Senior Process Water Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Scope This is a unique opportunity to lead and develop advanced water treatment systems at Micron. As a Senior Process Water Engineer, you will drive the smooth implementation of projects related to RODI, WWTP, water reclaim, and scrubber systems. You will establish project scope and supervise construction to ensure exceptional quality and safety standards are preserved. Responsibilities: Lead and coordinate projects to ensure timely, safe, and quality execution at site. Monitor project scope, schedule, cost, quality, and safety performance, advancing risks with proposed mitigation actions. Conduct regular site inspections, progress reviews, system walkdowns, line checks, testing, and coordination meetings. Provide technical input during concept design, detailed design, tender, construction, testing, commissioning, and handover phases. Coordinate system shutdowns, tie-ins, modifications, expansions, and commissioning activities while minimizing operational impact. Ensure project documentation, including as-built drawings, testing records, operation manuals, training records, and handover documents, is completed before project close-out. Track non-conformances, punch lists, defects and corrective actions through closure. Review high-risk construction activities, work methods, job hazard analyses and mitigation plans before execution. Support internal, corporate, customer, and RBA-related audits and evidence of compliance. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Staff Global Facilities Engineer - Mechanical at Micron, you will have the opportunity to work on innovative projects that form the future of semiconductor technology. You will be in charge of providing excellent engineering services and support for the planning, development, construction, operation, and maintenance of critical facilities systems. This role highlights Global Standardization and Alignment, Innovation, Reliability and Performance, and Sustainability. Your duties encompass Semiconductor Mechanical and Process Systems like Cleanroom HVAC, Chilled Water, Heating Water, Makeup Air, Recirculation Air, Process Cooling Water, Process Exhaust, Compressed Air, Process Vacuum, General HVAC, Building, and Fire Protection systems, among others. Responsibilities: Serve as the technical domain expert, providing guidance and support to global, regional, and site facilities and manufacturing teams. Collaborate with internal teams (Technology Development, Procurement, Finance, Legal) to implement engineering solutions and drive innovation. Analyze system designs to improve performance, efficiency, and cost-effectiveness, and support problem-solving using standard methodologies. Benchmark engineering practices across Micron and the industry to maintain and evolve best-known methods (BKMs). Lead and support large-scale infrastructure design and construction projects, ensuring alignment with standards, codes, and regula

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Job Purpose The Facilities Senior Manager is responsible for continuous, safe, and compliant operation of all fab facilities and critical utilities supporting semiconductor manufacturing in Operation, Maintenance, Engineering and Hook Up. This includes bulk and high-purity gas distribution systems, chemicals, Ultra‑Pure Water (UPW), wastewater treatment, HVAC and cleanroom environmental control, electrical systems, and building infrastructure in a 24×7, This role directly impacts yield, uptime, safety, and customer audit outcomes . Core Responsibilities Fab Facilities & Critical Utilities Operations/Maintenance and Engineering Lead operations of bulk & specialty gas systems, chemical distribution systems, UPW, process cooling water, wastewater treatment, Electrical System, Building Infrastructure HVAC, and cleanroom environmental systems . Ensure continuous availability of all utilities required for Manufacturing with minimal production impact. On Time Hook Up of Production tools Own facility incident response and serve as first responder for site‑wide facilities and hook up events. 2. Cleanroom & Environmental Control Maintain clean room temperature, humidity, pressure, and contamination control within fab‑defined limits. Coordinate filter maintenance, airflow verification, and critical environmental alarms to protect yield‑sensitive operation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Systems Ownership Scope As the designated System Owner, the engineer holds end-to-end technical accountability for the following mechanical utility systems across their full lifecycle — build, construction, commissioning, and operation: Chilled Water – Medium-Temperature (MTCHW): centrifugal / screw chillers, primary-secondary or variable-primary pumping, cooling towers, and distribution to HVAC and process loads. Chilled Water – Low-Temperature (LTCHW): low-temperature chiller plant serving process and dehumidification loads with tighter temperature control. Process Cooling Water (PCW): closed-loop tool-cooling system — vertical/inline pumps, plate heat exchangers, filtration, chemical dosing, and detailed temperature/flow regulation according to tool specifications. Ethylene Glycol (EG) / Low-Temperature Loop: sub-zero glycol refrigeration package(s), pumps, filtration, and distribution for process temperature control. Associated cooling towers, water-treatment / chemical-dosing systems, expansion tanks, instrumentation, and BMS integration. Shows readiness and capability to incorporate AI-powered tools into everyday engineering tasks. These include predictive maintenance, energy management, and data-driven optimization of mechanical utility systems. This supports Micron's AI transformation and smart manufacturing objectives. Construction Phase — Build, Delivery & Commissioning Review the basis for the buil

About the Team DoorDash Labs, established in 2018, serves as the innovation hub for DoorDash, focusing on developing automation and robotics solutions to enhance last-mile logistics. The team's mission is to create technologies that support and augment human networks, aiming to improve efficiency for Dashers, merchants, and consumers alike. We’re ruthlessly focused on business impact. We are a highly senior team composed of former pioneers from a variety of different robotics industries. As of 2025, DoorDash has completed 10B lifetime deliveries. We’re focused on how to do the next 10B even better. About the Role We are seeking a highly motivated Senior/Staff Test Engineer to join our team. This individual will play a key role in the development and validation of our unmanned platforms at the system and component levels. The ideal candidate has a strong background in test development, test execution, and root cause analysis with a proven track record of collaboratively managing risk throughout a fast paced development process. You’re excited about this opportunity because you will… Run and monitor tests within our facility as well as at outside test labs. Collaborate with a tight knit team to identify and understand test failures. Be hands-on in developing test methods and equipment to uncover failures before they happen in the field. Find clarity through root cause analysis of lab and field failures and suggest design changes to prevent them. Use your creativity to create novel and scaled tests for autonomous systems. We’re excited about you because you have… A bachelors or advanced degree in a relevant engineering discipline. Mastery of test equipment such as environmental chambers, vibration tables, water testers, DAQs, etc.. Ability to bring order to complex test and development programs via clear technical communication and documentation. Experience designing and building testers and equipment. Ability to write Python scripts to automate

