Senior Process Water Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Wet Process Equipment Engineering organization supports advanced semiconductor manufacturing by ensuring critical equipment delivers the reliability, capability, and performance needed for leading-edge memory technologies. We work closely across Manufacturing, Process Engineering, Technology Development, Facilities, Industrial Engineering, Quality, Procurement, suppliers, and global engineering teams to improve factory performance and enable future technology transitions. As Sr. Manager, Wet Process Equipment Engineering, you will lead an engineering organization responsible for wet process equipment strategy, reliability, and manufacturing performance. You will develop engineering leaders and technical talent while driving improvements in equipment availability, output, yield, quality, cost, and technology readiness across a high-volume manufacturing environment. Responsibilities: Lead and develop engineering leaders, equipment engineers, and technical experts through coaching, succession planning, and clear organizational priorities Own equipment engineering strategy for wet clean, wet etch, batch and single-wafer processing, surface preparation, chemical management systems, and supporting infrastructure Improve equipment reliability, availability, throughput, defectivity, contamination control, process stability, cost of ownership, and preventive and predictive maintenance performance Partner across Manufacturing, Process Engineering, Process Integration, Technology Development, Facilities, In

About the job Own the manufacturing performance behind advanced AI compute systems in volume production. As, Senior Manufacturing Product Engineer you will connect product design, test, quality and supply chain with manufacturing execution. You will support volume production across PCB assembly with our build partners in Taiwan. Your work will improve yield, quality and manufacturability across complex products. You will link manufacturing process performance to the product metrics that matter most. You will manage partner engineering relationships, resolve manufacturing issues and drive continuous improvement. You will also shape DfM feedback, production data requirements and next generation manufacturing technologies. This role suits someone who combines practical manufacturing judgement with strong data thinking. You will work close to suppliers, product teams and the decisions that shape production outcomes. The team and culture You will join the Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan, close to wafer foundry, package assembly and PCBA subcontractors. Work happens through direct ownership at partner sites and clear technical engagement with internal teams. You will move quickly on production issues, using data and engineering judgement to guide action. The team values people who speak up, take responsibility and build strong supplier relationships. Decisions are grounded in evidence, product impact and the need to keep manufacturing improving. What we're looking for · Strong fault diagnosis, problem solving and failure analysis skills, including ICT to SMT debug · Thorough understanding of automated SMT assembly processes and lean manufacturing methodologies · Working knowledge of L10 mechanical design and system build, ideally for HPC products · Experienced in statistical analysis tools (e.g JMP, SQL, Python) · Ability to connect silicon, package and PCB interactions into clear DfM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Realtime Defect Analysis (RDA) and Metrology team plays a critical role in enabling world-class semiconductor manufacturing through advanced defect detection, process monitoring, and quality systems. We partner closely with manufacturing, process integration, process development, yield engineering, data science, and global high-volume manufacturing (HVM) sites to ensure process stability, defect visibility, and continuous improvement. Our team is passionate about innovation, collaboration, and delivering data-driven solutions that help prevent excursions and improve factory performance. As an ID1 RAM Quality Engineer, you will help define and maintain quality standards, monitoring systems, and best-known methods that support defect detection and metrology operations. You will analyze quality performance metrics, drive excursion mitigation, improve sampling strategies, and collaborate across global teams to identify and resolve process anomalies. This is an exciting opportunity to make a global impact through technical leadership, data analysis, and continuous improvement initiatives. Responsibilities: Develop and maintain quality control systems, sampling strategies, SPC compliance, and Wafer at Risk (WaR) processes for RDA and Metrology Analyze defect and process data to identify anomalies, drive excursion mitigation, and improve defect detection effectiveness Conduct audits, FMEA activities, and quality assessments while recommending and implementing process improvements

