Semiconductor Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: Lead PI loop structural uniformity integration and cross loop integration projects for critical loops such as Capacitance loop to address yield and quality challenges, collaborating with cross module process/PI technical experts and suppliers to improve integration structures to achieve BIC yield performance. Build Model based root cause analysis and enhance critical inline defense line for structure including uniformity. Maintain and enhance product integration programs or loop domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Node over node shift left uniformity, bevel and backside BKM implementation at early development stage to accelerate wafer overall and edge yield and quality ramping. Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Job Requirements: Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front end and backend assembly process. Good model based problem solving together with data driven decision making, and presentation skills. Proven abili

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary Micron is seeking motivated Process Technicians to support wafer manufacturing by monitoring operations, reviewing data, and working closely with engineering and production teams to enhance yield, quality, and efficiency. This role requires strong analytical and problem‑solving skills, the ability to troubleshoot issues in a fast‑paced environment, and adherence to established procedures. Ideal candidates are proficient with computers, including Microsoft Office, and capable of extracting, analyzing, and clearly presenting data insights. Success depends on effective communication, strong organization and time‑management skills, the ability to work independently, and flexibility with responsibilities and shift schedules. As part of a fabrication team driving innovation for a global leader in memory and storage solutions, Process Technicians directly support manufacturing excellence while demonstrating reliability, engagement, and a growth mindset aligned with Micron’s core values: People, Innovation, Tenacity, Collaboration, and Customer Focus. Responsibilities: Manage semiconductor tools, perform technical evaluations, and partner with cross‑functional teams to optimize wafer fabrication processes. Work with engineering teams to enhance workstations and troubleshoot complex issues. Set up and manage processing tools in an office and/or cleanroom environments to support production and engineering needs. Communicate clearly, manage time effectively

About Us Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Job Summary Working within the logical design team, the silicon logical design engineer is responsible for a wide range of logical design tasks. The team is responsible for delivering the Microarchitecture and RTL design to implement the chip architecture specification for Graphcore Silicon, working closely with other engineers within the Silicon team. The successful candidate will be responsible for helping the team deliver high quality micro-architecture and RTL for Graphcore chips, working within the logical design team and with the broader Silicon team to ensure we meet the company objectives for Silicon delivery. Responsibilities and Duties Integrate IP and subsystems into top-level SoC designs Develop and maintain build and configuration environments Perform synthesis, linting, CDC/RDC, and timing checks at the SoC level Support verification and physical design teams through clean interface hand-offs Debug and resolve integration-related issues across multiple hierarchies Contribute to the continuous improvement of integration flows and automation Producing high quality microarchitecture and other documentation Ensure good communication between sites to maintain consistent working practises Candidate Profile Essential skills: Logical design experience in relevant industry Experience range 8-12 years in Semiconductor Industry/Product development exposure. Be highly motivated, a self-starter, and a team player Ability to work across teams and debugging issues seen to find root cau

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Collaborate with CAD teams, tool vendors, and foundries to ensure PDK compatibility and performance. Develop and maintain documentation for PDK usage and best practices. Troubleshoot and resolve PDK-related problems in a timely manner. Conduct training sessions for design teams on PDK usage and updates. Custom flow evaluation for PDK health evaluation. Participate in std cell characterization activities digital flow evaluation post design environment set up. Proficiency in EDA tools and PDK management. IP procurement and integration into PDK kit. Participate in DTCO activities within interface team. Coordinate cross-functional teams and resources to achieve project goals. Drive continuous improvement initiatives to enhance PDK features and usability. Stay updated with industry trends and advancements in semiconductor technology to incorporate best practices into PDK development. Employer will accept a Master’s degree in Electrical Engineering, Computer Engineering or related field and 2 years of experience in the job offered or in a related occupation. Position requires: 1. Working with EDA tools and flows. 2. Scripting languages including Python/Perl/Shell. 3. Project management skills and experience leading cross-functional teams. 4. Parasitic extraction, physical verification, circuit simulation, and reliability verification. 5. Working on external foundry’s FinFET and gate-all-around (GAA) nodes. 6. PDK development. 7. Semiconductor manufacturing processes and des

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department NAND Probe Product Engineering Project Title AI-Enabled Test Mode Innovation and Integration Project Description The NAND Probe Product Engineering Intern will undertake a structured learning and innovation project focused on test mode development concepts, silicon validation methodologies, and AI-Enabled engineering solutions for advanced NAND technologies. Working alongside experienced Product and Design Engineers, the intern will develop knowledge of NAND test methodologies, Design for Test (DFT) concepts, and silicon validation processes. This internship combines semiconductor engineering fundamentals with Artificial Intelligence, data analytics, automation, and Generative AI technologies, providing an opportunity to explore how AI-Enabled tools and Agentic AI solutions can enhance engineering learning, technical knowledge discovery, test effectiveness, and innovation. Objective of the Project The intern will have the opportunity to: Develop an understanding of NAND architecture, probe testing concepts, Design for Test methodologies, and test mode integration practices. Explore engineering datasets to identify product behaviour

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks Perform Outgoing QA inspection based on established OSI/OBA procedures and AWS criteria Familiar with SMT & TEST processes and procedures Familiar with CTO and product label inspections processes Understand and know how to extract data for performance reports Reporting Quality defect/issue and drive closure Perform verification on closure action Ensure document integrity, uniqueness, and compliance with internal and external procedures Assisting OSI/OBA engineer in DPM/LAR metric monitoring Responsible for providing shift-level support and assist Quality Inspectors Follow safety procedures and area work rules Support engineer/manager request as when required AI proficiency or AI‑enabled ways of working where applicable, for example : Cloud Assist, Code Assist and any relevant AI assistant REQUIRED Qualifications: Diploma or equivalent. Minimum 2-5 years working experience in semiconductor lab or relevant analytical lab. Experience with Reliability, Test and FA tools/techniques Field of Study: Mechanical, E&E, Chemical, Material, Science About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, techn

