Process Integration Senior Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal / MTS-Lead, you will be a part of a groundbreaking next-generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration, and testing a new dimension and scaling with next generation NAND. You will collaborate directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on powerful and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. In this role, your responsibilities will include, but are not limited to: Program and Project Management Manage efforts and set the strategy for developing process technology for assigned products in Process R&D. Offer routine project coordination and technical support to your process development team. Handle the demands of several customers to determine priorities for your team. Resolve yield and defect issues related to your process area. Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals. Work with R&D Management, Process Integration, and High-Volume Manufacturing Sites to regula

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer, Photo EUV Technology, you will be responsible for EUV process module development for memory devices, in addition to other photolithography and process integration related activities. In this position, you will work with other Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors. Key Responsibilities Develop and optimize EUV process modules to meet the stringent requirements of advanced memory devices. Perform advanced process development tasks, including material evaluations, reticle and layout design, OPC development, process window analysis, and overlay optimization. Lead the successful introduction of new technologies to manufacturing, focusing on yield improvement, cycle time reduction, and tool expansion. Collaborate closely with R&D and high-volume manufacturing (HVM) partners in globally diverse locations to ensure seamless integration and flawless execution. Partner with DRAM Development site leaders to align development strategies, deliverables, and provide on-site support for various technology projects. Work alongside Micron’s Manufacturing and Central teams to implement outstanding methods for manufacturability. Qualifications Proven experience in EUV process development and photolithography. Outstanding problem-solving skills and the ability to successfu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Main Responsibilities: Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications. Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect out