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in s

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The OCT CPEE SEAL Engineer/Senior Engineer will lead Manufacturing Excellence initiatives through standardization, SEAL deployment, Wafer Per Day (WPD) improvements, and Intelligent Solutions across global manufacturing sites. This role will drive sustainable productivity improvements through process optimization, best-known method (BKM) deployment, data-driven execution, and AI-enabled transformation. The candidate will serve as a technical leader in identifying opportunities, accelerating pilot adoption, and scaling innovative solutions across technologies and sites while leveraging Artificial Intelligence (AI), automation, and advanced analytics to improve engineering effectiveness and manufacturing performance. Key Responsibilities Manufacturing Excellence & SEAL Lead development and deployment of global SEAL initiatives to standardize manufacturing BKMs and improve operational excellence. Drive Wafer Per Day (WPD), utilization, manufacturing availability (MA), and productivity improvements through process and equipment optimization. Partner with site and global stakeholders to identify performance gaps and execute improvement roadmaps. Facilitate alignment across technology nodes and fabs to ensure successful adoption of pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Mask Development department in Micron’s Technology Development organization delivers reticle solutions that help shape next-gen memory and storage products in the evolving global technology landscape. This team works at the intersection of advanced equipment, materials science, and precision manufacturing. If you enjoy solving complex problems, collaborating with other subject-matter experts and department leaders, and seeing your direct impacts on product quality, you’ll feel at home here! Position Overview: Micron is seeking a highly experienced Resolution Enhancement Techniques (RET) Engineer to join the AMD team at Micron. At the Senior Member of Technical Staff level, our ideal candidate is a master in their field and has a history of innovation and driving technical direction in the industry. This role will focus on developing and optimizing RET and Optical Proximity Correction (OPC) solutions that enable high-fidelity wafer patterning for advanced memory technologies. This role will partner with a variety of teams to develop innovative reticle solutions, improve tapeout methodologies, and resolve complex patterning challenges across both R&D and HVM environments. We are looking for an ambitious and goals-centric individual to help drive groundbreaking solutions that maintain Micron’s competitive advantage. Responsibilities: Drive a steady stream of sophisticated projects with built-in contingency plans related to mask development, lithography optimization, and tapeout flow

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Career Growth & Impact Direct ownership of probe strategy and quality outcomes across the product lifecycle. Exposure to advanced technology nodes, customer‑driven requirements, and large‑scale manufacturing systems. Clear growth paths across senior technical contributor, product leadership, or people management tracks within STPG Product Engineering. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The high-volume manufacturing engineering team plays a key role in keeping Micron’s wafer fabs running safely, efficiently, and at scale. We work at the center of manufacturing execution, balancing capacity, risk, and performance to support both development and high-volume production goals. If you enjoy solving complex operational challenges in a fast-paced environment, this is the place to make an impact! As a senior engineer, you will focus on strengthening physical and chemical vapor deposition (PVD and CVD) area manufacturing performance by reducing operational risk and building stable, predictable capacity. Working closely with Manufacturing, Process Development, Industrial Engineering, and Operations, you will lead improving cycle time, throughput, and redundancy while supporting ambitious program timelines. This focus directly influences fab performance and development success. Responsibilities: Identify and resolve systemic physical and chemical vapor deposition (CVD and PVD) area issues affecting throughput, cycle time, and operational risk and model capacity planning Drive area performance using clear metrics, risk assessments, and data-informed capital decisions Effectively partner with Industrial Engineering, Process Development, Manufacturing, and Operations cross-functional teams to evaluate and influence capacity scenarios and mitigation plans Analyze operational data to communicate trends, risks, and improvement opportunities Through stron

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Operations Management Handle technology development and engineering builds in partnership with internal and external teams such as process, equipment, metro RDA, site planning and manufacturing. Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders. Align plans, dependencies, and deliverables to ensure timely, cohesive execution to meet program requirements. Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools. Drive for the resource readiness and ensure timely availability of required resources to support TD projects. Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays. Supervise daily execution, including wafer offloading, kitting, and support of TD builds. Support the logistics tasks as needed according to project requirements (Materials sending/receiving, submit the sample for failure analysis etc. Coordinate engineering builds and APTD operations in compliance with established standards and pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing reliability performance of hot carrier, bias temperature instability, electromigration etc. for each cell transistor, high performance CMOS and advanced interconnect. Also, you will be responsible for reliability model building and the consultation from device development team and circuit design team. The reliability is one of the important pillar for device scaling and state of the art technology development. Its work is based on understanding the semiconductor device physics, DRAM architecture knowledge, DRAM process integration knowledge. For the new reliability findings during the technology development phase, to point in the right direction is required. Responsibilities and Tasks: Develop and implement test methodologies to evaluate wafer-level & circuit-level reliability behavior and performance. Analyze results and create reports to deliver decision-ready, actionable recommendations for guiding technology development. Collaborate with Process Integration and characterization teams to correlate reliability signature with process conversions and parametric test data. Integrate other data sources (inline metro, param,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. We have an opening for Yield Analysis Engineer for NAND Technology Department in Singapore. We are looking for candidate that is passionate to innovate in data analytics, and curious to ask &#34;what, how and why&#34;? In this role you will be responsible for providing key feedback and direction on yield improvement activity for NAND memory technology! This role requires a high degree of collaboration across virtually all company functions, up to and including the Executive level. As Yield Analysis Engineer , you will be responsible for developing innovative NAND product technologies, define, and execute various effective actions to enable solutions to improve yield, quality, reliability, and hit key milestones & achieve the required performance within committed timelines. Your responsibilities will include, but are not limited to, the following: Discover yield issues in NAND development and identify unique metric or combination of metrics, such as wafer/dice/tile shading, ECATS or other custom metric for issues quantification Interact with process area, process integration, yield, failure analysis, product engineering, design, and layout teams to drive clear definition of yield, cell, CMOS,