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Senior Assembly Jobs

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl

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DoorDash USA
📍 San Francisco• $170K – $250K/yr
20 days ago

About the Team The DoorDash Air team is bringing drone delivery to reality. To make this happen, we’re building a strong electrical team to design high reliability, high power density converters, and fault-tolerant controls electronics. Come join us to build a new class of aircrafts and deploy at scale. DoorDash Labs, established in 2018, serves as the innovation hub for DoorDash, focusing on developing automation and robotics solutions to enhance last-mile logistics. The team's mission is to create technologies that support and augment human networks, aiming to improve efficiency for Dashers, merchants, and consumers alike. We’re ruthlessly focused on business impact. We are a highly senior team composed of former pioneers from a variety of different robotics industries. As of 2025, DoorDash has completed 10B lifetime deliveries. We’re focused on how to do the next 10B even better. About the Role We're hiring a Manufacturing Engineer to help build the process and tooling behind how our autonomous food delivery platform gets made. You'll work hands-on to bring up our first high-volume drone assembly line—applying DFA and PFMEA to new designs, building out layout and workstations, and specifying the tooling and fixtures that turn a prototype into a repeatable build. You'll spend your time on the shop floor and with suppliers and contract manufacturers, solving the real problems that come up when a line moves from prototype to production: fit and tolerance issues, process failures, tooling gaps, throughput bottlenecks. This is for someone who wants to be in the weeds of execution, who thrives in a fast-moving startup environment, and gets energy from solving hard, hands-on manufacturing problems. You'll get in at the ground floor with the chance to shape how the next generation of food delivery vehicles gets built. You’re excited about this opportunity because you will… Be our first manufacturing engineer for DoorDash Air's first mass-productio

Excelsupply chainlogistics
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We anticipate the application window for this opening will close on - 5 Oct 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72&#43; million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life Are you passionate about driving innovation and improving manufacturing processes? Medtronic is seeking a Senior Manufacturing Engineer to join our team at our Warsaw, Indiana manufacturing site. In this role, you’ll play a critical part in optimizing production, ensuring quality, and advancing our mission to improve lives. As a Senior Manufacturing Engineer, you’ll lead key initiatives to enhance manufacturing efficiency, implement Lean principles, and collaborate with cross-functional teams to solve complex challenges. You’ll also have the opportunity to work on cutting-edge technologies and processes while contributing to the production of life-saving medical devices. At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. We’re working a minimum of 5 days a week onsite as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. Responsibilities may include the following and other duties may be assigned. Responsible for the development of machining, metal finishing, and assembly methods for assigned product lines. <l

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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

artificial intelligenceaiproject management
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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in s

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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on

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Silicon Verification Engineer Multiple roles across different levels Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Bengaluru which will play a central role in Graphcore's work building the future of AI computing. The verification team sits within the Silicon design team and is responsible for ensuring that the RTL created by the logical design team and used by the physical design team matches the architecture specification for Graphcore silicon. The silicon verification engineer is responsible for verification activities within Graphcore, helping the team meet the company objectives for quality silicon delivery. Responsibilities Verification planning, specification and closure of functional coverage Providing feedback to architects Test generation and failure diagnosis/triage Contributing to shared verification infrastructure Ensuring good communication between sites Essential skills: • Verification experience in relevant industry • Proven leadership and planning skills • Highly motivated, a self starter, and a team player • Ability to work across teams and programming languages to find root causes of deep and complex issues • Experience of the verification process applied in CPU and/or ASIC environments • System Verilog, Python, C++, Linux Desirable skills: • UVM • SVA • Assembly languages • LLVM, GCC • DVCS e.g. Git • SGE or other DRMS • XML and XPath/XSLT • Web programming – HTML/DOM, Javascript, SQL Benefits: In addition to a competitive salary, Graphcore offers a competitive benefit

