ performance. Micron is attracting the diversified and dedicated candidate to build innovative solution for all aspects. Responsibilities As a Principal Engineer, Dry Etch Tool Installation Qualification for OCT, you will be considered an area domain expert in Dry Etch and will work as a site partner with Micron FABs globally and supplier partner with suppliers. • Understand short-term and long-term Cost goals within Front End and ensure alignment to corporate business goals. Initiate and drive across function programs to achieve department business goals • Facilitate the definition of program scope, goals, deliverables, timeline and resource requirements in collaboration with sponsors and partners • Manage the definition, refinement, and implementation of core methodologies and tools for bus

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a TCAD Engineer in the DRAM Device Technology group at Micron Technology, Inc., you will work with an industry-leading team to model, simulate, and understand advanced semiconductor devices and processes for future memory products. You will be responsible for physics-based device simulation, supporting technology development by providing quantitative insight into device behavior, variability, and reliability through TCAD tools. Responsibilities and Tasks Develop and apply TCAD simulations to analyze advanced semiconductor devices including DRAM access devices, CMOS devices, diodes, and resistive elements. Build 2D/3D device structures, define physical models (transport, recombination, traps, mobility, quantum effects, etc.), and perform parametric studies to support device and process development. Correlate TCAD simulation results with electrical characterization data to clarify physical mechanisms behind performance, variability, and reliability trends. Investigate impacts of process variations, material properties, defects, and interface states on device characteristics. Support development teams

We're looking for a Principal Engineer to join our CSP Engagements team as the technical focal point for end-to-end performance, working directly with engineering teams of key CSP/hyperscale customers to ensure they achieve various performance targets on NVIDIA platforms. In this role, you will augment NVIDIA's performance and benchmark teams with a dedicated CSP-facing focus. You will drive work streams with CSP engineering teams to build shared understanding of platform performance characteristics, gather and incorporate their workload-specific feedback into NVIDIA's optimization priorities, and validate that performance targets are met in customer-representative configurations. Your cross-CSP visibility enables you to identify patterns and drive systemic improvements in documentation, configuration guidance, and tooling. What you'll be doing: Drive performance characterization work streams with engineering teams of key CSP/hyperscale customers — ensuring they understand platform performance expectations, profiling methodology, and tuning options for their specific workloads Gather and synthesize CSP performance feedback — identify gaps between expected and actual throughput, and champion optimization priorities back into NVIDIA's CUDA, NCCL, driver, and firmware teams Ensure key open-source performance and stress tools (e.g., STREAM, GPU Burn, GPU BLAST) are updated and validated for the latest NVIDIA rack-scale systems, GPU architectures, and CPU platforms — so customers and internal teams have reliable baseline measurements from day one Work closely with CSPs to ensure their own performance and validation tooling reflects the latest GPU capabilities, memory hierarchy changes, and platform-specific tuning parameters Conduct cross-CSP performance comparison and pattern analysis — identify configuration, software, or workload differences that explai

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are a team that thrives on uncovering the unseen. Using advanced inspection technologies, data analytics, and innovative defect detection methodologies, we protect the health of our manufacturing lines and enable world-class yield performance. We collaborate across global sites to share knowledge, develop best known methods, and accelerate learning through data-driven decision making. If you enjoy solving complex manufacturing challenges and influencing improvement at scale, we invite you to join us. As a Principal Realtime Defect Analysis (RDA) HVM Process Engineer, you will serve as a technical leader responsible for driving defect reduction strategies across high-volume manufacturing. You will influence inspection roadmaps, develop innovative approaches for defect detection and excursion prevention, and partner with global stakeholders to improve process capability and manufacturing performance. Your expertise will help shape RDA strategy, accelerate technology transfer, and enable proactive identification of critical process issues before they impact production. Responsibilities: Lead defect reduction initiatives through analysis of inline defect signals, process flows, and equipment performance across manufacturing sites Develop and implement advanced inspection strategies, methodologies, and controls to improve defect visibility and prevent process excursions Drive root cause investigations for complex defect and yield challenges while influencing corrective actions across cross

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: <span

Principal Product Yield Analysis Engineer — Boise, ID - Main Site. Apply via Workday.

Principal Program Manager, PMO – Graphics & Compute — Boise, ID - Main Site. Apply via Workday.

Principal AI Computer Vision Engineer — Minnesota, United States of America. Apply via Workday.

Principal Clinical Specialist, Deep Brain Stimulation (DBS) - Connecticut — Connecticut, United States of America. Apply via Workday.

Principal Category Supplier Manager - Clay, NY — Clay, NY. Apply via Workday.

Principal Category Supplier Manager - Clay, NY — Clay, NY. Apply via Workday.

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Principal Data Modeler Architect — VA - Reston, 11951 Freedom Dr Ste 900. Apply via Workday.