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team drives leading-edge process capability, best-in-class yield (bits per wafer), high product quality, and rapid time to maturity through innovation and strong cross-functional collaboration. Supporting a global DRAM and NAND technology portfolio across development and manufacturing sites in the U.S., Japan, Taiwan, and Singapore, the team ensures consistent execution of manufacturing excellence worldwide! As a Frontend Central Process Integration Senior Engineer, you will identify, align, and deploy best-known methods across the global network and develop optimized processes to achieve product maturity and sustainable performance improvement. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline transparency to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. </li

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary The SMTS acts as a technical authority in 3D NAND cell film development, setting strategic direction and leading multi-functional initiatives to drive department-wide impact by architecting solutions, accelerating innovation adoption, influencing technical standards, and mentoring engineers to elevate technical excellence. Defines technical strategy and drives cross-org adoption; leads complex problem solving across process/hardware/device interactions with no yield trade-off; builds the SME pipeline through structured mentorship. Main Responsibilities Define technical strategy; architect solutions; influence technical standards and drive process improvements; lead advanced process development, fixing, and integration. Integrate unit processes into full cell packages and validate device/process linkages via wafer-level electricals. <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The SMTS acts as a technical authority in NAND Advanced Thin Films, setting strategic direction, architecting solutions, and leading multi-functional initiatives with department-wide impact. The role drives innovation adoption, influences technical standards, leads advanced development/fixing/integration, and develops engineering capability through mentorship and knowledge building. Main Responsibilities Define technical strategy and lead multi-functional projects in structural and electrical film development. Architect solutions and promote innovative technologies across teams; influence standards and drive process improvements. Lead advanced process development, fixing, and integration; validate within and cross-module interactions and device/process linkages via wafer-level electricals

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Frontend Central Product Integration Engineering team strives to deliver leading edge process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with cross functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6, ID1), Taiwan (OMT), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central Process Integration Senior Engineer, you will be responsible to develop best optimum process to achieve product maturity. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline visibility to e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team delivers best‑in‑class yield, quality, and cycle time through innovation and strong cross‑functional teamwork. Supporting diverse DRAM and NAND technologies across global development and manufacturing sites (Boise, Japan, and fabs in the U.S., Taiwan, Japan, and Singapore), the team identifies, aligns, and deploys best‑known methods across the network. As a Frontend Central Process Integration Senior Engineer, you will develop and optimize processes to drive rapid product maturity. Join us today and make a difference! Responsibilities and Tasks Drive rapid product maturity, improving yield (bits per wafer), repair density, and DPM through fast learning cycles. Apply deep process integration knowledge across FEOL, MOL, CELL, and BEOL to identify optimal solutions; design and circuit knowledge is a plus. Partner with Yield Engineering, Device, RDA, and Metrology teams to resolve key yield issues and build strong inline visibility for fast ramp and excursion prevention. Identify and standardize best‑known methods and business processes across DRAM and NAND sites. Travel to Micron sites as needed for onsite collaboration. Minimum Qualifications Bachelor’s degree in Engineering or a related field 5&#43; years of experience in process integration, product design, or equivalent technical roles Demonstrated ability to collaborate optimally with global, cross‑functional teams Proven t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Staff Engineer in Frontend (FE) Central Quality Engineering – Global Deviation Management (Event Deviation) at Micron Technology, Inc., you will play a critical role in driving quality excellence across Micron’s global Frontend manufacturing network. Our mission in the FE Central Process QE organization is to elevate Micron’s quality standards through strategic collaboration with Frontend sites, Global Quality teams, and Central partners. In this role, you will lead initiatives to identify, manage, and reduce deviations across all Micron Frontend fabs. You will partner with Corporate QMS, QRA, Manufacturing, and other cross-functional teams to foster a Best-in-Class Quality Culture, ensuring alignment between quality, wafer output, and cost objectives. Key Responsibilities Lead global quality initiatives to design, implement, and sustain robust deviation management processes and systems. Drive the Effective Problem Solving (EPS) SWAT team, deploying Best-Known Methods (BKMs) and standardizing practices across manufacturing sites. Analyze and resolve major Quality deviations (e.g., Excursion & Late event) by providing data-driven recommendations to improve fab performance. Champion quality improvement projects, addressing non-conformances and implementing corrective and preventive actions. Continuously enhance quality metrics such as $CoNC and %NCD through innovative solutions and system improvements. Form and lead cross-functional task

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a NAND Reliability Product Engineer, you will be responsible for defining, evaluating, and safeguarding the Extrinsic/Intrinsic reliability of Micron’s NAND Flash products. You will work hands‑on with large‑scale data analysis, electrical failure analysis, and cross‑functional teams to ensure robust product reliability and prevent escapes to customers. This role offers deep technical ownership at the intersection of device physics, circuits, process technology, and product engineering, with strong visibility across development and manufacturing organizations. Key Responsibilities Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes. Perform high‑volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends. Drive electrical failure analysis, including advance characterization, to identify root causes and solution spaces. Develop short‑term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering. Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability. Collaborat