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 2 years of experience M.S.EE degree with 1+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your persona

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As an AI Product Owner, Cost Transformation, you will lead enterprise-wide cost optimization initiatives across Front-End (Wafer Fab) and Back-End (Assembly & Test) operations. You will work with Manufacturing, Procurement, Engineering, Cost, and Program Management organizations to identify cost opportunities and deliver AI-driven solutions that improve productivity, spend visibility, and business performance. This role requires broad semiconductor operations knowledge, procurement expertise, and the ability to connect operational, sourcing, and financial perspectives to deliver sustainable cost improvements. Main Responsibilities Drive identification, prioritization, and implementation of AI-enabled cost optimization opportunities across Front-End and Back-End operations. Partner

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Engineering Execution Manager within Compute DRAM Product Engineering , you will lead engineering program execution for assigned DRAM products from pre-silicon readiness through qualification, production ramp, and transition to sustaining teams. This is an individual contributor leadership role, you will lead product execution across functional engineering teams through influence, technical judgment, and accountability. You will also collaborate across engineering and business organizations to build integrated plans, solve complex execution challenges, and deliver products that meet quality, yield, schedule, supply, and business requirements. Your work will have a direct impact on bringing innovative memory products to market! This technical leadership opportunity will allow you to develop broad product knowledge, strengthen your leadership skills across different functional groups, and learn across the semiconductor product lifecycle. Responsibilities Lead product execution from pre-silicon readiness through qualification and production ramp, building integrated schedules, dependencies, actions and decision points. Collaborate across Product Development, Design, Technology Development, Test, Package, Module, Quality, Manufacturing, Planning, and business teams to align technical and product achievements. Drive problem-solving for product risks and failures by facilitating issue triage, root-cause alignmen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that power Artificial Intelligence (AI), high-performance computing, graphics, and data center applications. Our team collaborates across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver next-generation memory technologies. As an HBM Design Engineer Intern, you will work alongside experienced engineers on the design, development, and validation of advanced HBM products. This internship provides hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to real-world memory design projects in a collaborative global environment. Responsibilities Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis. Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Perform timing, power, and functional analysis of HBM subsystems and support design reviews, technical investigations, and root-cause analysis using AI-enabled engineering techniques where appropriate. Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development. Document technical work

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions that enable advanced AI, high-performance computing, data center, and networking applications. Our team collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-centric SoC solutions that meet demanding power, performance, area, quality, and schedule objectives. As an HBM SoC Design Engineer/Architect, you will contribute to the design, integration, and validation of advanced HBM logic die and memory-centric SoCs. Working alongside experienced engineers, you will apply knowledge gained through academic coursework, research, internships, and engineering projects to solve real-world semiconductor design challenges. This role offers opportunities to develop expertise in digital design, ASIC development, HBM architecture, and AI-enabled engineering methodologies that improve design productivity and quality. Responsibilities Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions. Collaborate with architects and multi-functional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans. Support design-quality activities including simulation, synthesis, static timing analy

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 4 years of experience M.S.EE degree with 2+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professiona

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron's DRAM Systems & Component Architecture team to develop next-generation software platforms and AI-enabled workflows for memory-system architecture research. This role combines computer architecture, DRAM systems, software development, and artificial intelligence to accelerate architecture exploration, simulation, data analysis, and technical decision making for future memory technologies. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $35.96 - $43.15 an hour Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High Bandwidth Memory (HBM) organization develops industry-leading memory solutions that power artificial intelligence, high-performance computing, graphics, and data center applications. The team brings together experts across architecture, design, verification, physical design, product engineering, and validation to deliver advanced memory products that enable the world's most demanding computing workloads. As an HBM Design Development Technical Leadership (DDTL) Intern, you will support the planning, execution, and coordination of next-generation HBM product development programs. You will work closely with technical leaders and engineering teams to track project execution, manage risks, analyze program data, and improve engineering productivity through automation, analytics, and AI-enabled workflows. This role offers exposure to both the technical and leadership aspects of semiconductor product development. Responsibilities Support HBM product execution by tracking schedules, achievements, dependencies, technical risks, and design readiness throughout the development lifecycle. Collaborate with multi-functional engineering teams to monitor project status, coordinate deliverables, and support successful achievement completion. Develop dashboards, reports, data analytics solutions, and executive summaries to provide transparency into program health and key performance indicators. Create automation tools, workflow improvements, and AI-assisted solutions that improve engineering productivity, de

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary As the Manager, Front End Global Pln Strategic Scenario Operation, you will lead the primary scenario planning function responsible for driving enterprise-level fab scenario improvement, long-range capacity planning, and decision support across Micron’s global front-end network. You will set direction and priorities for the team, collaborate closely with the Global Planning group, Capital, Modeling, Site Planning, Sales and operations planning, financial, business unit, and R&D teams, and ensure scenario recommendations are robust, data-driven, and aligned to business plan objectives. This role requires strong leadership, critical thinking skills, semiconductor planning knowledge, and skill in translating sophisticated capacity, cost, capital, inventory, and roadmap trade-offs into clear executive recommendations. Applying Artificial Intelligence to support business transformation. Responsibilities and Tasks Lead and develop the Central Scenario team, setting clear priorities, ownership, and operating cadence for monthly SNOP Process. Drive global fab scenario optimization by evaluating options across cost, capital, ramp execution, inventory strategy, bit growth, customer service, and roadmap flexibility. Pa