Semiconductor Manufacturing Engineer Jobs

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Thin Films Equipment Engineering team at Micron develops and enhances advanced semiconductor manufacturing equipment in a fast-paced research and development environment. The team works closely with Process Engineering, Facilities Engineering, and equipment suppliers to enable next-generation memory technologies and achieve world-class equipment performance. Through innovation, collaboration, and data-driven decision-making, the team plays a critical role in advancing semiconductor technology development. As a Thin Films Equipment Engineering Intern, you will gain hands-on experience working with groundbreaking semiconductor equipment and processes. You will support engineering projects focused on equipment optimization, data analysis, and technology development while collaborating with multi-functional teams. This role provides exposure to semiconductor manufacturing, experimental design, and the application of advanced analytics to solve complex engineering challenges. Responsibilities Collect, analyze, and interpret equipment and process data to find opportunities for performance optimization and continuous improvement. Support structured engineering experiments, document findings, and communicate results through technical reports and presentations. Collaborate with Equipment Engineering, Process Engineering, Facilities Engineering, and equipment suppliers to address technology-development challenges and improve equipment performance. Develop an understanding of equipment hardware,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 擔任 Hook-up 專案技術領導者&#xff0c;整合設計、施工、品質與營運需求&#xff0c;確保機台導入及量產所需公用系統按時交付 主要職責 負責半導體廠房機台 Hook-up&#xff08;二次配&#xff09;工程規劃、執行與進度管理。 統籌機台 Move-in、Pre Hook-up、Hook-up、Turn-on 等各階段工作。 協調廠務&#xff08;FAC&#xff09;、設備&#xff08;ME&#xff09;、工務&#xff08;Construction&#xff09;、IE、EHS 及承攬商等跨部門作業。 審查 Hook-up 設計圖面、BIM 模型及施工方案&#xff0c;確保符合安全、品質及產能需求。 管理施工進度、施工品質、成本及風險議題&#xff0c;確保關鍵里程碑達成。 主導現場施工問題排除、介面整合及資源協調。 推動 QA/QC 驗證、測試驗收及系統交付作業。 建立並持續優化 Hook-up 標準流程、施工規範及教育訓練制度。 人工智慧與數位化能力 - 具備運用人工智慧工具、數據分析和數位技術提升專案規劃、工程執行、風險管理和營運效率的能力。 - 具備應用人工智慧輔助解決方案進行設計審查、專案控制、工作流程自動化、知識管理和持續改進的經驗。 - 致力於推動數位轉型&#xff0c;並促進工程和施工團隊採用創新技術。 Hook-up Senior Engineer / Technical Lead Position Summary Serve as the technical lead for Hook-up projects, integrating design, construction, quality, and operational requirements to ensure the timely delivery of utility systems required for tool installation and volume manufacturing. Key Responsibilities Lead the planning, execution, and schedule management of semiconductor fab Hook-up (secondary distribution) projects. Coordinate all phases of tool installation, including Move-in, Pre-Hook-up, Hook-up, and Turn-on activities. Collaborate closely with Facilities (FAC), Manufacturing Engineering (ME), Construction, Industrial Engineering (IE), Environmental Health & Safety (EHS), and contractors to ensure seamless project execution. Rev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron's Equipment Engineering organization is at the forefront of enabling advanced semiconductor manufacturing at scale within the newest U.S. memory fabrication facility. The CMP team collaborates closely with Manufacturing, Technology Development, Procurement, Facilities, and global engineering partners to drive equipment performance, innovation, and operational excellence. This team plays a meaningful role in delivering world-class yield, throughput, and cost performance. As the CMP Equipment Manager , you will lead and develop a high-performing team responsible for CMP equipment engineering . This role is accountable for setting the strategic vision, optimizing manufacturing performance, and aligning execution to Micron's global business objectives. You will partner internally and externally to enable best-in-class equipment capability while fostering a culture of collaboration, innovation, and continuous improvement. Responsibilities Lead and develop an elite CMP equipment engineering team, establishing clear performance targets aligned to fab output, yield, and cost objectives. Drive manufacturing optimization through equipment performance improvement, yield enhancement, throughput maximization, and cost reduction using data-driven methodologies. Partner cross-functionally (Manufacturing, TD, ATE, Procurement, Facilities) and globally to depl

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Prepare daily/regular PCS monitoring reports and review control chart abnormalities. Conduct basic initial analysis and organize abnormal findings. Send abnormal notifications and follow up with engineers on investigation results. Support basic system issue investigation during night shifts. Maintain PCS reports and related records. Assist the engineering team with routine PCS monitoring and follow-up activities. Required Qualifications Diploma or Associate Degree in Engineering, Information Technology, Computer Science, Statistics, or related discipline. Proficient in Microsoft Office applications. Good communication and interpersonal skills, including basic to intermediate English communication skills for technical documentation and routine business discussions. Strong organizational, time management, and prioritization skills. Problem-solving mindset and ability to work independently with minimal supervision. Ability to manage multiple assignments in a fast-paced manufacturing environment. Willingness to learn new systems, technologies, business processes, and AI-enabled workplace tools. Preferred Qualifications Basic knowledge of semiconductor manufacturing processes. Familiarity with data analysis and reporting tools. Good analytical and problem-solving skills. Good communication and follow-up skil

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: We are seeking a motivated and detail-oriented Procurement A

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: The Office Administrator will be required to oversee and man

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary : The Construction Project Support Administration Supervisor

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary The QA/QC Inspector (Fire) is responsible for conducting fiel

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: The Contract Manager serves as a strategic subcontractor per