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1mo ago

ABOUT US At Shinola, we make beautiful, enduring, handcrafted goods that are built to be lived in, worn out, and well-loved. Our thoughtful craftsmanship, timeless design, and spirited stories inspire our customers to live well, with confidence & joy—in a style that is uniquely their own! Because we are a growing and evolving company, each employee is a key stakeholder, making decisions every day that directly impact our overall vision and direction. At Shinola, you’ll have the opportunity to make a significant contribution at the start of what we believe will become an iconic American brand. ABOUT THE ROLE As our Senior Videographer, you will lead the development of Shinola’s video tone. You will play a key role in capturing, editing, and producing high-quality video content that aligns with Shinola’s vision and core messaging. You will be responsible for both the technical and creative aspects of production — shooting high-quality footage, editing videos, and ensuring that all content aligns with the brands aesthetic and goals. KEY RESPONSIBILITIES Pre-Production Collaborating with Art Director, creative and marketing teams on concepts for campaign, product, social, and brand videos. Refining story boards and scripts with creative team/Art Director. Creating shot lists and schedules in collaboration with creative project manager. Scouting locations, talent, weather and lighting pre shoot. Cinematography Executing video assets for campaigns, ecommerce, and social media. Camera operations Set lighting and grip Utilizing audio equipment for voice overs when applicable Leading freelance staff on set Collaborating with freelance agencies on larger brand videos Post-Production - Video Editing Execution and delivery of final video assets: offloading footage, color correction, sound, first assembly, rough cut, final cut, delivery and archiving final assets. Adhering to a script and timeline Conception of scripts and timelines when applicable Organizing as

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking a Senior Reliability Supplier Industrialization Engineer focused on avionics, printed circuit board assemblies, and harnessing to qualify, develop, and scale suppliers that produce reliable electrical hardware to engineering, manufacturing, and system requirements. You will translate avionics design intent into capable assembly processes, supplier controls, inspection methods, and production-readiness evidence. This role spans Electrical Engineering, Avionics, Supply Chain, Quality, Manufacturing, Test, and suppliers from early design reviews through prototype, qualification, production, and field support. The work is hands-on and requires regular engagement with electronics assembly, harness fabrication, inspection data, functional test, and supplier process development. Key Responsibilities Lead supplier industrialization for avionics assemblies, PCBAs, cable harnesses, and related electrical hardware from design release through production readiness. Support avionics design reviews by identifying assembly, testability, component, soldering, routing, and harness-integration risks. Develop commodity FMEAs, supplier qualification requirements, control plans, inspection methods, and acceptance criteria for critical elect

Excelsupply chain
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Instawork is on a mission to create meaningful economic opportunities for skilled hourly professionals in communities around the globe. Our AI-powered labor marketplace helps local businesses scale, and enables global technology companies to push the frontiers of robotics and AI. Backed by world-class investors like Benchmark, Spark Capital, Craft Ventures, Greylock, Y Combinator, and others, we’re looking for exceptional talent to reimagine the way the world works. Senior Mechanical Engineer — Robotics Hardware Location - Bangalore Instawork Robotics Labs is building Instacore, our proprietary five-camera and IMU wearable capture rig. Hundreds of units operate across India every day, collecting real-world data used to train frontier Physical AI models. We are looking for a senior, mechanically focused engineer to own the complete hardware lifecycle for Instacore and future hardware products. This person will independently lead design, prototyping, manufacturing, testing, deployment, logistics, maintenance, and continuous improvement. What you’ll do - Own the mechanical design and development of Instacore and other robotics hardware from initial requirements through production and field deployment. - Create detailed CAD models, assemblies, engineering drawings, bills of materials, and manufacturing documentation. - Rapidly prototype and validate designs using 3D printing, machining, fabrication, and off-the-shelf components. - Design durable mounts, enclosures, fixtures, wearable components, packaging, and protective systems. - Own design for manufacturability, assembly, serviceability, reliability, and cost. - Improve cable routing, connector retention, strain relief, thermal management, ingress protection, and resistance to vibration and impact. - Design packaging and logistics processes that prevent damage during storage and transit. - Establish verification, stress-testing, quality-control, and acceptance-testing procedures. - Investigate field failures, d

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2mo ago

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit

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Micron
📍 Taichung• Full-time
2mo ago

