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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bondin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Boise, Idaho has a current need for a Senior or Staff R&D Photolithography Materials Engineer . Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an R&D Photolithography Materials Engineer at Micron Technology Inc., we are responsible for photolithography material selection and optimization for advanced memory devices. In this position, you will develop new technology and photo materials that meet device requirements and integrate new technology into manufacturing processes. This work could include photo materials for any photo processes including hardmasks and resists for I-line (365nm) through EUV (13.5nm). Additionally, you will address process and materials issues with pilot manufacturing and work on continuous improvements for manufacturability. Job Responsibilities: Lead long-term resist screening projects. Define success criteria with process owners, evaluate multiple rounds of design of experiments (DOEs) with suppliers, and identify top materials for detailed evaluation on devices in technology development. Broad knowledge and experience in photoresist chemistry with an ability to direct material optimization and development with our suppliers Work in a cleanroom, follow safety proc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Design Engineering organization is dedicated to creating world‑class memory and storage solutions through sophisticated digital and analog circuit innovation. Our teams span the globe and collaborate across technology development, product design, systems architecture, and validation to deliver industry‑leading semiconductor products. The Principal Design Engineer plays a key role in developing, analyzing, and optimizing circuit designs that power Micron’s next‑generation memory technologies. This role partners closely with diverse teams—including Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing—to ensure best‑in‑class performance, quality, cost efficiency, and time‑to‑market. Responsibilities: Design and optimize memory circuits from gate‑level to full chip implementations. Lead development of schematic blocks such as memory arrays, control logic, address decode, datapath, and internal test logic. Perform advanced circuit simulations using industry tools (e.g., SPICE, VERILOG) to validate performance. Drive architectural decisions related to power, speed, die area, and overall circuit performance. Collaborate with technology development and business units to define design rules, device requirements, and validation strategies. Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related technical field (or equivalent practical experience). Experience in se

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we design the memory that moves the world — from advanced DRAM to complete silicon-to-systems solutions! Our design teams work at the leading edge of memory technology, and we collaborate across the globe to turn ambitious ideas into world-class products. If you want your work to show up in the devices billions of people rely on, this is the place to do it. As a Staff Design Engineer on our DRAM team, you'll shape the circuits at the heart of our next memory generations. You'll own design decisions that directly affect cost, quality, reliability, and time-to-market, and you'll partner with talented engineers across design, verification, product, and manufacturing. This is a role for someone who enjoys working close to silicon and wants real ownership over the products they help create. Responsibilities: Design, lay out, and optimize Memory, Logic, and Analog circuits for new memory products Handle parasitic modeling and support design validation, reticle experiments, and tape-out revisions Oversee the layout process, including floor-planning, placement, and routing Run verification through modeling and simulation using industry-standard simulators Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to ensure manufacturability, and use Generative AI tools to speed up design, analysis, and documentation while owning correctness and signoff Minimum Qualifications: Bachelor's degree in Electrical

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for understanding the processes used to assess and mitigate risks related to the introduction of new package technologies so that you can improve efficiency and effectiveness by implementing automation, data analysis and machine learning/AI solutions. Set up data bases, develop data ingestion pipelines, and implement automated data analysis and reporting tools. Support problem solving and risk assessment for internal or customer quality issue by pulling and analyzing data. Contribute to the advancement of technology at Micron through mentoring, publishing technical papers (internal and external), and developing innovative solutions to challenging problems. Implement Automation, Data Analysis, and AI Solutions. Collaborate with Engineering teams to Map Package DDQA processes and data streams. Set up and optimize databases and develop solutions to improve efficiency and effectiveness. Understand the needs of internal customers and develop solutions. Support Problem Solving and Risk Assessment for Quality Issues. Pull relevant product information, manufacturing data, and reliability data based on given problem statements. Determine the appropriate dataset and treatment required to answer questions posed by problem solving teams. This could include producing data visualizations, machine learning models, statistical inferences, and web applications. Provide recommendations about root cause findings and product risk, based on data analysis. Collaboratively Communicate Findings and Best Practices. Share best practices with global teams to enable a cultur

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly motivated and experienced Technical Staff Member to join our Quality Engineering team in Boise, ID. Your role will be crucial in ensuring the reliability and quality of wafers shipped from our Boise manufacturing site! Summary The Product Quality and Reliability team ensures Micron delivers high-quality, reliable semiconductor solutions that meet customer expectations and business objectives. The team partners across product engineering, design, technology development, manufacturing, and reliability organizations to identify risks, solve complex technical challenges, and drive continuous improvements in product performance, yield, and customer satisfaction! Position Overview As a Senior Product Quality and Reliability Engineer, you will be a technical leader. You will drive product excellence in quality, dependability, and yield across advanced semiconductor technologies. You will lead complex technical investigations, influence product and technology decisions, and develop innovative approaches that strengthen quality systems and business outcomes. This role provides an opportunity to have broad interpersonal impact through technical leadership, multi-functional teamwork, and strategic problem-solving. Responsibilities Lead complex investigations involving yield excursions, product deviations, and quality issues, driving root cause identification, containment actions, and sustainable corrective solutions Define product quality and reliability moni