Semiconductor Equipment Engineer Jobs

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

NVIDIA has an outstanding opportunity for a Materials Planning Management to join our Procurement Management team in Yokneam, IL. This role offers an exceptional chance to be at the forefront of transforming our supply chain into a digitally optimized operation. You will drive cross-functional initiatives that improve execution and strengthen coordination across the materials supply chain What You Will Be Doing: Own the end-to-end supply chain and procurement readiness for the NPI phase, ensuring a smooth transition from NPI to full-scale Mass Production (MP). Ensure material readiness to support program achievements, including production ramp-up, and full-scale manufacturing. Proactively identify and resolve supply constraints, lead-time risks, and BOM gaps that could jeopardize a successful MP ramp. Lead cross-functional readiness reviews, driving alignment between Engineering, Operations, CM, and procurement stakeholders. Monitor and track Single-source parts, proactively identifying supply chain risks and escalating the need for dual/multi-manufacturer strategies to ensure supply continuity. Collaborate cross-functionally with Planning and Business Units to drive demand analysis across NPI and high-volume production portfolios Drive innovation in supply chain analytics by deploying BI and AI solutions to improve CM reporting accuracy, strengthen supply–demand alignment, and enable predictive, insight-based decision-making What We Need To See: B.Sc. in Industrial Engineering , related field or equivalent experience Minimum of 5+ overall years of experience in materials management, procurement, or supply chain management within a semiconductor OEM environment. Strong understanding of supply chain processes, NPI cycles, and material planning systems. Strong technical knowledge of semiconductor materials and contract manu

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: The Project Support Coordinator assists in the day-to-day op

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron’s MaskTech department is responsible for reticle data preparation and mask-related technologies that enable advanced semiconductor manufacturing. The team partners closely with Design, Process Integration, Mask Development, Scribe, Lithography, Tapeout Operations, Mask Shops, and Manufacturing Fabs to ensure successful tapeout execution and high-quality wafer patterning. As an Optical Proximity Correction (OPC) Engineer, you will process reticle design data through OPC to ensure designs are accurately transferred to silicon during photolithography. You will also develop and improve processes, automated verification methods, and systems that support tapeout operations while collaborating with global teams across the United States, Japan, and India to drive operational excellence and continuous improvement. Responsibilities Drive OPC job deck development, process flow execution, and recipe optimization to support production and R&D tapeouts. Collaborate with teams from multiple functions to develop new OPC flows, implement best-known methods (BKMs), and resolve manufacturing challenges. Analyze and troubleshoot OPC process issues, maintaining high-quality work to support a stable production environment. Develop automation, scripts, and process improvement

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: The Safety Administrator will support day‑to‑day project ope

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Distinguish Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Global Facilities Tool Installation team leads the planning, development, construction, and operation of Micron’s worldwide manufacturing network. This team drives major global programs that integrate engineering innovation, sustainability, and operational excellence to enable advanced semiconductor manufacturing. As a Principal Program Manager, you will play a critical role in guiding global Facilities Tool Installation (TI) programs, partnering with multi-functional and international teams, and ensuring execution aligns with best-known methods and strategic objectives. This position is ideal for a highly experienced professional with a strong facilities and greenfield construction background who thrives in complex, fast-paced environments and excels at collaboration, data-driven decision-making, and continuous improvement. Responsibilities Lead U.S. Facilities Tool Installation efforts for new fab startups and greenfield expansions, including planning and development of Tool Install User Requirement Specifications (TI-URS). Partner with Global Procurement and site teams on TI RFPs, supporting contracting strategies, bid evaluations, cost modeling, and execution timelines. Ensure global project readiness by coordinating material planning, labor strategies, construction interfaces, and risk identification/issues. Develop and maintain installation benchmarks to find opportunities for cycle-time reduction and critical path optimization. Define and implement global TI stra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Technology Development (TD) organization delivers critical manufacturing systems and software solutions that enable innovation, operational excellence, and future high-volume manufacturing capabilities. The team partners closely with engineering, manufacturing, infrastructure, and IT organizations to ensure reliable, scalable, and high-performing technology solutions that support advanced semiconductor development and production. As an IT Software Support Engineer, you will develop, maintain, and support software applications, databases, and data analysis solutions that are essential to manufacturing operations. This role requires strong solving, analytical, and technical skills, along with the ability to collaborate across global teams to resolve issues, improve system reliability, and drive continuous improvement. You will leverage modern development practices, automation, and AI-enabled technologies to enhance operational effectiveness and customer experience. Responsibilities Support, develop, and maintain manufacturing software solutions, databases, and data analysis systems to ensure high availability and operational performance. Fix and resolve critical system issues, minimize downtime, and implement sustainable software solutions that improve reliability and supportability. Design and develop utilities, monitoring solutions, metrics, and automation tools that improve support efficiency and operational visibility.</spa

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As a NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. Silicon Co-Design Group (SCG) is a wide-ranging, multi-functional, integral team at NVIDIA. We sit at the crossroads of design, architecture, marketing, operations, and productization. Our contributions span from the arch stage and extend to defining final products. We architect innovative solutions for Datacenter, Server, Gaming, Robotics, Automotive, and Embedded markets. We are fast-paced, dynamic, share a sense of humor, and collaborate extensively to push the boundaries of what is possible. We do all of this with an eye on making groundbreaking, impactful market disruptions! We are seeking an experienced Senior Manager to lead Product Co-Design and Verification in areas of Speed, Reliability and Power Compliance. You will oversee speed/timing/reliability system design, Simulation-to-Silicon power/speed verification, features for product compliance and test chip development crating future product roadmaps. The ideal candidate will have deep technical expertise in semiconductor/VLSI design and a background in translating product requirements into design and vice versa. This is a highly visible, multi-functional role to produce outstanding products that ship at SOL and meet the high NVIDIA quality we demand and customers expect. <p

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Job Purpose The Facilities Senior Manager is responsible for continuous, safe, and compliant operation of all fab facilities and critical utilities supporting semiconductor manufacturing in Operation, Maintenance, Engineering and Hook Up. This includes bulk and high-purity gas distribution systems, chemicals, Ultra‑Pure Water (UPW), wastewater treatment, HVAC and cleanroom environmental control, electrical systems, and building infrastructure in a 24×7, This role directly impacts yield, uptime, safety, and customer audit outcomes . Core Responsibilities Fab Facilities & Critical Utilities Operations/Maintenance and Engineering Lead operations of bulk & specialty gas systems, chemical distribution systems, UPW, process cooling water, wastewater treatment, Electrical System, Building Infrastructure HVAC, and cleanroom environmental systems . Ensure continuous availability of all utilities required for Manufacturing with minimal production impact. On Time Hook Up of Production tools Own facility incident response and serve as first responder for site‑wide facilities and hook up events. 2. Cleanroom & Environmental Control Maintain clean room temperature, humidity, pressure, and contamination control within fab‑defined limits. Coordinate filter maintenance, airflow verification, and critical environmental alarms to protect yield‑sensitive operation

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: We are searching for an Associate Engineer - Cleanroom to jo