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Assembly and Test (AT) IP Security Engineer, you will be part of the AT BISO (Business Information Security Officer) Organization. You will partner with Micron’s Enterprise Infrastructure and Security (EIS) and your business area (Assembly and Test) to implement security controls, reduce risk, and maintain business continuity. You will work within Assembly and Test organizations (and sites) to identify risks, help classify data and establish processes which are aligned to Micron’s security disciplines. You will serve as an ambassador for Assembly and Test Organization to protect Micron’s most sensitive data (Intellectual Property). You will institutionalize a security-first culture across AT operations and ensure compliance with micron’s security standards, whilst ensuring AT Business continuity Key Responsibilities Act as a Liaison with EIS team and AT business are to support roadmaps, strategies, and requirements to improve Micron’s security policies. Bridge security goals and commitments with articulated business needs driving towards a common set of goals and objectives Participate in defining clear goals and strategic initiatives to improve our security posture in line with Micron’s 7 Security Disciplines. Secure Data Handling: Help secure micron’s most Sensitive Data (Sensitive Data Protection Program), through Data Classification and Inventorization. Help define and implement Entitlement Policy Management System (EPMS) fo

artificial intelligenceaiPMP
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Micron
📍 Malaysia• Full-time
2mo ago

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Assembly and Test (AT) IP Security Engineer, you will be part of the AT BISO (Business Information Security Officer) Organization. You will partner with Micron’s Enterprise Infrastructure and Security (EIS) and your business area (Assembly and Test) to implement security controls, reduce risk, and maintain business continuity. You will work within Assembly and Test organizations (and sites) to identify risks, help classify data and establish processes which are aligned to Micron’s security disciplines. You will serve as an ambassador for Assembly and Test Organization to protect Micron’s most sensitive data (Intellectual Property). You will institutionalize a security-first culture across AT operations and ensure compliance with micron’s security standards, whilst ensuring AT Business continuity Key Responsibilities Act as a Liaison with EIS team and AT business are to support roadmaps, strategies, and requirements to improve Micron’s security policies. Bridge security goals and commitments with articulated business needs driving towards a common set of goals and objectives Participate in defining clear goals and strategic initiatives to improve our security posture in line with Micron’s 7 Security Disciplines. Secure Data Handling: Help secure micron’s most Sensitive Data (Sensitive Data Protection Program), through Data Classification and Inventorization. Help define and implement Entitlement Policy Management

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About the job Build the board test solutions that help complex hardware move reliably from new product introduction into volume manufacturing. You’ll develop and maintain Flying Probe and ICT test programs for Graphcore circuit card assemblies. You’ll deploy these solutions with our manufacturing partners in Taiwan. Your work will improve test coverage, yield, stability and production efficiency. You’ll analyse test data and resolve PCB and test issues across manufacturing. You’ll work closely with Product Test and Diagnosis and Manufacturing Operations. You’ll own problems through to resolution and help strengthen testability from product design onwards. The team and culture The Product Test and Diagnosis team finds and manages hardware defects across chips, boards and finished systems. Its work spans manufacturing sites and products in the field. You’ll work closely with design teams and external manufacturing partners. Expect hands-on problem solving, direct communication and clear ownership of test solutions. You’ll make evidence-led decisions using test results, manufacturing data and technical investigation. When problems appear, you’ll be expected to investigate, speak up and drive practical improvements. What we’re looking for Essential Proven experience in PCBA and system product validation within production manufacturing test environments. Strong experience in advanced electronic system testing, including Teradyne, Keysight, and TRI test platforms; SPEA experience highly preferred. Thorough understanding of SMT/PCB manufacturing processes and failure mechanisms, with knowledge of AOI and AXI inspection capabilities. Hands-on experience with ISP/OBP CCA configuration and local/remote use of test equipment, including oscilloscopes, DMMs, clock generators, SMUs, and PSUs. Proven ability to collaborate with external Circuit Card Assembly (CCA) test and manufacturing partners to support product validation and testing. Desirable Thorough understanding of t

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