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Strategy & Innovation Define and execute the technical roadmap for Advanced DRAM Films development. Provide technical leadership across Epi, device films, hardmask technologies, HAR deposition, and diffusion processes. Drive innovative process solutions that enable future technology nodes while meeting manufacturability, yield, reliability, and cost objectives. Partner with Process Integration and cross-functional teams to resolve critical technology challenges. Leverage Artificial Intelligence to enhance problem solving across technical and logistical spaces. Organizational Leadership & Team Development Lead, coach, and develop a growing organization of engineers, technical leads, and future managers. Foster a culture of technical excellence, innovation, accountability, collaboration, and ownership. Develop talent through mentoring, succession planning, talent management, and strategic hiring. Create an environment that accelerates learning, encourages technical curiosity, and enables career growth for engineers at all levels. Drive high levels of team member engagement by cultivating an inclusive, supportive, and high-performing culture where employees feel valued, empowered, and connected to Micron's mission and business objectives. Champion employee development, recognition, feedback, and wellbeing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about driving innovation for next-generation memory solutions powering AI/ML and high-performance computing systems. As a Director of HBM RTL Design and Integration, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die, with a strong focus on RTL development and IP integration. You will drive technical strategy and execution across multiple product generations, working closely with architecture, verification, physical design, firmware, and product engineering teams. Key Responsibilities Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence. Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams. Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness. Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs. Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution. Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Understand NAND device operation, reliability tests, product qualification, and performance/reliability requirements. Drive process and device technology development to meet performance and reliability specs within project timelines. Design process experiments, segment problems clearly, and analyze data using device physics understanding. Develop and utilize artificial intelligence (AI) tools to enable faster cycles of learning to advance NAND device capability and drive new solution. Extract and analyze inline, probe, parametric, and reliability data. Lead cross-functional teams to address device/array deficiencies across design, process, and device teams. Apply project management skills to small projects or parts of larger projects. Collaborate with product engineering, TCAD, and process integration teams to improve characterization and define structural specs. Provide regular project status, outlook, problem summaries, actions, and deliverable timelines to global cell and management teams. Required Knowledge and Skills Strong understanding of semiconductor device physics, CMOS fundamentals, and memory device operation. Knowledge of semiconductor process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job responsibilities Represent the Fab in technology maturity, improving yield, and activities related to integrating processes. Work closely with teams in production operations, process development, yield optimization, and technology development to drive balanced yield and quality improvement. Drive initiatives related to process optimization, defect reduction, and process margin enhancement within OMT. Accountable for yield performance, quality metrics, and manufacturing readiness to meet business objectives. Accountable for identifying, prioritizing, and addressing key yield issues through detailed root cause analysis, inline control strategies, and multi-functional task force leadership. Lead Fab process integration activities including technology deployment, equipment qualification, process changes, and cross-site alignment. Ensure successful execution of technology ramps, coordination of workflows, and transfer readiness in terms of yield, quality, and schedule. Plan and coordinate process improvement projects, qualification activities, and engineering evaluations to advance technology maturity and manufacturing perfection. Supervise and react to critical yield, inline, electrical, and reliability indicators to ensure process stability, product quality, and continuous improvement. Build positive partnerships with Technology Development, Product Engineering, Yield Analysis, and Manufacturing organizations to accelerate problem solving and technology execu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Advanced Technology Singapore, Alpha Technology Engineering Part Type Management Project Title Fab 10 Metallization Conversion and M77R New Product Introduction Program Management Project Description The intern will undertake a project focused on the Fab 10 Metallization sister fabrication facility conversion and the M77R new product introduction. The project provides practical exposure to semiconductor manufacturing, process integration, program planning, risk management, and stakeholder coordination. The intern will work with engineering and manufacturing teams to track project readiness, analyze technical information, and develop clear program-management materials. Objective of the Project To establish a structured program-management approach for the Fab 10 Metallization conversion and M77R product introduction, enabling effective milestone tracking, early risk identification, manufacturing-readiness assessment, and cross-functional communication. Opportunities for Full Time Employment Successful interns may be considered for future full-time opportunities within Micron’s engineering and manufacturing organizations. Consideration will be subject to internshi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Direct process AMC control and N₂ / advanced FOUP environmental regulation efforts to minimize contamination risks and protect product quality. Direct process Particle control and N₂ / advanced FOUP environmental regulation efforts to minimize contamination risks and protect product quality. Develop and complete end-to-end contamination control strategies across FOUP/FOSB, equipment, and fab environments. Drive monitoring, automation, and data-driven solutions to improve process quality, manufacturing stability, and yield performance. Work together with process integration, equipment, AMHS, and global groups to support advanced node ramp and manufacturing readiness. Define process contamination control standards, procedures, and guidelines, benchmarking solutions with industry-leading approaches. Support process contamination-related investigations, risk assessments, and corrective/preventive actions across fabs. Ability to apply baseline digital fluency and role‑appropriate applying Artificial Intelligence to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Analyze inline/param/probe/DOE data to identify yield detractors and drive continuous improvement. Apply semiconductor device physics, process knowledge, and statistical tools to troubleshoot yield issues. Collaborate with module engineering teams to diagnose process/tool‑related yield variation and ensure timely resolution. Lead or participate in cross‑functional task forces to solve complex yield, defect, or process integration challenges. Perform root‑cause analysis using FMEA, 8D, SPC, and other structured methodologies. Publish clear Pareto analyses and maintain dashboards for assigned product lines. Support new technology transfer, process baseline setup, and qualification activities. Partner with equipment engineering, shift engineering, and quality teams to address long‑term defect or excursion issues. Conduct material, process, and equipment evaluations and recommend optimization strategies. Ensure product performance meets design and reliability requirements and propose corrective actions when gaps exist. Leverage AI-Enabled and AI-Assisted solutions, including Copilot, YMS Genie, Agentic AI, AI Agents, and Large Language Models (LLMs), to accelerate yield analysis, automate engineering workflows, summarize insights, and enhance diagnostic efficiency. Develop and maintain Tableau dashboards and visualization solutions to monitor yield performance, detect abnormal trends, and provide actionable in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly experienced Staff Engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description: Responsibilities will include, but are not limited to: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 5+ years of experience in semiconductor industry in areas such as Process Integration, Yiel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description Key Responsibilities: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 2+ years of experience in semiconductor industry in areas such as Process Integration, Yield Enhancement, Product Engineering, Design, Test Structure Development

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Analyze inline/param/probe/DOE data to identify yield detractors and drive continuous improvement. Apply semiconductor device physics, process knowledge, and statistical tools to troubleshoot yield issues. Collaborate with module engineering teams to diagnose process/tool‑related yield variation and ensure timely resolution. Lead or participate in cross‑functional task forces to solve complex yield, defect, or process integration challenges. Perform root‑cause analysis using FMEA, 8D, SPC, and other structured methodologies. Publish clear Pareto analyses and maintain dashboards for assigned product lines. Support new technology transfer, process baseline setup, and qualification activities. Partner with equipment engineering, shift engineering, and quality teams to address long‑term defect or excursion issues. Conduct material, process, and equipment evaluations and recommend optimization strategies with AI assisted tool. Ensure product performance meets design and reliability requirements and propose corrective actions when gaps exist. Required Qualifications Minimum 2 years of experience in semiconductor manufacturing, yield engineering, process engineering, or related electronics industries. Bachelor’s or Master’s degree in Physics, Optoelectronics, Electrical Engineeri

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Staff Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications Initiate and manage experiments to widen process margins as well as to eva