Process Integration And Defect Reduction Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Also, strong AI proficiency, a solid understanding of agentic AI models, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Strong AI proficiency, a solid understanding of agentic AI model

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Strong AI proficiency, a solid understanding of agentic AI model

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s DRAM Technology Development group, where engineers operate at the leading edge of semiconductor process and product innovation. This role sits at the intersection of process technology, product requirements, and manufacturing execution, and is critical to enabling next generation DRAM technology. As a Principal Node Development Product Engineer, you will play a technical role in driving product readiness through close engagement with process integration, device, yield, test, design, and manufacturing teams. You will own deep process‑aware product knowledge, identify node‑specific risks, and translate silicon behavior into actionable decisions that ensure robust, scalable next generation DRAM products. Responsibilities Serve as a technical contributor during development stage of next gen DRAM! Drive process‑aware product optimization, identifying sensitivities, interactions, and integration risks Analyze silicon data (electrical, parametric, yield, reliability) to identify systematic process or integration limiters Partner with design, process integration, test, and device teams to debug yield and performance issues and converge on root cause Collaborate closely with manufacturing and TD to enable smooth node readiness, learning cycles, and factory ramp Translate process changes into product impact assessments, including PPA, yield, reliability, and test coverage Guide test content and monitoring strategies to ensure early detection of process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but are not limited to · Responsible for the architecture, design, implementation, and validation of analog and mixed-signal circuits used in NAND Flash across the complete design lifecycle. · Design and develop circuits such as charge pumps, amplifiers, voltage regulators, data converters (ADC/DAC), bandgap references, sensor interfaces, and power-management blocks. · Translate system-level requirements into detailed circuit specifications, architectures, schematics, verification plans, and clear design documentation. · Perform transistor-level design and optimization to meet performance, power, area, noise, and reliability targets. · Conduct DC, AC, transient, noise, Monte Carlo, and corner simulations to verify functionality and robustness across process, voltage, and temperature variations. · Validate block- and chip-level design performance using standard industry simulators, including evaluation of parasitic effects and integration quality. · Participate in cross-functional evaluation of key NAND features and collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and other partner teams. · Analyze design and silicon issues, drive root-cause analysis, and implement robust corrective actions. · Coordinate technical activities for a small team when required, including design reviews, execution tracking, and knowledge sharing. · Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 業務内容 次世代DRAM技術開発におけるプロセスインテグレーション業務を担当いただきます。 将来世代DRAMノード向けプロセス技術の開発および統合 キャパシタモジュールの設計、開発、最適化 複数のプロセスモジュールにまたがるインテグレーション業務 DOE（実験計画法）の設計・実行、およびデータ解析によるプロセス条件の最適化 歩留まりおよび品質に関する課題の特定と解決 プロセス、設計、デバイス、品質部門との連携 応募資格 技術要件 半導体プロセスに関する基礎知識 プロセスインテグレーションまたは関連するエンジニアリング分野の知識 DRAMデバイスおよび構造に関する知識があれば尚可 半導体エンジニアリング分野における10年以上の経験 コミュニケーションスキル 海外チームとの会議に頻繁に参加するため、英語でのコミュニケーション能力 日常業務に必要な日本語コミュニケーション能力 関係部門との協業や調整を行うための対人コミュニケーション能力 求める人物像 高い分析力および問題解決力を有する方 チーム環境において主体的に業務を遂行できる方 技術課題に対して粘り強く取り組み、責任感を持って対応できる方 ============================================ ■ Job Responsibilities In this role, you will be responsible for process integration activities for next-generation DRAM technology development. Your key responsibilities will include: Development and integration of process technologies for Future DRAM nodes Design, development, and optimization of capacitor modules Integration across multiple process modules to ensure consistency and performance Design and execution of experiments (DOE) and data analysis to optimize

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 次世代DRAM技術開発におけるプロセスインテグレーション業務をご担当いただきます。 【主な業務内容】 次世代DRAMノード向けプロセス技術の開発および統合 キャパシタモジュールの設計、開発、最適化 複数のプロセスモジュールを統合し、性能および整合性を確保 プロセス条件最適化のためのDOE&#xff08;実験計画法&#xff09;の設計・実施およびデータ解析 歩留まりおよび品質に関する課題の特定と改善 Process、Design、Device、Qualityチームとの部門横断的な連携 応募資格 必須要件&#xff08;技術スキル&#xff09; 半導体プロセスに関する基礎知識 プロセスインテグレーションまたは関連するエンジニアリング分野の知識 半導体業界における5年以上の実務経験 歓迎要件 DRAMデバイスおよび構造に関する知識 語学・コミュニケーションスキル 海外チームとの会議に対応できる英語でのコミュニケーション能力 日常業務を遂行できる日本語力 関係部門との連携・調整を円滑に進めるための高い対人コミュニケーション能力 求める人物像 高い分析力と問題解決能力をお持ちの方 チーム環境において主体的に業務を推進できる方 技術的課題に対して粘り強く取り組み、オーナーシップを持って対応できる方 ------------------------------------------------------------------- ■ Job Responsibilities In this role, you will be responsible for process integration activities for next-generation DRAM technology development. Your key responsibilities will include: Development and integration of process technologies for Future DRAM nodes Design, development, and optimization of capacitor modules Integration across multiple process modules to ensure consistency and performance <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is seeking a highly motivated and proactive individual to join our team as an Advanced CMOS Device & Process Integration Engineer. This position is designed for early-career engineers who are interested in developing expertise in advanced CMOS device technology and process integration. The successful candidate will use AI-assisted tools (Claud Assist, Code Assist, etc.) , including engineering assistants, coding assistants, and data analytics platforms, to enhance productivity, accelerate learning, improve decision-making, and increase operational efficiency. AI tools are expected to complement engineering judgment, technical knowledge, and hands-on problem solving. This is a unique opportunity to develop your career with a world-class company at the forefront of memory and storage technology. As an Advanced CMOS Device & Process Integration Engineer, you will contribute to the development of current and future CMOS technologies for advanced memory products. You will work under the guidance of experienced engineers and collaborate with teams across Process Engineering, Circuit Design, Layout, Product Engineering, Reliability, Manufacturing, and Modeling/TCAD. You will support silicon experiments, analyze electrical and process data, evaluate transistor performance, and help establish robust CMOS devices and process flows for high-volume manufacturing. <R

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron's core memory technology critical for AI-enabled customers. The R&D development takes place in an industry-leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on driving front-end process integration for future DRAM technology nodes, owning integration schemes, DOEs, and silicon learning from development through transfer to manufacturing. You will strengthen that work with device and process modeling, using simulation and device physics to build predictive insight, shorten learning cycles, and guide integration decisions. This is an integration role first; modeling is a tool you bring to it, not a standalone assignment. Responsibilities include, but not limited to: Own process integration for assigned DRAM FEOL modules: define integration schemes, drive unit process and module interactions, and deliver on technology node milestones. Design and execute DOEs on silicon, analyze inline, parametric, and yield data, and drive root cause to resolution. Apply device and process modeling (TCAD, Silvaco, Sentaurus, or comparable) to evaluate process interactions, device behavior, and scaling options, and to prioritize experiments before committing silicon. Correlate simulation results with experimental and silicon data to improve model accuracy and deepen process understanding.</li